Abstract: The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 ?m or less.

Abstract: The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 ?m or less.

Abstract: To provide a thermosetting resin composition that has low elasticity, high heat resistance, high elongation under an ordinary temperature environment and a high temperature environment, high electric insulation reliability, and high adhesion strength to a metal foil, and is capable of providing a prepreg that is excellent in crack resistance; a prepreg including the thermosetting resin composition; a metal foil with a resin including the thermosetting resin composition and a metal foil laminated on each other; a laminate including the prepreg or the metal foil with a resin; a printed wiring board including the laminate; and a semiconductor package including the printed wiring board. Specifically, the thermosetting resin composition contains (A) a phenol-based resin, and the component (A) contains (A-1) a phenol-based resin having an aliphatic hydrocarbon group having 10 to 25 carbon atoms.

Abstract: According to the sampling method of the aspect of the present invention, the coordinate (location information) of the sampling location on the sampling specimen is generated randomly by the controller, such as a personal computer, of the sampling location display. Based on the location information, the sampling location is displayed on the sampling specimen, which is a part of the recycled raw material, by laser light. Because of this, arbitrariness, in which the operator artificially selects the sampling location, during incremental sampling for setting the average quality of the sampling specimen, such as the average content of valuable metal, can be excluded reliably.

Abstract: The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 ?m or less.

Abstract: According to the sampling method of the aspect of the present invention, the coordinate (location information) of the sampling location on the sampling specimen is generated randomly by the controller, such as a personal computer, of the sampling location display. Based on the location information, the sampling location is displayed on the sampling specimen, which is a part of the recycled raw material, by laser light. Because of this, arbitrariness, in which the operator artificially selects the sampling location, during incremental sampling for setting the average quality of the sampling specimen, such as the average content of valuable metal, can be excluded reliably.

Abstract: A polyamide-imide resin obtained by a process comprising the step of reacting an aromatic diisocyanate with a diimide dicarboxylic acid containing 40 mol % or more of a compound represented by the following general formula (1) and 20 mol % or more of a compound represented by the following general formula (2).

Abstract: A process for production of a flexible laminated sheet having one or more laminated bodies each provided with a metal foil formed on one side of a resin film, the process comprising a coating step in which a varnish containing a polyamic acid and a solvent is coated onto the metal foil to form a coated film, a holding step in which the coated film formed on the metal foil is held, a drying step in which at least a portion of the solvent in the varnish is removed to form a layer composed of a resin composition, and a resin film-forming step in which the layer composed of the resin composition is heated to form a resin film containing a polyimide resin. The conditions for each step from the coating step up to the resin film-forming step are adjusted based on a target for the content of metal elements in the resin film.

Abstract: A process for production of a flexible laminated sheet having one or more laminated bodies each provided with a metal foil formed on one side of a resin film. The process includes coating a varnish containing a polyamic acid and a solvent onto the metal foil, holding the coated film, drying in which at least a portion of the solvent in the varnish is removed to form a layer composed of a resin composition, and forming the resin in which the layer composed of the resin composition is heated to form a resin film containing a polyimide resin. The conditions for each step from the coating up to the resin film-forming are adjusted based on a target for the content of metal elements in the resin film.

Abstract: A polyamide-imide resin obtained by a process comprising the step of reacting an aromatic diisocyanate with a diimide dicarboxylic acid containing 40 mol % or more of a compound represented by the following general formula (1) and 20 mol % or more of a compound represented by the following general formula (2).

Abstract: A process for production of a flexible laminated sheet having one or more laminated bodies each provided with a metal foil formed on one side of a resin film, the process comprising a coating step in which a varnish containing a polyamic acid and a solvent is coated onto the metal foil to form a coated film, a holding step in which the coated film formed on the metal foil is held, a drying step in which at least a portion of the solvent in the varnish is removed to form a layer composed of a resin composition, and a resin film-forming step in which the layer composed of the resin composition is heated to form a resin film containing a polyimide resin. The conditions for each step from the coating step up to the resin film-forming step are adjusted based on a target for the content of metal elements in the resin film.

Abstract: A resin composition comprising a cyanate compound (A) having 2 or more cyanato groups in the molecule; a phenol compound (B); a silicone polymer (D) having at least one siloxane unit selected from the group consisting of a tri-functional siloxane unit represented by the formula RSiO3/2 and tetra-functional siloxane unit represented by SiO4/2, polymerization degree of 7,000 or less, and at least one terminal functional group reactive with hydroxyl group; and inorganic filler (E).

Abstract: The present invention relates to a thermosetting resin composition comprising: (1) a metal salt of a disubstituted phosphinic acid, and (2) a resin having a dielectric constant of 2.9 or less at a frequency of 1 GHz or more, and a prepreg and a laminated board using the same.

Abstract: A resin composition comprising a cyanate compound (A) having 2 or more cyanato groups in the molecule; a phenol compound (B); a silicone polymer (D) having at least one siloxane unit selected from the group consisting of a tri-functional siloxane unit represented by the formula RSiO3/2 and tetra-functional siloxane unit represented by SiO4/2, polymerization degree of 7,000 or less, and at least one terminal functional group reactive with hydroxyl group; and inorganic filler (E).

Abstract: The present invention provides a thermosetting resin composition superior with respect to all characteristics of dielectric characteristics, heat resistance, moisture resistance, electrolytic corrosion resistance, adhesiveness with a copper foil, chemical resistance and flame retardancy using a halogen-free flame retardant, its use, and for example, a prepreg, laminated board and printed wiring board. The present invention relates to: (1) a resin thermosetting resin composition comprising: (A) a phenol-modified cyanate ester oligomer obtained by reacting a cyanate compound (a) containing two or more cyanato groups in a single molecule, and (b) a phenol compound represented by the formula (I) and/or formula (II), such that a blending equivalence ratio of hydroxyl group (b)/cyanato group (a) is within a range of 0.01 to 0.

Abstract: The present invention relates to a thermosetting resin composition comprising: (1) a metal salt of a disubstituted phosphinic acid, and (2) a resin having a dielectric constant of 2.9 or less at a frequency of 1 GHz or more, and a prepreg and a laminated board using the same.

Abstract: A resin composition comprising a cyanate compound (A) having 2 or more cyanato groups in the molecule; a phenol compound (B); a silicone polymer (D) having at least one siloxane unit selected from the group consisting of a tri-functional siloxane unit represented by the formula RSiO3/2 and tetra-functional siloxane unit represented by SiO4/2, polymerization degree of 7,000 or less, and at least one terminal functional group reactive with hydroxyl group; and inorganic filler (E).

Abstract: An epoxy resin composition for a printed circuit board includes an epoxy resin; a multi-functional phenol group; a hardening accelerator; and at least one of a compound having a triazine or isocyanurate ring, and a compound containing less than 60 weight percent nitrogen, but not containing a urea derivative. A printed circuit board comprising the epoxy resin composition has low water absorption, excellent heat endurance, and a good adhesion with copper foil.

Abstract: Novel heterocyclic compounds shown by the general formula ##STR1## or the pharmaceutically acceptable salts thereof useful as medicament in particular as antagonist of slow reacting substance of anaphylaxis (SRS-A).

Abstract: This invention relates to novel heterocyclic compounds structurally characterized by containing a specific heterocyclic group and by the presence of --CH.sub.2 --S--directly bound to the specific heterocyclic group. These heterocyclic compounds are useful as medicines, particularly as antagonists of SRS-A (slow reacting substance of anaphylaxis).