Abstract: According to one embodiment, a magnetic memory device includes a lower insulating layer, first and second conductive portions provided in the lower insulating layer, first and second memory cells provided on the lower insulating layer and on the respective first and second conductive portions, and each including a magnetoresistance effect element, a switching element and a bottom electrode connected to corresponding one of the first and second conductive portions. As viewed from a third direction, a width of each of the first and second conductive portions is less than a width of a corresponding bottom electrode. The lower insulating layer has a void under a region between the first and second memory cells.

Abstract: According to one embodiment, a magnetic memory device includes a first wiring line extending in a first direction, a second wiring line provided on an upper layer side of the first wiring line and extending in a second direction intersecting the first direction, and a memory cell provided between the first wiring line and the second wiring line and including a magnetoresistance effect element and a switching element which are stacked in a third direction intersecting the first direction and the second direction. The first wiring line includes a first conductive layer and a second conductive layer provided on the first conductive layer and formed of a material containing carbon (C).

Abstract: According to one embodiment, a magnetic memory device includes an electrode, and a magnetoresistance effect element provided on the electrode. The electrode includes a first electrode portion and a second electrode portion provided between the magnetoresistance effect element and the first electrode portion and containing a metal element selected from molybdenum (Mo) and ruthenium (Ru).

Abstract: A semiconductor module includes: a circuit board; a semiconductor chip having a first electrode pad on a first surface, bonded to the circuit board at a second surface that is opposite to the first surface, and having side surfaces intersecting the first surface and the second surface; an external terminal electrically connected to the first electrode pad; and an insulating member configured to fix the external terminal, wherein by the insulating member contacting the side surfaces of the semiconductor chip at a plurality of locations, parallel movement and rotational movement of the semiconductor chip relative to the insulating member in a plane parallel, to the first surface are restricted, and wherein the external terminal penetrates the insulating member.

Abstract: A semiconductor module includes a semiconductor chip having a first surface provided with a first electrode pad and a second surface, opposite to the first surface, provided with a second electrode pad, a first substrate connected to the first electrode pad, a second substrate provided on the side of the second surface, and a conductor section, electrically connecting the second electrode pad and the second substrate, and having a size greater than the second electrode pad in a plan view viewed from the side of the second substrate.

Abstract: A semiconductor module includes: a circuit board; a semiconductor chip having a first electrode pad on a first surface, bonded to the circuit board at a second surface that is opposite to the first surface, and having side surfaces intersecting the first surface and the second surface; an external terminal electrically connected to the first electrode pad; and an insulating member configured to fix the external terminal, wherein by the insulating member contacting the side surfaces of the semiconductor chip at a plurality of locations, parallel movement and rotational movement of the semiconductor chip relative to the insulating member in a plane parallel, to the first surface are restricted, and wherein the external terminal penetrates the insulating member.

Abstract: A semiconductor module includes a semiconductor chip having a first surface provided with a first electrode pad and a second surface, opposite to the first surface, provided with a second electrode pad, a first substrate connected to the first electrode pad, a second substrate provided on the side of the second surface, and a conductor section, electrically connecting the second electrode pad and the second substrate, and having a size greater than the second electrode pad in a plan view viewed from the side of the second substrate.

Abstract: An image processing device capable of executing a plurality of jobs that differ in kind, the image processing device includes: a controller that controls execution of an input job; and a detection part that, on the basis of a voice detected by a voice detector, detects that any of a plurality of predetermined target voices has been emitted, wherein in a case where it is detected that the target voice has been emitted during a target setting period corresponding to a job that is being executed, among setting periods that are defined beforehand according to kinds of jobs respectively, the controller stops the execution of the job.

Abstract: An image processing system includes: an image processing device that comprises a first display and a first hardware processor; and an information processing device that communicates with the image processing device, and comprises: a second display on which a second screen same as a first screen being displayed on the first display is displayed; and a second hardware processor, wherein one of the first and second hardware processors determines whether a screen display standard of the first display is left or right standard and whether a screen display standard of the second display is left or right standard, and inverts the second screen that is same as the first screen being displayed on the first display and is displayed on the second display right and left, when the screen display standards of the first and second displays are determined to be different from each other.

Abstract: An image processing device capable of executing a plurality of jobs that differ in kind, the image processing device includes: a controller that controls execution of an input job; and a detection part that, on the basis of a voice detected by a voice detector, detects that any of a plurality of predetermined target voices has been emitted, wherein in a case where it is detected that the target voice has been emitted during a target setting period corresponding to a job that is being executed, among setting periods that are defined beforehand according to kinds of jobs respectively, the controller stops the execution of the job.

Abstract: A device for determining a gesture includes a display portion for selectively displaying one of screens; a storage portion for storing, for each of the screens, a rule used for distinguishing between gestures; a detection portion for detecting a motion made by a user; and a determination portion for identifying, from among the gestures, a gesture represented by the motion detected by the detection portion based on the rule for a current screen, the current screen being one of the screens and being displayed at a time when the motion has been detected.

Abstract: An image processing apparatus includes a display for displaying operational information for executing image processing, an operation unit for giving an input instruction in association with a display region appearing on the display, and a controller for controlling the display in accordance with the input instruction on the operation unit. The controller is configured to determine whether an input instruction of a flick operation is given through the operation unit in association with a prescribed display region appearing on the display. If it is determined that the input instruction of the flick operation is given, the controller is configured to enlarge a range of the prescribed display region in which the input instruction is allowed, and to display the enlarged display region on the display.

Abstract: A semiconductor module (10A) according to one embodiment includes: vertical first and second transistor chips (12A, 12B), wherein a second main electrode pad (20) formed on a back surface of the first transistor chip is mounted on and connected to a first wiring pattern (74) on the substrate, a first control electrode pad (16) formed together with a first main electrode pad on a front surface of the first transistor chip is electrically connected to a second wiring pattern (76) on the substrate, third main electrode pad (18) formed together with a second control electrode pad on a front surface of the second transistor is mounted on and connected to the first wiring pattern, and the second control electrode pad (16) formed on a back surface of the second transistor chip is electrically connected to a third wiring pattern.

Abstract: A semiconductor module (10A) according to one embodiment includes a plurality of first and second transistor chips (hereinafter, first and second transistors) (12A, 12B) and a substrate (90). In each of the first and second transistors, first and second main electrode pads (18, 20) are each electrically connected together; the second main electrode pads of the first transistors are electrically connected to the first main electrode pads of the second transistors; control electrode pads of the first and second transistors are respectively connected to first and second control electrode wiring patterns (94, 98) on the substrate via first and second resistance parts (13A, 13B); and the first and second resistance parts respectively have a plurality of first and second resistance elements (72A, 72B) each connected to the corresponding control electrode pad, and first and second linking parts (74A, 74B) respectively linking the plurality of first and second resistance elements together.

Abstract: A semiconductor module (10A) according to one embodiment includes: vertical first and second transistor chips (12A, 12B), wherein a second main electrode pad (20) formed on a back surface of the first transistor chip is mounted on and connected to a first wiring pattern (74) on the substrate, a first control electrode pad (16) formed together with a first main electrode pad on a front surface of the first transistor chip is electrically connected to a second wiring pattern (76) on the substrate, third main electrode pad (18) formed together with a second control electrode pad on a front surface of the second transistor is mounted on and connected to the first wiring pattern, and the second control electrode pad (16) formed on a back surface of the second transistor chip is electrically connected to a third wiring pattern.

Abstract: A semiconductor module (10A) according to one embodiment includes a plurality of first and second transistor chips (hereinafter, first and second transistors) (12A, 12B) and a substrate (90). In each of the first and second transistors, first and second main electrode pads (18, 20) are each electrically connected together; the second main electrode pads of the first transistors are electrically connected to the first main electrode pads of the second transistors; control electrode pads of the first and second transistors are respectively connected to first and second control electrode wiring patterns (94, 98) on the substrate via first and second resistance parts (13A, 13B); and the first and second resistance parts respectively have a plurality of first and second resistance elements (72A, 72B) each connected to the corresponding control electrode pad, and first and second linking parts (74A, 74B) respectively linking the plurality of first and second resistance elements together.

Abstract: A display system includes an image forming device and a mobile communication terminal. In the display system, the mobile communication terminal accepts a flick manipulation to move the screen, and transmits flick information on the accepted flick manipulation to the image forming device. The image forming device decides an area, which is a part of the screen of the mobile communication terminal and in which display is changed when the screen is moving, and sequentially transmits to the mobile communication terminal positional information on the decided area and screen data of the screen before the movement is completed since the movement is started, which is decided based on the flick information in the decided area. The mobile communication terminal displays the screen in the area of the transmitted positional information based on the transmitted screen data.

Abstract: A surrounding area monitoring apparatus for vehicle includes an infrared camera mounted on a vehicle for capturing images of surrounding area around the vehicle, a unit for generating and displaying images based on image data captured by the camera, and a controller for calibrating output of the camera with respect to a relation between pixels, based on image data produced by imaging a surface of a shutter that opens and closes an aperture introducing a light to the camera, The controller estimates whether a temperature of the camera is stable, based on an operation state of the vehicle, and determines a possibility that a driver is looking at the unit, based on a behavior of the vehicle. When the temperature of the camera is estimated stable and the possibility that the driver is looking at the unit is determined to be low, the means for calibrating executes the calibration.

Abstract: A display system includes an image forming apparatus for storing screen data and a portable information terminal for displaying a screen based on the screen data stored by the image forming apparatus. The display system accepts flick operation for requesting movement of a screen at the portable communication terminal and transmits flick information concerning the flick operation to the image forming apparatus. The display system successively transmits screen data of screens from the start of movement to completion of movement from the image forming apparatus to the portable communication terminal, based on the flick information. The display system displays a screen based on the transmitted screen data on the portable communication terminal.

Abstract: An MFP (Multifunction Peripheral) receives, from a remote terminal, information on a first operation to request the MFP to execute processing. The MFP transmits, to the remote terminal, information on a screen in accordance with the information on the first operation, and receives, from the remote terminal, a report that a screen in accordance with the transmitted information is displayed on the remote terminal. The MFP receives, from the remote terminal, information on a second operation to request the MFP to execute processing, after receipt of the information on the first operation and before receipt of the report, and decides whether to execute or cancel the processing in accordance with the information on the second operation, depending on the type of the information on the second operation.