Abstract: A semiconductor structure includes an alternating stack of insulating layers and electrically conductive layers that is located on a front side of at least one semiconductor material layer; memory openings vertically extending through the alternating stack; memory opening fill structures; a dielectric material portion contacting sidewalls of the insulating layers of the alternating stack. In one embodiment, a connection via structure can vertically extend through the dielectric material portion, and a metal plate can contact the connection via structure. Alternately or additionally, an integrated via and pad structure may be provided, which includes a conductive via portion vertically extending through the dielectric material portion and a conductive pad portion located on an end of the conductive via portion.

Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers located over a substrate, memory stack structures vertically extending through the alternating stack, a perforated dielectric moat structure vertically extending through the alternating stack, and an interconnection via structure laterally surrounded by the perforated dielectric moat structure and vertically extending through each insulating layer within the alternating stack. Each of the memory stack structures includes a vertical semiconductor channel and a vertical stack of memory elements located at levels of the electrically conductive layers. The perforated dielectric moat structure includes a plurality of lateral openings at each level of the insulating layers, and does not include any opening at levels of the electrically conductive layers.

Abstract: A protection film is formed on a semiconductor substrate. Impurity ions are implanted into the semiconductor substrate through the protection film. The impurity is activated to form an impurity layer. The protection film is removed after forming the impurity layer. The semiconductor substrate of a surface portion of the impurity layer is removed after removing the protection film. A semiconductor layer is epitaxially grown above the semiconductor substrate after removing the semiconductor substrate of the surface portion of the impurity layer.

Abstract: A method of manufacturing a semiconductor device including a stacked gate type nonvolatile memory cell and a p-channel type first transistor, includes: forming a gate insulating film of the first transistor on a semiconductor substrate; forming a tunnel insulating film of the stacked gate type nonvolatile memory cell on the semiconductor substrate; forming a first conductive layer containing an n-type impurity on the tunnel insulating film and the gate insulating film; and implanting p-type impurity ions to a region of the first conductive layer for forming the first transistor to turn the region of the first conductive layer into a p-type region.

Abstract: According to an aspect of an embodiment, a semiconductor device has a semiconductor substrate, a gate insulating film on the semiconductor substrate, a gate electrode formed on the gate insulating film, an impurity diffusion region formed in an area of the semiconductor substrate adjacent to the gate electrode to a first depth to the semiconductor substrate, the impurity diffusion region containing impurity, an inert substance containing region formed in the area of the semiconductor substrate to a second depth deeper than the first depth, the inert substance containing region containing an inert substance, and a diffusion suppressing region formed in the area of the semiconductor substrate to a third depth deeper than the second depth, the diffusion suppressing region containing a diffusion suppressing substance suppressing diffusion of the impurity.

Abstract: A protection film is formed on a semiconductor substrate. Impurity ions are implanted into the semiconductor substrate through the protection film. The impurity is activated to form an impurity layer. The protection film is removed after forming the impurity layer. The semiconductor substrate of a surface portion of the impurity layer is removed after removing the protection film. A semiconductor layer is epitaxially grown above the semiconductor substrate after removing the semiconductor substrate of the surface portion of the impurity layer.

Abstract: The depletion of a gate electrode (103) is suppressed in such a way that impurities are introduced into the gate electrode that is formed on a semiconductor substrate (101), with a gate insulating film (102) interposed between the gate electrode (103) and the semiconductor substrate (101), and that, by irradiating a laser beam onto the gate electrode (103), the introduced impurities are made to diffuse up to the interface between the gate electrode (103) and the gate insulating film (102).

Abstract: The refrigerator includes a vegetable compartment (107) thermally insulated by a rear partition (111), and a mist generation department (139) for atomizing a mist into the vegetable compartment (107), and the mist generation department (139) includes a atomizing electrode (135) for atomizing the mist into the vegetable compartment (107), a voltage applicator (133) for applying a voltage to the atomizing electrode (135), and a cooling pin (134) coupled to the atomizing electrode (135), in which the atomizing electrode (135) is cooled to a temperature lower than the dew point by a outlet air-duct for freezer compartment (141), and the moisture in the air is cooled to condense dew on the atomizing electrode (135), and is atomized as a mist into the vegetable compartment (107), and dew can be condensed from moisture onto the atomizing electrode (135) stably and in a simple configuration, and the freshness of the food is enhanced while the reliability of the refrigerator is enhanced.

Abstract: In a urine receptacle of an automatic urine disposal device, a urine backflow prevention sheet, with no water permeability, having funnel-shaped pores, is placed between a top sheet and a urine absorbing sheet. A pair of rectangular electrodes, constituting a urine detection sensor, is glued onto an electrode support sheet and is placed between the top sheet and the urine backflow prevention sheet. A plurality of funnel-shaped pores is formed on the urine backflow prevention sheet.

Abstract: According to an aspect of an embodiment, a semiconductor device has a semiconductor substrate, a gate insulating film on the semiconductor substrate, a gate electrode formed on the gate insulating film, an impurity diffusion region formed in an area of the semiconductor substrate adjacent to the gate electrode to a first depth to the semiconductor substrate, the impurity diffusion region containing impurity, an inert substance containing region formed in the area of the semiconductor substrate to a second depth deeper than the first depth, the inert substance containing region containing an inert substance, and a diffusion suppressing region formed in the area of the semiconductor substrate to a third depth deeper than the second depth, the diffusion suppressing region containing a diffusion suppressing substance suppressing diffusion of the impurity.

Abstract: According to an aspect of an embodiment, a semiconductor device has a semiconductor substrate, a gate insulating film on the semiconductor substrate, a gate electrode formed on the gate insulating film, an impurity diffusion region formed in an area of the semiconductor substrate adjacent to the gate electrode to a first depth to the semiconductor substrate, the impurity diffusion region containing impurity, an inert substance containing region formed in the area of the semiconductor substrate to a second depth deeper than the first depth, the inert substance containing region containing an inert substance, and a diffusion suppressing region formed in the area of the semiconductor substrate to a third depth deeper than the second depth, the diffusion suppressing region containing a diffusion suppressing substance suppressing diffusion of the impurity.

Abstract: A method of manufacturing a semiconductor device includes forming a conductive layer over a semiconductor substrate, selectively removing the conductive layer for forming a resistance element and a gate electrode, forming sidewall spacers over sidewalls of the remaining conductive layer, forming a first insulating film containing a nitrogen over the semiconductor substrate having the sidewall spacers, implanting ions in the semiconductor substrate through the first insulating film, forming a second insulating film containing a nitrogen over the first insulating film after implanting ions in the semiconductor substrate through the first insulating film, and selectively removing the first and the second insulating film such that at least a part of the first and the second insulating films is remained over the semiconductor substrate and over the conductive layer.

Abstract: A semiconductor device comprises a field-effect transistor arranged in a semiconductor substrate, which transistor has a gate electrode, source/drain impurity diffusion regions, and carbon layers surrounding the source/drain impurity diffusion regions. Each of the carbon layers is provided at an associated of the source/drain impurity diffusion regions and positioned so as to be offset from the front edge of a source/drain extension in direction away from the gate electrode and to surround as profile the associated source/drain impurity diffusion region.

Abstract: A wearer wears a urine receptacle in which a urine absorbent material 3 is housed in a substantially rectangular, non-breathable, liquid-impermeable outer sheet having a U-shaped cross-section, and the surface of the urine absorbent material is covered with a hard-breathable, liquid permeable top sheet. Urine is discharged from a urine drainage port formed on the bottom surface of the outer sheet to a sealed urine tank by a vacuum pump through urine drainage tubes.

Abstract: The refrigerator includes a vegetable compartment (107) thermally insulated by a rear partition (111), and a mist generation department (139) for atomizing a mist into the vegetable compartment (107), and the mist generation department (139) includes a atomizing electrode (135) for atomizing the mist into the vegetable compartment (107), a voltage applicator (133) for applying a voltage to the atomizing electrode (135), and a cooling pin (134) coupled to the atomizing electrode (135), in which the atomizing electrode (135) is cooled to a temperature lower than the dew point by a outlet air-duct for freezer compartment (141), and the moisture in the air is cooled to condense dew on the atomizing electrode (135), and is atomized as a mist into the vegetable compartment (107), and dew can be condensed from moisture onto the atomizing electrode (135) stably and in a simple configuration, and the freshness of the food is enhanced while the reliability of the refrigerator is enhanced.

Abstract: The refrigerator includes a vegetable compartment (107) thermally insulated by a rear partition (111), and a mist generation department (139) for atomizing a mist into the vegetable compartment (107), and the mist generation department (139) includes a atomizing electrode (135) for atomizing the mist into the vegetable compartment (107), a voltage applicator (133) for applying a voltage to the atomizing electrode (135), and a cooling pin (134) coupled to the atomizing electrode (135), in which the atomizing electrode (135) is cooled to a temperature lower than the dew point by a outlet air-duct for freezer compartment (141), and the moisture in the air is cooled to condense dew on the atomizing electrode (135), and is atomized as a mist into the vegetable compartment (107), and dew can be condensed from moisture onto the atomizing electrode (135) stably and in a simple configuration, and the freshness of the food is enhanced while the reliability of the refrigerator is enhanced.

Abstract: The refrigerator includes a vegetable compartment (107) thermally insulated by a rear partition (111), and a mist generation department (139) for atomizing a mist into the vegetable compartment (107), and the mist generation department (139) includes a atomizing electrode (135) for atomizing the mist into the vegetable compartment (107), a voltage applicator (133) for applying a voltage to the atomizing electrode (135), and a cooling pin (134) coupled to the atomizing electrode (135), in which the atomizing electrode (135) is cooled to a temperature lower than the dew point by a outlet air-duct for freezer compartment (141), and the moisture in the air is cooled to condense dew on the atomizing electrode (135), and is atomized as a mist into the vegetable compartment (107), and dew can be condensed from moisture onto the atomizing electrode (135) stably and in a simple configuration, and the freshness of the food is enhanced while the reliability of the refrigerator is enhanced.

Abstract: A method for manufacturing a semiconductor device has the steps of: (a) implanting boron (B) ions into a semiconductor substrate; (b) implanting fluorine (F) or nitrogen (N) ions into the semiconductor device; (c) after the steps (a) and (b) are performed, executing first annealing with a heating time of 100 msec or shorter relative to a region of the semiconductor substrate into which ions were implanted; and (d) after the step (c) is performed, executing second annealing with a heating time longer than the heating time of the first annealing, relative to the region of the semiconductor substrate into which ions were implanted. The method for manufacturing a semiconductor device is provided which can dope boron (B) shallowly and at a high concentration.

Abstract: A semiconductor device comprises a field-effect transistor arranged in a semiconductor substrate, which transistor has a gate electrode, source/drain impurity diffusion regions, and carbon layers surrounding the source/drain impurity diffusion regions. Each of the carbon layers is provided at an associated of the source/drain impurity diffusion regions and positioned so as to be offset from the front edge of a source/drain extension in direction away from the gate electrode and to surround as profile the associated source/drain impurity diffusion region.

Abstract: A method of manufacturing a semiconductor device includes forming a conductive layer over a semiconductor substrate, selectively removing the conductive layer for forming a resistance element and a gate electrode, forming sidewall spacers over sidewalls of the remaining conductive layer, forming a first insulating film containing a nitrogen over the semiconductor substrate having the sidewall spacers, implanting ions in the semiconductor substrate through the first insulating film, forming a second insulating film containing a nitrogen over the first insulating film after implanting ions in the semiconductor substrate through the first insulating film, and selectively removing the first and the second insulating film such that at least a part of the first and the second insulating films is remained over the semiconductor substrate and over the conductive layer.