Patents by Inventor Kenichi Tani

Kenichi Tani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11984272
    Abstract: A solid electrolytic capacitor that includes a resin molding including: a capacitor element laminate, the capacitor element laminate including a first layer and a second layer that are laminated together, the first layer includes a valve-action metal substrate exposed at a first end surface of the resin molding, the second layer includes an electrode lead-out layer exposed at a second end surface of the resin molding; an insulating substrate; and a sealing resin enclosing the capacitor element laminate; a first external electrode on a first end surface of the resin molding and connected to the valve-action metal substrate; a second external electrode on a second end surface of the resin molding and connected to the electrode lead-out layer; and a dummy layer not contributing to a capacity of the capacitor on a main surface of the capacitor element laminate in a lamination direction thereof and adjacent to the insulating substrate.
    Type: Grant
    Filed: June 6, 2022
    Date of Patent: May 14, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Junichi Kasuya, Kenichi Oshiumi, Koji Fujimoto, Kazutoyo Horio, Satoshi Tani, Katsutomo Aritomi
  • Patent number: 11972907
    Abstract: A solid electrolytic capacitor that includes a resin molding, a first external electrode, and a second external electrode. The resin molding includes a laminate of multiple capacitor elements, and a sealing resin sealing the laminate. The following are satisfied: t1<t2, t3<t4, t1<t3, and t4/t3<t2/t1, where t1 is the thickness of an inner portion of the cathode lead-out layer, the inner portion not being exposed at the second end surface; t2 is the thickness of an exposed portion of the cathode lead-out layer, the exposed portion being exposed at the second end surface; t3 is the thickness of an inner portion of the valve-action metal substrate, the inner portion not being exposed at the first end surface; and t4 is the thickness of an exposed portion of the valve-action metal substrate, the exposed portion being exposed at the first end surface.
    Type: Grant
    Filed: June 15, 2022
    Date of Patent: April 30, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Satoshi Tani, Kenichi Oshiumi, Kazutoyo Horio, Junichi Sato, Keiji Yoshida
  • Publication number: 20240123776
    Abstract: A tire assembly includes a tire for mounting on a vehicle, an elastic body disposed on an inner side of the tire, and a power generation body disposed between an inner surface of the tire and the elastic body. The power generation body includes a first member and a second member. The first member has a first insulating film forming a first surface. The second member has a second insulating film forming a second surface that faces the first surface and contacts the first surface. The elastic body biases the power generation body toward the inner surface of the tire.
    Type: Application
    Filed: October 6, 2021
    Publication date: April 18, 2024
    Applicants: Sumitomo Rubber Industries, Ltd., The School Corporation Kansai University
    Inventors: Mutsuki SUGIMOTO, Hiroshi TANI, Kenichi KURODA, Takahiro FUJIWARA, Kyota SUGIOKA
  • Publication number: 20230074711
    Abstract: An inductor component includes a rectangular parallelepiped shaped element body and an inductor wiring extending inside the element body. The body has a first electrode exposed to outside the body in a region from a bottom surface to a first end surface. The inductor wiring includes a first wiring portion extending parallel to a first main surface from a first end and a via extending perpendicular to the first main surface from the first wiring portion. In a direction perpendicular to the first main surface, a first wiring layer is a layer having the first wiring portion and a first via layer is a layer having the via. A first wiring layer height, which is the maximum height of the first electrode in the first wiring layer, is larger than a first via layer height, which is the maximum height of the first electrode in the first via layer.
    Type: Application
    Filed: September 6, 2022
    Publication date: March 9, 2023
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Daisuke TAKAHASHI, Kenichi Tani
  • Patent number: 4022627
    Abstract: A thermally crystallizable glass consisting essentially of 45-57 SiO.sub.2, 29-38 Al.sub.2 O.sub.3, 13-22 Na.sub.2 O, in parts by weight, and the parts totalling 100. For each of these 100 parts, the glass contains 0.5-5 parts of ZrO.sub.2 and 1-10 parts of ZnO. The five constituents constitute at least 95 weight percent of the total glass and a thermally crystallized glass-ceramic article suitable as kitchen ware or table ware is made from this glass.
    Type: Grant
    Filed: April 6, 1971
    Date of Patent: May 10, 1977
    Assignee: Owens-Illinois, Inc.
    Inventors: Megumi Tashiro, Masamichi Wada, Toshio Yamanaka, Kenichi Tani