Patents by Inventor Kenichi Okunaga

Kenichi Okunaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11345780
    Abstract: A thermoplastic polyester resin composition includes a thermoplastic polyester resin (A), an epoxy compound (B) having an epoxy equivalent of from 200 to 3,000 g/eq, and a hydroxy group-containing resin (C) having a number average molecular weight of from 2,000 to 500,000 and a halogen element content of 1,000 ppm or less, wherein the epoxy compound (B) is blended in an amount of from 0.05 to 10 parts by weight with respect to 100 parts by weight in total of 70 to 99.9 parts by weight of the thermoplastic polyester resin (A) and 0.1 to 30 parts by weight of the hydroxy group-containing resin (C). The thermoplastic resin composition and a molded article achieve both long-term hydrolysis resistance and heat aging resistance at a high level, and can further suppress bleed-out to the surface of the molded article during heat-dry and heat-moisture treatments.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: May 31, 2022
    Assignee: Toray Industries, Inc.
    Inventors: Kenichi Okunaga, Yusuke Tojo, Makito Yokoe, Hideyuki Umetsu
  • Publication number: 20210032402
    Abstract: A thermoplastic polyester resin composition includes a thermoplastic polyester resin (A), an epoxy compound (B) having an epoxy equivalent of from 200 to 3,000 g/eq, and a hydroxy group-containing resin (C) having a number average molecular weight of from 2,000 to 500,000 and a halogen element content of 1,000 ppm or less, wherein the epoxy compound (B) is blended in an amount of from 0.05 to 10 parts by weight with respect to 100 parts by weight in total of 70 to 99.9 parts by weight of the thermoplastic polyester resin (A) and 0.1 to 30 parts by weight of the hydroxy group-containing resin (C). The thermoplastic resin composition and a molded article achieve both long-term hydrolysis resistance and heat aging resistance at a high level, and can further suppress bleed-out to the surface of the molded article during heat-dry and heat-moisture treatments.
    Type: Application
    Filed: June 20, 2018
    Publication date: February 4, 2021
    Inventors: Kenichi Okunaga, Yusuke Tojo, Makito Yokoe, Hideyuki Umetsu
  • Publication number: 20180312692
    Abstract: A molded product made from a resin composition includes a polyamide resin and has a thickness of not less than 0.56 mm. A difference (Q?P) between Q and P is less than 0.06, where P (A1680/A1632) denotes an intensity ratio of a maximum value of absorbance A1680 at 1680 cm?1±8 cm?1 to a maximum value of absorbance A1632 at 1632 cm?1±8 cm?1 with an absorbance at 1800 cm?1 being set to 0 with regard to an infrared absorption spectrum of a cutting surface at a depth of 0.28 mm from a surface of the molded product, and Q (A?1680/A?1632) denotes an intensity ratio of a maximum value of absorbance A?1680 at 1680 cm?1±8 cm?1 to a maximum value of absorbance A?1632 at 1632 cm?1±8 cm?1 with an absorbance at 1800 cm?1 being set to 0.
    Type: Application
    Filed: July 6, 2016
    Publication date: November 1, 2018
    Applicant: Toray Industries, Inc.
    Inventors: Kenichi Okunaga, Atsushi Masunaga, Shingo Nishida, Masaru Akita, Hideyuki Umetsu
  • Patent number: 9938407
    Abstract: A polyarylene sulfide resin composition includes: (A) a polyarylene sulfide resin having a carboxyl group content of more than 100 ?mol/g and less than 400 ?mol/g, and also having a weight average molecular weight of 10,000 or more and less than 100,000; and (B) a filler. The polyarylene sulfide resin composition has improved mechanical properties and chemical resistance while maintaining intrinsic high melting point of a polyarylene sulfide.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: April 10, 2018
    Assignee: Toray Industries, Inc.
    Inventors: Takeshi Unohara, Hideki Matsumoto, Kei Saitoh, Kenichi Okunaga
  • Publication number: 20160244612
    Abstract: A polyarylene sulfide resin composition includes: (A) a polyarylene sulfide resin having a carboxyl group content of more than 100 ?mol/g and less than 400 ?mol/g, and also having a weight average molecular weight of 10,000 or more and less than 100,000; and (B) a filler. The polyarylene sulfide resin composition has improved mechanical properties and chemical resistance while maintaining intrinsic high melting point of a polyarylene sulfide.
    Type: Application
    Filed: September 25, 2014
    Publication date: August 25, 2016
    Inventors: Takeshi Unohara, Hideki Matsumoto, Kei Saitoh, Kenichi Okunaga