Patents by Inventor Kenichi SAWANAKA
Kenichi SAWANAKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10319663Abstract: A semiconductor memory device includes a housing having a wall, a circuit board located in the housing and spaced from the wall and extending along the surface of the wall, a memory located on the circuit board, a heat conduction member interposed, and compressed, between the wall and the memory. The wall includes an uneven region comprising contact portions contacting the heat conduction member and recess portions located between the contact portions. The recess portions are recessed inwardly of the wall from the ends of the contact portions in a direction away from the location of the memory.Type: GrantFiled: March 2, 2018Date of Patent: June 11, 2019Assignee: TOSHIBA MEMORY CORPORATIONInventor: Kenichi Sawanaka
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Publication number: 20190088569Abstract: A semiconductor memory device includes a housing having a wall, a circuit board located in the housing and spaced from the wall and extending along the surface of the wall, a memory located on the circuit board, a heat conduction member interposed, and compressed, between the wall and the memory. The wall includes an uneven region comprising contact portions contacting the heat conduction member and recess portions located between the contact portions. The recess portions are recessed inwardly of the wall from the ends of the contact portions in a direction away from the location of the memory.Type: ApplicationFiled: March 2, 2018Publication date: March 21, 2019Applicant: TOSHIBA MEMORY CORPORATIONInventor: Kenichi SAWANAKA
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Patent number: 10076063Abstract: According to one embodiment, an electronic apparatus includes a first substrate, a second substrate, an electronic component, a housing, and a protruding portion. The first substrate has a first face and a second face and is provided with an opening. The second substrate has a third face configured to face the second face and a fourth face and is configured to be electrically connected to the first substrate. The electronic component is configured to be mounted on the third face and is configured to be disposed at a position overlapping the opening in a direction in which the third face faces. The housing is configured to accommodate the first and second substrates. The protruding portion is provided in the housing and is configured to pass through the opening and be thermally connected to the electronic component.Type: GrantFiled: July 7, 2015Date of Patent: September 11, 2018Assignee: Toshiba Memory CorporationInventors: Yoshiharu Matsuda, Kazuhiro Yoshida, Kenichi Sawanaka
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Patent number: 9788463Abstract: A semiconductor memory device includes a semiconductor memory unit, a memory controller, a cover unit having a first portion covering the semiconductor memory unit and a second portion covering the memory controller, a first heat conduction member disposed between the semiconductor memory unit and the first portion of the cover unit, and a second heat conduction member disposed between the memory controller and the second portion of the cover. The cover unit has a gap formed between the first and second portions.Type: GrantFiled: September 1, 2015Date of Patent: October 10, 2017Assignee: Toshiba Memory CorporationInventors: Yasuyuki Ozawa, Fuminori Kimura, Masaaki Niijima, Masahiro Iijima, Yoshiharu Matsuda, Kenichi Sawanaka, Kazuhiro Yoshida
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Publication number: 20160270266Abstract: A semiconductor memory device includes a semiconductor memory unit, a memory controller, a cover unit having a first portion covering the semiconductor memory unit and a second portion covering the memory controller, a first heat conduction member disposed between the semiconductor memory unit and the first portion of the cover unit, and a second heat conduction member disposed between the memory controller and the second portion of the cover. The cover unit has a gap formed between the first and second portions.Type: ApplicationFiled: September 1, 2015Publication date: September 15, 2016Inventors: Yasuyuki OZAWA, Fuminori KIMURA, Masaaki NIIJIMA, Masahiro IIJIMA, Yoshiharu MATSUDA, Kenichi SAWANAKA, Kazuhiro YOSHIDA
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Publication number: 20160270261Abstract: According to one embodiment, an electronic apparatus includes a first substrate, a second substrate, an electronic component, a housing, and a protruding portion. The first substrate has a first face and a second face and is provided with an opening. The second substrate has a third face configured to face the second face and a fourth face and is configured to be electrically connected to the first substrate. The electronic component is configured to be mounted on the third face and is configured to be disposed at a position overlapping the opening in a direction in which the third face faces. The housing is configured to accommodate the first and second substrates. The protruding portion is provided in the housing and is configured to pass through the opening and be thermally connected to the electronic component.Type: ApplicationFiled: July 7, 2015Publication date: September 15, 2016Inventors: Yoshiharu Matsuda, Kazuhiro Yoshida, Kenichi Sawanaka
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Patent number: 8730622Abstract: According to one embodiment, a disk drive includes a case including a base with a bottom wall, a drive motor on the bottom wall of the base, a plurality of disk recording mediums rotatable by the drive motor, a magnetic head configured to perform data processing on the recording mediums, a carriage on the bottom wall of the base, configured to support the magnetic head for movement relative to the recording mediums, a drive section including a yoke and a magnet on the bottom wall of the base and configured to drive the carriage, and a spoiler including a main body, which includes a magnetic shield member between the yoke and the recording mediums, and a baffle plate extending from the main body and between the adjacent disk recording mediums.Type: GrantFiled: July 17, 2012Date of Patent: May 20, 2014Assignee: Kabushiki Kaisha ToshibaInventor: Kenichi Sawanaka
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Publication number: 20130188280Abstract: According to one embodiment, a disk drive includes a case including a base with a bottom wall, a drive motor on the bottom wall of the base, a plurality of disk recording mediums rotatable by the drive motor, a magnetic head configured to perform data processing on the recording mediums, a carriage on the bottom wall of the base, configured to support the magnetic head for movement relative to the recording mediums, a drive section including a yoke and a magnet on the bottom wall of the base and configured to drive the carriage, and a spoiler including a main body, which includes a magnetic shield member between the yoke and the recording mediums, and a baffle plate extending from the main body and between the adjacent disk recording mediums.Type: ApplicationFiled: July 17, 2012Publication date: July 25, 2013Applicant: KABUSHIKI KAISHA TOSHIBAInventor: Kenichi SAWANAKA