Abstract: A solar cell base body is attached to a frame smoothly and without being damaged. At the time of attaching the solar cell base body, a sealing material applied in a guide groove of the frame is prevented from protruding to the surface of the solar cell base body. Furthermore, the solar cell base body and the frame are stably fixed even when the solar cell module is at a high temperature and the sealing material is softened.

Abstract: The electrode parts of a solar cell module which differ in color form other parts of the module are hidden without increasing the number of module assembly/production steps to thereby enable the whole CIS based thin-film solar cell module to have an even color throughout and hence an improved appearance. A solar cell module 1 having a beautiful appearance is provided which includes a submodule 3 having the same color as electrode parts 3A of the submodule. A black ceramic layer 7 having almost the same color as the submodule 3 is formed on the back side (lower side) of peripheral edge parts of a cover glass 4. The silver-white electrode parts 3A formed in peripheral areas of the submodule 3 are hidden by the black ceramic layer 7, whereby the whole module 1 has an even color throughout and has an improved appearance. For a baking operation for forming the black ceramic layer 7, the heating performed when the cover glass 4 is produced through tempering by a heat treatment may be utilized.

Abstract: A method for tenaciously connecting a conductor electrode on a glass substrate to a ribbon conductor with certainty at low cost without causing damage. An indium-solder-coated copper foil ribbon conductor 1 obtained by depositing an indium solder 3 (100-90% indium and 10-0% silver) in a thickness of 100 ?m or smaller on one side of a copper foil or tin-coated copper foil 2 having a thickness of 300 ?m or smaller and optionally further depositing the solder thinly on the other surfaces of the foil is placed on an exposed part of a molybdenum-based metallic back electrode layer 4B on a glass substrate 4A. An ultrasonic soldering iron 5 is then placed against the upper side of the copper foil ribbon conductor 1 to melt the indium solder 3 and connect the copper foil ribbon conductor 1 to the electrode layer 4B.