Abstract: One each wide main groove is disposed on each side of a tire equator on a tread surface, the area interposed between these right and left two main grooves is used as ribs, two kinds of large and small sub-grooves having mutually different groove widths and extending from the main grooves to a ground contact end in a tire width-wise direction are disposed alternately in both outside areas of the main grooves throughout one circumference of a tire, and sub-main grooves extending in the tire circumferential direction are disposed between the main grooves and the ground contact end in the tire width-wise direction.

Abstract: A pneumatic tire in which sub-grooves extending at least in the widthwise direction of the tire are provided in a center portion of a tread surface and shoulder portions thereof on both sides of the center portion at a predetermined pitch, both the width and depth of the sub-grooves in the two shoulder portions being set larger than those of the sub-grooves in the center portion, a ratio of the area of the sub-grooves in the two shoulder portions to that of the tread surface being set larger than a ratio of the area of the sub-grooves in the center portion to that of the tread surface. This tire can be used with the air pressure therein set higher under the on-road travelling condition, and lower under the off-road travelling condition.

Abstract: A semiconductor device having a moisture barrier comprises a semiconductor substrate, a plurality of bonding pads arranged along at least one side of the semiconductor substrate, and an insulating film provided between at least one side of the semiconductor substrate and the bonding pads opposite to that side, and provided with means for preventing incursion of moisture, thereby to prevent moisture from being absorbed from the chip side surface. Further, there is also disclosed a method of manufacturing such a semiconductor device, which comprises the steps of forming an insulating film on a semiconductor wafer, forming a plurality of bonding pads arranged along dicing lines of the semiconductor wafer, and forming a contact hole or a via hole in the insulating film, and forming at the same time, a groove structure so that it is arranged between the dicing lines and the plurality of bonding pads.

Abstract: A method of manufacturing wiring layers of semiconductor devices in which a base layer made of electroconductive material is formed on a wiring-intended area of the substrate surface and an insulating layer is formed on the area other than the wiring intended area. Then the wiring layer is grown on the base layer up to substantially the same level as that of the insulating layer up, hereby planarity of the surfaces of the device is maintained after wiring formation.

Abstract: A pneumatic tire having a tread pattern formed on a tread surface and comprising a plurality of main grooves extending in the center region of the tread surface towards the circumferential direction of the tire and a plurality of subgrooves extending so as to cross the plurality of main grooves, wherein the percentage groove area of the whole grooves including said main grooves and said subgrooves relative to the area of the whole tread surface is 20 to 30% and the number of pitches at which the circumferential direction of the tire is divided by the plurality of subgrooves is 30 to 45. The pneumatic tire is characterized in that the subgrooves each have a groove portion bent in a wedge form in shoulder regions respectively located outside the outermost main grooves.