Abstract: A magnetic sensor is constituted using magnetic sensor chips mounted on stages supported by interconnecting members and a frame having leads in a lead frame. Herein, the stages are inclined upon plastic deformation of the interconnecting members. When the frame is held in a metal mold and the stages are pressed, the interconnecting members are elastically deformed, so that the magnetic sensor chips are bonded onto the stages placed substantially in the same plane and are then wired with the leads. Thereafter, the stages are released from pressure, so that the interconnecting members are restored from the elastically deformed states thereof. When the magnetic sensor chips are combined together to realize three sensing directions, it is possible to accurately measure three-dimensional bearings of magnetism, and the magnetic sensor can be reduced in dimensions and manufactured with a reduced cost thereof.

Abstract: A lead frame has a die stage for mounting a semiconductor chip whose electrodes are electrically connected with leads via bonding wires, wherein they are enclosed in a molded resin, thus producing a semiconductor device. The outline of the die stage is shaped so as to be smaller than the outline of the semiconductor chip, and a plurality of cutouts are formed in the peripheral portion of the die stage so as to reduce the overall area of the die stage and to enhance the adhesion between the die stage and molded resin. The length L2 of each cutout ranges from (L1×0.05) to (L1×0.20) where L1 denotes the length of each side of the die stage, and the overall area S2 of the die stage ranges from (S1×0.10) to (S1×0.40) where S1 denotes the overall area of the semiconductor chip.

Abstract: A physical quantity sensor is constituted using a lead frame having at least one stage and a plurality of leads whose bases are arranged in the same plane, wherein at least one physical quantity sensor chip having a plurality of electrode pads is mounted on the stage and is inclined so that the electrode pads are disposed in the inclination direction and are connected to the leads by use of wires whose lengths substantially match distances between the electrode pads and leads. This prevents the leads and wires from being unexpectedly broken, and it is possible to avoid the occurrence of separation of the leads from the physical quantity sensor chip. In addition, the tip ends of the leads are disposed along the surface of the inclined stage before wire bonding; hence, it is possible to easily connect the tip ends of the leads to the physical quantity sensor chip.

Abstract: A lead frame includes a frame body defining an internal region, a plurality of leads extending from the frame body, and first and second stages that are disposed in the internal region. The first and second stages are sloped and are parallel to a first line along which a primary stream of a molten resin runs, so that slope angles of the stages are not substantially changed by the injection of the molten resin into the cavity.

Abstract: A lead frame made from a metallic thin plate, comprising: at least two stage portions on which a physical quantity sensor chip is mounted, and which have an area smaller than a mounting surface of the physical quantity sensor chip; a rectangular frame portion which encloses the stage portions; a plurality of leads including connecting leads which extend in a direction of the stage portion from the frame portion and are positioned on the periphery of the stage portion, and which connect the frame portion and each of the stage portions; and an easily deformed portion formed on the connecting leads which inclines the stage portion by becoming deformed; and the physical quantity sensor chip is mounted by superimposing the mounting surface on the stage portion and a portion of the plurality of leads in the direction of thickness of the frame portion.

Abstract: A method for manufacturing a physical quantity sensor includes the steps of: preparing a lead frame comprising a rectangular frame portion, a plurality of leads protruding out from this rectangular frame portion in the inward direction, and a stage portion that is connected to the rectangular frame portion by connecting leads; fixing a physical quantity sensor chip to the stage portion; inclining the stage portion and the physical quantity sensor chip with respect to the rectangular frame portion; and integrating the inclined physical quantity sensor chip and the leads within a metallic mold using a resin.

Abstract: A physical quantity sensor includes a pair of physical quantity sensor chips that are inclined with respect to the bottom of an exterior mold package whose side surfaces are each inclined in a thickness direction by an angle ranging from 0° to 5° and are formed in proximity to the outer ends of the physical quantity sensor chips. It is possible to realize the inclination of stages without using molds, wherein absorption devices are used to absorb prescribed portions related to stages, which rotate about axial lines and are thus inclined with respect to a prescribed base. In manufacturing, a thin metal plate having a plurality of lead frames is placed on a base delimited by a clamp; then, intersecting points of intermediate portions formed between the lead frames are subjected to pressing so as to realize the inclination of stages.

Abstract: A semiconductor device is equipped with a semiconductor sensor chip for detecting pressure variations that is arranged inside of a hollow cavity of a housing, wherein an opening is formed in a prescribed region of the housing, which is not positioned opposite to the semiconductor sensor chip, so as to allow the hollow cavity to communicate with an external space. The opening is formed using at least one through-hole having a thin slit-like shape. Alternatively, the opening is formed using plural through-holes each having a desired shape such as a thin slit-like shape, a circular shape, and a sectorial shape. Thus, it is possible to reduce negative influences due to environmental factors such as dust and sunlight with respect to the semiconductor sensor chip.

Abstract: A lead frame including a shield plate, a main frame, interconnection arms, support arms, and terminals is sealed with a resin mold including a base portion for embedding the shield plate and a peripheral wall for embedding the interconnection arms and support arms, thus forming a package base. The interconnection arms and support arms are subjected to bending so as to depress the shield plate in position compared with the main frame. At least one semiconductor chip (e.g. a microphone chip) is mounted on the base portion just above the shield plate. A cover having conductivity is attached onto the main frame exposed on the upper end of the peripheral wall, thus completely producing a semiconductor device encapsulated in a package. A sound hole is formed in the cover or the package base so as to allow the internal space of the package to communicate with the external space.

Abstract: A physical quantity sensor includes a pair of physical quantity sensor chips that are inclined with respect to the bottom of an exterior mold package whose side surfaces are each inclined in a thickness direction by an angle ranging from 0° to 5° and are formed in proximity to the outer ends of the physical quantity sensor chips. It is possible to realize the inclination of stages without using molds, wherein absorption devices are used to absorb prescribed portions related to stages, which rotate about axial lines and are thus inclined with respect to a prescribed base. In manufacturing, a thin metal plate having a plurality of lead frames is placed on a base delimited by a clamp; then, intersecting points of intermediate portions formed between the lead frames are subjected to pressing so as to realize the inclination of stages.

Abstract: A microphone package is constituted of a cover and a mold substrate that is formed in accordance with the resin mold technology so as to form a cavity for embracing a microphone chip. The mold substrate is constituted of a stage having conductivity and a rectangular shape for mounting a microphone chip thereon, a plurality of lead terminals having conductivity and electrically connected to the microphone chip, and a resin mold for electrically insulating the stage from the lead terminals. A sound hole is formed in the mold substrate by use of a cylindrical projection which projects from the backside of the stage and whose distal surface is exposed from the backside of the mold substrate. When the microphone package is mounted on the mounting surface of an external substrate, it is possible to prevent sound from being leaked via gaps therebetween.

Abstract: A semiconductor package encapsulating a semiconductor chip provides inner leads and outer leads for establishing electrical connections with the substrate. Herein, a lead frame is set into the metal mold, into which a resin is injected and which is clamped in proximity to the outer leads. Thus, the semiconductor package is sealed so as to avoid unwanted formation of resin burrs around lower surfaces of the inner leads. In addition, a semiconductor device is produced using a package in which a semiconductor chip mounted on a stage and terminals are embedded within a resin. Each terminal provides an electrode surface, an interconnecting portion, and an exposed terminal surface. Herein, an isolation portion is formed as an integral part of the package made by the resin and is arranged in the prescribed area between the electrode surface and the exposed terminal surface.

Abstract: To provide a semiconductor package mounting method, with excellent work efficiency, wherein the direction of a semiconductor package can be verified by a simple method before mounting. One corner of a square shaped display section provided on the surface of a semiconductor package body is chamfered such that the chamfer dimensions are different from those of the other corners. If image recognition by a camera determines that this chamfered part is located correctly, the orientation of a semiconductor package is determined to be correct. On the other hand, if image recognition determines that it is not located correctly, the orientation of the semiconductor package is adjusted until it is correct.

Abstract: A magnetic sensor is constituted using magnetic sensor chips mounted on stages supported by interconnecting members and a frame having leads in a lead frame. Herein, the stages are inclined upon plastic deformation of the interconnecting members. When the frame is held in a metal mold and the stages are pressed, the interconnecting members are elastically deformed, so that the magnetic sensor chips are bonded onto the stages placed substantially in the same plane and are then wired with the leads. Thereafter, the stages are released from pressure, so that the interconnecting members are restored from the elastically deformed states thereof. When the magnetic sensor chips are combined together to realize three sensing directions, it is possible to accurately measure three-dimensional bearings of magnetism, and the magnetic sensor can be reduced in dimensions and manufactured with a reduced cost therefore.

Abstract: A sensor includes a plurality of leads that have bottom surfaces extending in a first plane, a stage that extends in a second plane that tilts from the first plane, a sensor chip that is supported on the stage, a modified connection lead structure that supports the stage, and at least one projecting part extending from the stage in a first direction that tilts from the first and second planes. The at least one projecting part has a top portion that is higher in level than the bottom surfaces.

Abstract: A semiconductor device is constituted of a mold sheet for mounting a sensor chip and a cover having a box-like shape, both of which are combined together so as to form a cavity therebetween. The mold sheet includes a stage having a rectangular shape in a plan view, a plurality of cutouts formed in the periphery of the stage, and a plurality of lead terminals arranged inside of the cutouts. The lead terminals include a plurality of connection portions electrically connected to the sensor chip and a plurality of support leads which are externally extended from the periphery of the stage. The stage and the lead terminals are sealed with a mold resin, by which they are electrically insulated from each other. The recesses of the support leads are sealed with the insulating resin mold relative to the surface of the mold sheet so as to mount the opening end of the cover.

Abstract: A magnetic sensor is constituted using magnetic sensor chips mounted on stages supported by interconnecting members and a frame having leads in a lead frame. Herein, the stages are inclined upon plastic deformation of the interconnecting members. When the frame is held in a metal mold and the stages are pressed, the interconnecting members are elastically deformed, so that the magnetic sensor chips are bonded onto the stages placed substantially in the same plane and are then wired with the leads. Thereafter, the stages are released from pressure, so that the interconnecting members are restored from the elastically deformed states thereof. When the magnetic sensor chips are combined together to realize three sensing directions, it is possible to accurately measure three-dimensional bearings of magnetism, and the magnetic sensor can be reduced in dimensions and manufactured with a reduced cost therefor.

Abstract: A microphone package includes a sound detection unit, which further includes a microphone chip for detecting sound and a control circuit for controlling the microphone chip, a substrate having a mount surface for mounting the microphone chip and the control circuit and a ring-shaped side wall, which projects upwardly from the mount surface so as to surround the sound detection unit, and a cover that is arranged above the substrate so as to form a hollow cavity with the mount surface and the ring-shaped side wall of the substrate. A sound hole establishing communication between the cavity and the external space is formed in a prescribed position of the substrate or the cover, wherein a recess or a projection is formed inside of the cover. A directional regulator is formed in the housing so as to block excessive pressure variations and environmental factors from being directed to the microphone chip.

Abstract: A semiconductor device is equipped with a semiconductor sensor chip for detecting pressure variations that is arranged inside of a hollow cavity of a housing, wherein an opening is formed in a prescribed region of the housing, which is not positioned opposite to the semiconductor sensor chip, so as to allow the hollow cavity to communicate with an external space. The opening is formed using at least one through-hole having a thin slit-like shape. Alternatively, the opening is formed using plural through-holes each having a desired shape such as a thin slit-like shape, a circular shape, and a sectorial shape. Thus, it is possible to reduce negative influences due to environmental factors such as dust and sunlight with respect to the semiconductor sensor chip.

Abstract: A semiconductor device includes two semiconductor chips having different guarantee temperatures, which are individually mounted on two stages distanced from each other and are sealed with a resin mold. One semiconductor chip includes a heating circuit causing a heating temperature that is higher than the guarantee temperature of another semiconductor chip, and the backside of the stage thereof is exposed externally of the resin mold. This reduces the amount of heat transmitted from one semiconductor chip to another semiconductor chip, thus improving the reliability of the semiconductor device. Alternatively, two semiconductor chips having different heights are mounted on a single stage, wherein one semiconductor chip causing a high heating temperature is lowered in height in comparison with another semiconductor chip, thus increasing the heat-transmission path between the semiconductor chips and thus reducing the heat-dissipation path for dissipating heat of one semiconductor chip to a substrate.