Abstract: An irradiation apparatus attached to a rotary gantry includes a middle housing unit and a lower housing unit. Touch sensor apparatuses are attached to a middle housing unit, and touch sensor apparatuses are attached to a lower housing unit. The touch sensor apparatus includes a cover, a pair of cover support apparatuses for attaching the cover to a support member of the middle housing unit, and a sensor unit attached to each cover support apparatus. When the cover comes into contact with a bed and moves toward the support member during rotation of the irradiation apparatus, a link such as a cover support apparatus activates the sensor unit, and a contact signal is output. The touch sensor apparatuses also function in the same manner.

Abstract: A decoding device includes: a data obtaining unit configured to obtain a key block and a non-key brock, the key block forming a part of image data of one frame, and the non-key block forming a part of the image data of one frame on at least a part of which a coding process is performed; a characteristic information storage unit configured to store characteristic information regarding a pixel value correlation characteristic in a frame; and a decoding unit configured to perform repeated decoding by a belief-propagation method based on a first log-likelihood ratio and a second log-likelihood ratio to estimate the non-key block before the coding process, the first log-likelihood being obtained from the non-key block, and the second log-likelihood ratio being obtained from the key block and the characteristic information.

Abstract: The present invention provides a material for a molded resin as a material for a semiconductor light-emitting device that can yield a highly durable (light resistance and heat resistance) molded resin and can also improve the LED output through an excellent reflectivity. The present invention also provides an easily moldable material for a molded resin for a semiconductor light-emitting device. The material for a molded resin for a semiconductor light-emitting device is a resin composition, comprising (A) a polyorganosiloxane, (B) a white pigment, and (C) a curing catalyst, wherein the white pigment (B) has the following characteristics (a) and (b): (a) an aspect ratio 1.2 or more and 4.0 or less, and (b) a primary particle diameter 0.1 ?m or more and 2.0 ?m or less.

Abstract: The present invention provides a material for a molded resin as a material for a semiconductor light-emitting device that can yield a highly durable (light resistance and heat resistance) molded resin and can also improve the LED output through an excellent reflectivity. The present invention also provides an easily moldable material for a molded resin for a semiconductor light-emitting device. The material for a molded resin for a semiconductor light-emitting device is a resin composition, comprising (A) a polyorganosiloxane, (B) a white pigment, and (C) a curing catalyst, wherein the white pigment (B) has the following characteristics (a) and (b): (a) an aspect ratio 1.2 or more and 4.0 or less, and (b) a primary particle diameter 0.1 ?m or more and 2.0 ?m or less.

Abstract: The present invention provides a curable polysiloxane composition which is excellent in light resistance (particularly ultraviolet resistance) and adhesion and has a sufficient heat resistance/hydrothermal resistance and film-forming property and which generates little foaming at curing and does not generate cracks, peeling, coloring, and foaming even when used for a long period of time. A curable polysiloxane composition which comprises a specific hydrosilyl group-containing polysiloxane compound, a specific polysiloxane compound comprising two or more silanol groups in one molecule, and a dehydrogenative condensation reaction catalyst.

Abstract: The present invention provides a material for a molded resin as a material for a semiconductor light-emitting device that can yield a highly durable (light resistance and heat resistance) molded resin and can also improve the LED output through an excellent reflectivity. The present invention also provides an easily moldable material for a molded resin for a semiconductor light-emitting device. The material for a molded resin for a semiconductor light-emitting device is a resin composition comprising (A) a polyorganosiloxane, (B) a white pigment, and (C) a curing catalyst, wherein the white pigment (B) has the following characteristics (a) and (b); (a) an aspect ratio 1.2 or more and 4.0 or less, and (b) a primary particle diameter 0.1 ?m or more and 2.0 ?m or less.

Abstract: A medium position detection device including: a medium moving space (10) formed in which a plurality of media (30) can simultaneously move without overlapping in a predetermined direction; a light-guiding plate (11) which perpendicularly intersects the predetermined direction and defines the front of the medium moving space (10); a light source (20) disposed to emit light entering an end surface of the light-guiding plate (11); a reflecting section (13) formed in the light-guiding plate (11) so that the light having entered the light-guiding plate (11) is reflected by the reflecting section (13) and exits the light-guiding plate (11) through a back surface of the light-guiding plate (11); and detection means which detects the light from the light-guiding plate (11).

Abstract: A semiconductor device comprising curable polyorganosiloxane composites is provided where the composites contain at least 0.1 wt % of the 4th and/or 13th group elements of the periodic table. The cured polyorganosiloxane composites may be catalyst-free, have increased stability, and can be used as encapsulation resin at a temperature far lower than 300° C., have excellent light transmission properties (colorless transparency) in a wavelength region of from ultraviolet light to visible light, light resistance, heat resistance, resistance to moist heat and UV resistance, and has excellent adhesiveness toward metal, ceramics, and plastic surfaces over a long period of time.

Abstract: A semiconductor light emitting device comprising curable polyorganosiloxane compositions is provided where the compositions contain a 13th group elements of the periodic table. The cured polyorganosiloxane compositions may be catalyst-free, have increased stability, and can be used as encapsulation resin at a temperature far lower than 300° C., have excellent light transmission properties (colorless transparency) in a wavelength region of from ultraviolet light to visible light, light resistance heat resistance, resistance to moist heat and UV resistance, and has excellent adhesiveness toward metal, ceramics, and plastic surfaces over a long period of time.

Abstract: Curable polyorganosiloxanes are provided that cure in the absence of a hydrosilylation catalyst. The cured polyorganosiloxanes have increased stability and can be used as encapsulation resin is at a temperature far lower than 300° C., have excellent light transmission properties (colorless transparency. in a wavelength region of from ultraviolet light to visible light, light resistance, heat resistance, resistance to moist heat and UV resistance, and do not generate cracks and peeling even in use over a long period of time.

Abstract: The present invention provides a curable polysiloxane composition which is excellent in light resistance (particularly ultraviolet resistance) and adhesion and has a sufficient heat resistance/hydrothermal resistance and film-forming property and which generates little foaming at curing and does not generate cracks, peeling, coloring, and foaming even when used for a long period of time. A curable polysiloxane composition which comprises a specific hydrosilyl group-containing polysiloxane compound, a specific polysiloxane compound comprising two or more silanol groups in one molecule, and a dehydrogenative condensation reaction catalyst.

Abstract: A semiconductor device comprising curable polyorganosiloxane composites is provided where the composites contain at least 0.1 wt % of the 4th and/or 13th group elements of the periodic table. The cured polyorganosiloxane composites may be catalyst-free, have increased stability, and can be used as encapsulation resin at a temperature far lower than 300° C., have excellent light transmission properties (colorless transparency) in a wavelength region of from ultraviolet light to visible light, light resistance, heat resistance, resistance to moist heat and UV resistance, and has excellent adhesiveness toward metal, ceramics, and plastic surfaces over a long period of time.

Abstract: A process is provided for producing curable polyorganosiloxanes where noble metal oxides are used as hydrosilylation catalysts. The noble metals can be used in solid granular form or as part of a fixed bed, and do not form part of the final curable composition or cured product. The cured polyorganosiloxanes have increased stability and can be used as encapsulation resins at a temperature far lower than 300° C., have excellent light transmission properties (colorless transparency) in a wavelength region of from ultraviolet light to visible light, light resistance, heat resistance, resistance to moist heat and UV resistance, and do not generate cracks and peeling even in use over a long period of time.

Abstract: Curable polyorganosiloxanes are provided that cure in the absence of a hydrosilylation catalyst. The cured polyorganosiloxanes have increased stability and can be used as encapsulation resin is at a temperature far lower than 300° C., have excellent light transmission properties (colorless transparency) in a wavelength region of from ultraviolet light to visible light, light resistance, heat resistance, resistance to moist heat and UV resistance, and do not generate cracks and peeling even in use over a long period of time.

Abstract: A process is provided for producing curable polyorganosiloxanes where noble metal oxides are used as hydrosilylation catalysts. The noble metals can be used in solid granular form or as part of a fixed bed, and do not form part of the final curable composition or cured product. The cured polyorganosiloxanes have increased stability and can be used as encapsulation resins at a temperature far lower than 300° C., have excellent light transmission properties (colorless transparency) in a wavelength region of from ultraviolet light to visible light, light resistance, heat resistance, resistance to moist heat and UV resistance, and do not generate cracks and peeling even in use over a long period of time.

Abstract: Disclosed is a distance measuring system comprising a transmitter that sequentially generates pulse sequences each having a plurality of pulse signals of equal amplitudes arranged at equi-time intervals, and transmits the generated pulse sequence as a radio wave; and a receiver that receives the pulse sequence transmitted from the transmitter as a radio wave, and has a distance calculator that acquires propagation times of the pulse signals in the received pulse sequence, and calculates a distance from the transmitter by giving different weightings to the pulse signals for the propagation times acquired for the respective pulse signals. As the amplitudes of the pulse signals in the received pulse sequence become larger, the weightings are made larger.

Abstract: This invention has as its object to implement the constitution of a receiver that receives signals sent by performing multi-valued pulse modulation and performs iterative decoding. The constitution includes: (1) a bank of pulse correlators that achieves correlation with all predetermined sent pulse waveforms, (2) a pulse demapper that calculates the log likelihood ratio for each bit of the interleaved code word from said pulse correlator outputs and a priori information for each bit, (3) a deinterleaver that performs deinterleaving on the output from said pulse demapper, (4) a decoder that calculates likelihood information for the deinterleaved code word bits and information bits, respectively, (5) an interleaver that interleaves the output of the decoder in the same manner as on the sending side, and (6) a feedback circuit that provides feedback of the output of said interleaver as a priori probability to the pulse demapper.

Abstract: A medium position detection device including: a medium moving space (10) formed in which a plurality of media (30) can simultaneously move without overlapping in a predetermined direction; a light-guiding plate (11) which perpendicularly intersects the predetermined direction and defines the front of the medium moving space (10); a light source (20) disposed to emit light entering an end surface of the light-guiding plate (11); a reflecting section (13) formed in the light-guiding plate (11) so that the light having entered the light-guiding plate (11) is reflected by the reflecting section (13) and exits the light-guiding plate (11) through a back surface of the light-guiding plate (11); and detection means which detects the light from the light-guiding plate (11).

Abstract: Disclosed is a distance measuring system comprising a transmitter that sequentially generates pulse sequences each having a plurality of pulse signals of equal amplitudes arranged at equi-time intervals, and transmits the generated pulse sequence as a radio wave; and a receiver that receives the pulse sequence transmitted from the transmitter as a radio wave, and has a distance calculator that acquires propagation times of the pulse signals in the received pulse sequence, and calculates a distance from the transmitter by giving different weightings to the pulse signals for the propagation times acquired for the respective pulse signals. As the amplitudes of the pulse signals in the received pulse sequence become larger, the weightings are made larger.

Abstract: In a steerage locking system for a vehicle, including a control knob mounted to a rotor capable of being turned from a LOCK position via an ACC position and an ON position to a START position, the control knob is detachably fastened to a front end of the rotor by a screw member from axially outside the rotor. Thus, the maintenance such as exchange of the control knob is facilitated.