Patents by Inventor Kenichi Tokioka

Kenichi Tokioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Preparation process for semiconductor device
    Patent number: 6949465
    Abstract: According to this invention, residues generated after selectively removing a low-dielectric-constant film such as SiOC can be effectively removed without damage on an insulating film or metal film. Specifically, residues 126 and 128 generated after forming an interconnect trench in an SiOC film 116 are removed using a fluoride-free weak alkaline amine stripper. After the removing step, the wafer is rinsed with isopropyl alcohol and then dried without drying with pure water.
    Type: Grant
    Filed: July 9, 2003
    Date of Patent: September 27, 2005
    Assignee: NEC Electronics Corporation
    Inventors: Hidemitsu Aoki, Kenichi Tokioka, Yoshiko Kasama, Tatsuya Koito, Keiji Hirano
  • Stripping composition
    Patent number: 6869921
    Abstract: A stripping composition comprising at least one of alcohols having an ether-bond in the molecule thereof as component (a), and an anticorrosive as component (b). Furfuryl alcohol or tetrahydrofurfuryl alcohol is preferable as component (a).
    Type: Grant
    Filed: August 1, 2002
    Date of Patent: March 22, 2005
    Assignees: NEC Electronics Corporation, Sumitomo Chemical Company, Limited
    Inventors: Tatsuya Koito, Keiji Hirano, Masayuki Takashima, Kenichi Tokioka, Hidemitsu Aoki
  • Preparation process for semiconductor device
    Publication number: 20040009658
    Abstract: According to this invention, residues generated after selectively removing a low-dielectric-constant film such as SiOC can be effectively removed without damage on an insulating film or metal film. Specifically, residues 126 and 128 generated after forming an interconnect trench in an SiOC film 116 are removed using a fluoride-free weak alkaline amine stripper. After the removing step, the wafer is rinsed with isopropyl alcohol and then dried without drying with pure water.
    Type: Application
    Filed: July 9, 2003
    Publication date: January 15, 2004
    Applicant: NEC Electronics Corporation
    Inventors: Hidemitsu Aoki, Kenichi Tokioka, Yosiko Kasama, Tatsuya Koito, Keiji Hirano
  • Stripping composition
    Publication number: 20030130147
    Abstract: A stripping composition comprising at least one of alcohols having an ether-bond in the molecule thereof as component (a), and an anticorrosive as component (b). Furfuryl alcohol or tetrahydrofurfuryl alcohol is preferable as component (a).
    Type: Application
    Filed: August 1, 2002
    Publication date: July 10, 2003
    Applicant: NEC CORPORATION, SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Tatsuya Koito, Keiji Hirano, Masayuki Takashima, Kenichi Tokioka, Hidemitsu Aoki