Abstract: A circuit board design device judging whether a circuit board has a pair of via holes which are adjacent within a solder bridge formation distance within which a solder bridge can be formed; when the affirmative, the circuit board design device judging whether each of the pair of via holes is electrically connected in parallel to other via hole with a land not coated with solder resist; when the circuit board design device judges that at least one of the pair of via holes is electrically connected in parallel to the other via hole with a land not coated with solder resist, the circuit board design device determining the at least one of the pair of via holes which is electrically connected in parallel to the other via hole with a land not coated with solder resist as a coated via hole with a land coated with solder resist.

Abstract: A circuit board design device judging whether a circuit board has a pair of via holes which are adjacent within a solder bridge formation distance within which a solder bridge can be formed; when the affirmative, the circuit board design device judging whether each of the pair of via holes is electrically connected in parallel to other via hole with a land not coated with solder resist; when the circuit board design device judges that at least one of the pair of via holes is electrically connected in parallel to the other via hole with a land not coated with solder resist, the circuit board design device determining the at least one of the pair of via holes which is electrically connected in parallel to the other via hole with a land not coated with solder resist as a coated via hole with a land coated with solder resist.

Abstract: Provided is a printed circuit board structure that needs minimum manufacturing costs and in which there is little possibility that a solder bridge is formed. The printed circuit board structure is formed with via holes for electrically conductively connecting electrically conductive layers of a printed circuit board, and the via holes include a coated via hole with a land coated with solder resist and a non-coated via hole with a land not coated with solder resist, wherein the coated via hole is arranged in a place of the printed circuit board where a solder bridge or a solder ball is highly likely to be generated, and is electrically connected to at least one of the non-coated via hole in parallel.

Abstract: In respect to emissions trading, although the emission of carbon dioxide may be reduced, there arises a need for reduction of energy so used in conjunction therewith with the possibility of global recession. The present invention purports to facilitate supply of organic compounds having environmentally-friendly values by providing a support system, an certification system and a method of trading environmentally-friendly values of organic compounds, in conjunction with accompanying computer software, to operators creating environmentally-friendly values of organic compounds; to a wide range of companies wishing to purchase organic compounds having said environmentally-friendly values and products produced by using said organic compounds; and to individual consumers.

Abstract: A pure steam-related apparatus, which is one of apparatus in the group of pure steam generators generating pure steam from purified water, pipelines for pure steam and sterilizers using pure steam, is protected from discoloration, so-called "fouling", to red or black caused by contact with the pure steam. The apparatus is manufactured by using an austenitic stainless steel sheet as the material, by taking the blanks from the material which received no mechanical surface polishing, by deforming and welding, without electrolytic polishing customarily done, and by passivating the surface to contact pure water to increase Cr-content in the passivation film to such extent as 45 atomic % or higher, preferably 55 atomic % or higher. Better results will be obtained by ensuring Cr/Fe ratio in the passivation film at the level of 1.45 or higher, preferably, 1.70 or higher.