Patents by Inventor Kenichi Shimada

Kenichi Shimada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120103680
    Abstract: A multilayer printed wiring board includes a multilayered structure having conductor circuit layers and interlaminar insulative layers, the interlaminar insulative layers including an outermost interlaminar insulative layer, the conductor circuit layers including an outermost conductor circuit layer formed over the outermost interlaminar insulative, a filled-viahole formed in the outermost interlaminar insulative layer and having one or more metal plating fillings and completely closing a hole formed through the outermost interlaminar insulative layer such that the metal plating of the filled-viahole extends out of the hole and forms a substantially flat surface, and solder bumps including a first solder bump formed on the substantially flat surface of the filled-viahole and a second solder bump formed on a surface portion in the outermost conductor circuit layer.
    Type: Application
    Filed: January 12, 2012
    Publication date: May 3, 2012
    Applicant: IBIDEN CO., LTD.
    Inventors: Seiji SHIRAI, Kenichi SHIMADA, Motoo ASAI
  • Publication number: 20120050831
    Abstract: In a holographic memory of an angle multiple recording system, when a hologram is reproduced, a light beam of a different polarizing direction is irradiated as reference light to a hologram recording medium and diffracted light is detected from the hologram recording medium.
    Type: Application
    Filed: April 13, 2011
    Publication date: March 1, 2012
    Inventors: Kenichi SHIMADA, Toshiki ISHII, Motoyuki SUZUKI
  • Patent number: 8115111
    Abstract: A multilayer printed wiring board includes a multilayered structure having conductor circuit layers and interlaminar insulative layers, the interlaminar insulative layers including an outermost interlaminar insulative layer, the conductor circuit layers including an outermost conductor circuit layer formed over the outermost interlaminar insulative, a filled-viahole formed in the outermost interlaminar insulative layer and having one or more metal plating fillings and completely closing a hole formed through the outermost interlaminar insulative layer such that the metal plating of the filled-viahole extends out of the hole and forms a substantially flat surface, and solder bumps including a first solder bump formed on the substantially flat surface of the filled-viahole and a second solder bump formed on a surface portion in the outermost conductor circuit layer.
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: February 14, 2012
    Assignee: Ibiden Co., Ltd.
    Inventors: Seiji Shirai, Kenichi Shimada, Motoo Asai
  • Publication number: 20120026856
    Abstract: A holographic memory apparatus comprises first phase modulation means that adds phase information to each pixel of a signal beam to generate page data at recording time; oscillator light generation means that generates an oscillator light that is superimposed on, and interferes with, a diffracted light from a holographic recording medium at reproduction time; second phase modulation means that adds phase information to the oscillator light; and light detection means that detects an interference light generated by superimposing the oscillator light and the diffracted light from the holographic recording medium.
    Type: Application
    Filed: April 19, 2011
    Publication date: February 2, 2012
    Inventors: Kenichi Shimada, Toshiki Ishii, Taku Hoshizawa, Motoyuki Suzuki
  • Patent number: 8093507
    Abstract: A multilayer printed circuit board including a substrate board having a lower conductor circuit, a resin insulating layer formed over the substrate board and lower conductor circuit, and a conductor circuit formed over the resin insulating layer. The resin insulating layer has a via hole filled up with plating and is formed of a linear polyolefin resin formed by hot-pressing a film shaped resin.
    Type: Grant
    Filed: April 8, 2009
    Date of Patent: January 10, 2012
    Assignee: Ibiden Co., Ltd.
    Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
  • Patent number: 8085643
    Abstract: In holographic recording by the angle multiplexing method, in order to allow a signal beam and a reference beam to sufficiently overlap with each other in a storage medium to decrease as much as possible a wastefully exposed region, which does not contribute to a signal recording, an optical pickup apparatus having a function which can control, for example, a size or a position of an aperture of the reference beam is used. An optical information reproducing apparatus or an optical information recording and reproducing apparatus using the optical pickup apparatus is used.
    Type: Grant
    Filed: November 4, 2009
    Date of Patent: December 27, 2011
    Assignee: Hitachi Consumer Electronics Co., Ltd.
    Inventor: Kenichi Shimada
  • Publication number: 20110280112
    Abstract: In an optical information reproduction method for reproducing information using holography from a medium which records an interference pattern generated when overlapping a signal beam and a reference beam, the reference beam is radiated to the medium at a reference beam angle with a predetermined range for reproducing the information, a reproduction beam is generated by diffracting the reference beam with the interference pattern, the reproduction beam is detected by a photodetector; and the information is reproduced by processing a signal detected by the photodetector.
    Type: Application
    Filed: April 18, 2011
    Publication date: November 17, 2011
    Inventors: Yusuke NAKAMURA, Kenichi Shimada, Toshiki Ishii, Makoto Hosaka
  • Publication number: 20110273754
    Abstract: An optical beam with the same amplitude distribution and phase distribution as those of the signal beam used for recording is radiated to the hologram recording medium via an optical system of the signal beam prior to reproduction so that the optical beam with the amplitude and phase of the reference beam upon recording is generated through diffraction. A wavefront sensor detects the wavefront configuration of the diffraction beam and obtains preliminarily the suitable wavefront of the reference beam for reproduction. The wavefront control element preliminarily corrects the wavefront of the reference beam to an optimum wavefront.
    Type: Application
    Filed: April 26, 2011
    Publication date: November 10, 2011
    Inventors: Kenichi SHIMADA, Toshiki Ishii
  • Publication number: 20110261671
    Abstract: In case of reproducing a hologram recorded on an optical information recording medium, adjusting beam with the amplitude distribution and phase distribution at least partially the same as those of a signal beam upon recording is radiated to the optical information recording medium which records information. The diffracting beam diffracted by the hologram is detected by a photodetector. Based on the detected information, an incident angle of the reference beam to the optical information recording medium is appropriately controlled.
    Type: Application
    Filed: April 14, 2011
    Publication date: October 27, 2011
    Inventors: Toshiki ISHII, Kenichi Shimada, Yusuke Nakamura
  • Patent number: 8030577
    Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
    Type: Grant
    Filed: June 25, 2008
    Date of Patent: October 4, 2011
    Assignee: Ibiden Co., Ltd.
    Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
  • Patent number: 8020291
    Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
    Type: Grant
    Filed: June 25, 2008
    Date of Patent: September 20, 2011
    Assignee: Ibiden Co., Ltd.
    Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
  • Patent number: 8018045
    Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
    Type: Grant
    Filed: June 25, 2008
    Date of Patent: September 13, 2011
    Assignee: Ibiden Co., Ltd.
    Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
  • Patent number: 8006377
    Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
    Type: Grant
    Filed: June 25, 2008
    Date of Patent: August 30, 2011
    Assignee: Ibiden Co., Ltd.
    Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
  • Patent number: 8004950
    Abstract: An optical pickup for recording a hologram by using an angle multiplexing method. An optical beam is separated into two beams, a signal beam and a reference beam having different convergence/divergence degrees, by using an optical component such as a diffraction lens. The signal and reference beams are made incident upon the same objective, and the optical component or the objective lens is moved in a direction perpendicular to an optical axis, to thereby realize angle multiplex recording. If an optical information recording medium is inclined, the optical component or the objective lens is moved along the direction along which the optical information recording medium moved to change an angle of the reference beam incident upon the optical information recording medium and compensate for degradation of a reproduction signal.
    Type: Grant
    Filed: February 27, 2008
    Date of Patent: August 23, 2011
    Assignees: Hitachi, Ltd., InPhase Technologies Inc.
    Inventors: Tatsuro Ide, Kenichi Shimada, Masahiko Takahashi, Takeshi Shimano, Kevin R. Curtis, Ken E. Anderson
  • Patent number: 7994433
    Abstract: A multilayer printed circuit board including a substrate board and a built-up structure formed over the substrate board. The built-up structure includes conductor circuits and resin insulating layers. The built-up structure has via holes interconnecting the conductor circuits through one or more resin insulating layers. The via holes are filled up with plating, and the resin insulating layers is formed of a cycloolefin resin.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: August 9, 2011
    Assignee: Ibiden Co., Ltd.
    Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
  • Patent number: 7990830
    Abstract: In holographic recording, it is important to form stably an interference fringe between a reference beam and a signal beam in a holographic storage medium. To suppress factors degrading stability of the interference fringe, such as fluctuation of atmospheric air, position displacement of optical components and the like during propagation of the reference and signal beams, an optical pickup and an optical information recording/reproducing apparatus adopt an optical system structure providing a higher proportion of optical components shared by the reference and signal beams optical path than conventional optical system structure. To increase the proportion of shared optical components, the signal beam and the reference beam pass through the PBS prism as parallel beams and a concave lens is placed on a reference beam path just before the objective lens.
    Type: Grant
    Filed: February 27, 2008
    Date of Patent: August 2, 2011
    Assignees: Hitachi, Ltd., InPhase Technologies Inc.
    Inventors: Kenichi Shimada, Tatsuro Ide, Kevin R. Curtis, Ken E. Anderson
  • Patent number: 7916492
    Abstract: The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains an inorganic filler.
    Type: Grant
    Filed: July 28, 2000
    Date of Patent: March 29, 2011
    Assignee: Ibiden Co., Ltd.
    Inventors: Hui Zhong, Kenichi Shimada, Yukihiko Toyoda, Motoo Asai, Dongdong Wang, Koji Sekine, Yoshitaka Ono
  • Patent number: 7910836
    Abstract: The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains an inorganic filler.
    Type: Grant
    Filed: August 14, 2007
    Date of Patent: March 22, 2011
    Assignee: Ibiden Co. Ltd.
    Inventors: Hui Zhong, Kenichi Shimada, Yukihiko Toyoda, Motoo Asai, Dongdong Wang, Koji Sekine, Yoshitaka Ono
  • Publication number: 20100271921
    Abstract: A holographic recording medium in which information can be reproduced by phase conjugate beam without requiring a mirror for obtaining the phase conjugate beam and its driving part and recording density is not reduced. The recording medium includes a recording layer in which an interference pattern is recorded and a light absorption/transmission layer which can be reversibly changed to be in a first state where signal beam and reference beam passed through the recording layer are absorbed at the time of recording of information and a second state where the reference beam is transmitted at the time of reproduction of information, and the reference beam transmitted through the light absorption/transmission layer is reflected by a reflection layer to produce the phase conjugate beam.
    Type: Application
    Filed: August 6, 2008
    Publication date: October 28, 2010
    Inventors: Kenichi Shimada, Tatsuro Ide, Takeshi Shimano, Harukazu Miyamoto
  • Patent number: 7817705
    Abstract: The hologram recording technology expected to realize ultrahigh-density information recording is one of the post Blu-ray Disc technology. When we think about developing a drive based on this technology and suitable for consumer electronics, it is considered most desirable from the viewpoint of upward compatibility to solve the problem of the BD-compatibility. The problem in sharing the laser light source between the hologram recording device and the current optical disc device, however, is that the hologram recording requires a high-coherent, single-mode light beam, while the current optical discs requires a low-coherent, multi-mode light beam. In point of the coherence of the light source, the above two cases require the light beams of the characteristics opposite to each other, and this presents an important task.
    Type: Grant
    Filed: March 6, 2008
    Date of Patent: October 19, 2010
    Assignee: Hitachi, Ltd.
    Inventors: Kenichi Shimada, Tatsuro Ide