Abstract: In a power converter, an insulation member is interposed between a first overlap portion of the near DC busbar and a second overlap portion of the far DC busbar in a protrusion direction. The first overlap portion is located closer to the converter component in the protrusion direction than the second overlap portion is. A near DC terminal is arranged to be closer to the first and second overlap portions than a far DC terminal is in an arrangement direction perpendicular to both the stack and protrusion directions. The near and far DC busbars are joined to the respective near and far DC terminals. The far DC busbar is joined to the far DC terminals of the respective semiconductor modules while bypassing the near DC terminals of the respective semiconductor modules.

Abstract: In a power converter, an insulation member is interposed between a first overlap portion of the near DC busbar and a second overlap portion of the far DC busbar in a protrusion direction. The first overlap portion is located closer to the converter component in the protrusion direction than the second overlap portion is. A near DC terminal is arranged to be closer to the first and second overlap portions than a far DC terminal is in an arrangement direction perpendicular to both the stack and protrusion directions. The near and far DC busbars are joined to the respective near and far DC terminals. The far DC busbar is joined to the far DC terminals of the respective semiconductor modules while bypassing the near DC terminals of the respective semiconductor modules.

Abstract: A power conversion apparatus includes electronic components configuring a power conversion circuit, a cooler for cooling at least part of the electronic components, and a case housing the electronic components and the cooler. The at least part of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit. The internal unit is fixed within the case through the frame. The frame has such a shape that the at least part of the electronic components is surrounded by the frame from four sides.

Abstract: An electric power conversion apparatus is provided which includes electronic components, a cooler, an internal unit, a capacitor, and a case. The internal unit has a frame to which at least one of the electronic components and the cooler are secured and which surrounds all around the one of the electronic components. The frame includes unit fixing sections through which the internal unit is fixed to the case and capacitor fixing sections through which the capacitor is fixed to the internal unit. The capacitor fixing sections are located inward of the frame more than the unit fixing sections. The internal unit is fixed to the case and thus works as a beam to increase the mechanical rigidity of the case. The fixing of the internal unit to the case minimizes external force to be exerted through the case on the electronic component and the cooler.

Abstract: In a power conversion apparatus, electronic components and a cooler are integrated in a frame as an internal unit. The internal unit is fixed within a case through the frame. The frame has such a shape that the electronic components are surrounded by the frame, and includes a first wall section, and second and third wall sections extending from both sides of the first wall section. The cooler includes a coolant introduction tube and a coolant discharge tube. The coolant introduction tube and the coolant discharge tube project outward from to the frame. The first to third wall sections include a support wall section supporting at least one of the coolant introduction tube and the coolant discharge tube, and a frame wall section not supporting the coolant introduction tube and the coolant discharge tube. The thickness of the support wall section is larger than the thickness of the frame wall section.

Abstract: The power conversion apparatus includes electronic components constituting a power conversion circuit, a cooler for cooling at least some of the electronic components, and a case housing the electronic components and the cooler. The at least some of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit . The internal unit including therein the semiconductor modules also includes a control circuit board fitted to board fixing sections formed in the frame so as to project from the frame in the height direction perpendicular to the plane of the frame. Each of the board fixing sections has a board abutment surface at a position closer to the frame than the tips of control terminals of the semiconductor modules formed so as to project in the height direction.

Abstract: An electric power conversion apparatus is provided which includes electronic components, a cooler, an internal unit, a capacitor, and a case. The internal unit has a frame to which at least one of the electronic components and the cooler are secured and which surrounds all around the one of the electronic components. The frame includes unit fixing sections through which the internal unit is fixed to the case and capacitor fixing sections through which the capacitor is fixed to the internal unit. The capacitor fixing sections are located inward of the frame more than the unit fixing sections. The internal unit is fixed to the case and thus works as a beam to increase the mechanical rigidity of the case. The fixing of the internal unit to the case minimizes external force to be exerted through the case on the electronic component and the cooler.

Abstract: A power conversion apparatus includes electronic components configuring a power conversion circuit, a cooler for cooling at least part of the electronic components, and a case housing the electronic components and the cooler. The at least part of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit. The internal unit is fixed within the case through the frame. The frame has such a shape that the at least part of the electronic components is surrounded by the frame from four sides.

Abstract: The power conversion apparatus includes electronic components constituting a power conversion circuit, a cooler for cooling at least some of the electronic components, and a case housing the electronic components and the cooler. The at least some of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit . The internal unit including therein the semiconductor modules also includes a control circuit board fitted to board fixing sections formed in the frame so as to project from the frame in the height direction perpendicular to the plane of the frame. Each of the board fixing sections has a board abutment surface at a position closer to the frame than the tips of control terminals of the semiconductor modules formed so as to project in the height direction.

Abstract: In a power conversion apparatus, electronic components and a cooler are integrated in a frame as an internal unit. The internal unit is fixed within a case through the frame. The frame has such a shape that the electronic components are surrounded by the frame, and includes a first wall section, and second and third wall sections extending from both sides of the first wall section. The cooler includes a coolant introduction tube and a coolant discharge tube. The coolant introduction tube and the coolant discharge tube project outward from to the frame. The first to third wall sections include a support wall section supporting at least one of the coolant introduction tube and the coolant discharge tube, and a frame wall section not supporting the coolant introduction tube and the coolant discharge tube. The thickness of the support wall section is larger than the thickness of the frame wall section.

Abstract: A multiphase inverter has two card shaped arm modules facing each other along a stacking direction. Each module has semiconductor switching elements disposed along an element arranging direction substantially perpendicular to the stacking direction, a common heat sink plate connecting direct current electrodes of the elements with one of terminals of the power source, and phase heat sink plates connecting respective alternating current electrodes of the elements with respective multiphase terminals of a motor. The elements of each module correspond to all phases of an alternating current. Each common heat sink plate forms a principal surface of the corresponding module, and the phase heat sink plates of each module forms another principal surface. The principal surfaces of each module face each other along the stacking direction.

Abstract: A circuit for detecting excessive current flow through a switching element derives an electrical quantity relating to a condition of the switching element and correlated with the current level, and compares the magnitude of that electrical condition quantity with a threshold value corresponding to the maximum allowable level of current. A temperature detection signal indicative of the switching element temperature is converted to a compensation signal having a temperature characteristic which is modified from that of the temperature detection signal, and which is utilized to compensate the magnitude comparison operation against inaccuracy caused by a temperature dependency of the electrical condition quantity.

Abstract: A semiconductor device is disclosed that includes a first and a second semiconductor package. Each semiconductor package includes a semiconductor element, a plurality of electrode members, and an encapsulating member. The semiconductor elements are interposed between the respective electrode members, and the electrode members are in electrical communication with and provide heat transfer for the respective semiconductor element. The encapsulating member encapsulates the respective semiconductor element between the respective electrode members, and an outer surface of each of the electrode members is exposed from the respective encapsulating member. Each semiconductor package includes a connecting terminal electrically coupled to one of the electrode members and extending outward so as to be exposed from the respective encapsulating member. The connecting terminals are electrically connected by abutment or via a conductive junction material.

Abstract: A circuit for detecting excessive current flow through a switching element derives an electrical quantity relating to a condition of the switching element and correlated with the current level, and compares the magnitude of that electrical condition quantity with a threshold value corresponding to the maximum allowable level of current. A temperature detection signal indicative of the switching element temperature is converted to a compensation signal having a temperature characteristic which is modified from that of the temperature detection signal, and which is utilized to compensate the magnitude comparison operation against inaccuracy caused by a temperature dependency of the electrical condition quantity.

Abstract: A multiphase inverter has two card shaped arm modules facing each other along a stacking direction. Each module has semiconductor switching elements disposed along an element arranging direction substantially perpendicular to the stacking direction, a common heat sink plate connecting direct current electrodes of the elements with one of terminals of the power source, and phase heat sink plates connecting respective alternating current electrodes of the elements with respective multiphase terminals of a motor. The elements of each module correspond to all phases of an alternating current. Each common heat sink plate forms a principal surface of the corresponding module, and the phase heat sink plates of each module forms another principal surface. The principal surfaces of each module face each other along the stacking direction.

Abstract: A semiconductor device is disclosed that includes a first and a second semiconductor package. Each semiconductor package includes a semiconductor element, a plurality of electrode members, and an encapsulating member. The semiconductor elements are interposed between the respective electrode members, and the electrode members are in electrical communication with and provide heat transfer for the respective semiconductor element. The encapsulating member encapsulates the respective semiconductor element between the respective electrode members, and an outer surface of each of the electrode members is exposed from the respective encapsulating member. Each semiconductor package includes a connecting terminal electrically coupled to one of the electrode members and extending outward so as to be exposed from the respective encapsulating member. The connecting terminals are electrically connected by abutment or via a conductive junction material.

Abstract: In a semiconductor device, a semiconductor module contains a semiconductor element and having a radiating portion, and a heat absorbing member has a heat absorbing portion with heat conductivity. A grease member is interposed between the radiating portion of the semiconductor module and the heat absorbing portion of the heat absorbing member. The radiating portion and absorbing portion are opposite and close to each other through the grease member in a predetermined direction. A grease extrusion path has one end and other end portions and formed in at least one of the radiating portion and the heat absorbing portion. The one end portion of the grease extrusion path is configured to contact the grease member, said other end portion thereof communicates with an exterior of the at least one of the radiating portion and the heat absorbing portion.

Abstract: In a semiconductor device, a semiconductor module contains a semiconductor element and having a radiating portion, and a heat absorbing member has a heat absorbing portion with heat conductivity. A grease member is interposed between the radiating portion of the semiconductor module and the heat absorbing portion of the heat absorbing member. The radiating portion and absorbing portion are opposite and close to each other through the grease member in a predetermined direction. A grease extrusion path has one end and other end portions and formed in at least one of the radiating portion and the heat absorbing portion. The one end portion of the grease extrusion path is configured to contact the grease member, said other end portion thereof communicates with an exterior of the at least one of the radiating portion and the heat absorbing portion.