Patents by Inventor Kenichi Soeda

Kenichi Soeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100112746
    Abstract: A housing assembly method for bonding through causing a first member and a second member, which form a tightly sealed housing that contains a sensing element, to be mutually abutting. A first resin material through which a laser beam passes is used as the first member and a second resin material that absorbs the laser beam is used as the member of the second piece. With the bonding surfaces of these members abutting each other, a laser beam having a diameter that is smaller than the width of the bonding surfaces is directed towards the bonding surfaces from the member of the first piece side to weld the bonding surfaces together while leaving non-welded portions between the abutting bonding surfaces.
    Type: Application
    Filed: November 5, 2009
    Publication date: May 6, 2010
    Applicant: YAMATAKE CORPORATION
    Inventors: Hisashi Suzuki, Kenichi Soeda, Hideyuki Aizawa