Patents by Inventor Kenichi Tomioka

Kenichi Tomioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210079172
    Abstract: The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 ?m or less.
    Type: Application
    Filed: December 2, 2020
    Publication date: March 18, 2021
    Inventors: Yuya HIRAYAMA, Takayo KITAJIMA, Kenichi TOMIOKA, Keisuke KUSHIDA, Minoru KAKITANI, Hiroshi SHIMIZU
  • Publication number: 20210024741
    Abstract: To provide a thermosetting resin composition that has low elasticity, high heat resistance, high elongation under an ordinary temperature environment and a high temperature environment, high electric insulation reliability, and high adhesion strength to a metal foil, and is capable of providing a prepreg that is excellent in crack resistance; a prepreg including the thermosetting resin composition; a metal foil with a resin including the thermosetting resin composition and a metal foil laminated on each other; a laminate including the prepreg or the metal foil with a resin; a printed wiring board including the laminate; and a semiconductor package including the printed wiring board. Specifically, the thermosetting resin composition contains (A) a phenol-based resin, and the component (A) contains (A-1) a phenol-based resin having an aliphatic hydrocarbon group having 10 to 25 carbon atoms.
    Type: Application
    Filed: March 29, 2019
    Publication date: January 28, 2021
    Inventors: Yuya HIRAYAMA, Keisuke KUSHIDA, Kenichi TOMIOKA, Hiroshi SHIMIZU
  • Patent number: 10330572
    Abstract: According to the sampling method of the aspect of the present invention, the coordinate (location information) of the sampling location on the sampling specimen is generated randomly by the controller, such as a personal computer, of the sampling location display. Based on the location information, the sampling location is displayed on the sampling specimen, which is a part of the recycled raw material, by laser light. Because of this, arbitrariness, in which the operator artificially selects the sampling location, during incremental sampling for setting the average quality of the sampling specimen, such as the average content of valuable metal, can be excluded reliably.
    Type: Grant
    Filed: June 16, 2014
    Date of Patent: June 25, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Akira Nitta, Michiaki Onishi, Kenichi Tomioka, Tomohiro Tsutsui, Makoto Takagi
  • Publication number: 20190161586
    Abstract: The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 ?m or less.
    Type: Application
    Filed: May 15, 2017
    Publication date: May 30, 2019
    Inventors: Yuya HIRAYAMA, Takayo KITAJIMA, Kenichi TOMIOKA, Keisuke KUSHIDA, Minoru KAKITANI, Hiroshi SHIMIZU
  • Publication number: 20170010190
    Abstract: According to the sampling method of the aspect of the present invention, the coordinate (location information) of the sampling location on the sampling specimen is generated randomly by the controller, such as a personal computer, of the sampling location display. Based on the location information, the sampling location is displayed on the sampling specimen, which is a part of the recycled raw material, by laser light. Because of this, arbitrariness, in which the operator artificially selects the sampling location, during incremental sampling for setting the average quality of the sampling specimen, such as the average content of valuable metal, can be excluded reliably.
    Type: Application
    Filed: June 16, 2014
    Publication date: January 12, 2017
    Inventors: Akira Nitta, Michiaki Onishi, Kenichi Tomioka, Tomohiro Tsutsui, Makoto Takagi
  • Patent number: 8956732
    Abstract: A polyamide-imide resin obtained by a process comprising the step of reacting an aromatic diisocyanate with a diimide dicarboxylic acid containing 40 mol % or more of a compound represented by the following general formula (1) and 20 mol % or more of a compound represented by the following general formula (2).
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: February 17, 2015
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Masaki Takeuchi, Katsuyuki Masuda, Kenichi Tomioka, Takako Ejiri
  • Patent number: 8501279
    Abstract: A process for production of a flexible laminated sheet having one or more laminated bodies each provided with a metal foil formed on one side of a resin film, the process comprising a coating step in which a varnish containing a polyamic acid and a solvent is coated onto the metal foil to form a coated film, a holding step in which the coated film formed on the metal foil is held, a drying step in which at least a portion of the solvent in the varnish is removed to form a layer composed of a resin composition, and a resin film-forming step in which the layer composed of the resin composition is heated to form a resin film containing a polyimide resin. The conditions for each step from the coating step up to the resin film-forming step are adjusted based on a target for the content of metal elements in the resin film.
    Type: Grant
    Filed: October 19, 2006
    Date of Patent: August 6, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Masahiko Suzuki, Kazuhito Obata, Katsuyuki Masuda, Kenichi Tomioka, Masaki Takeuchi, Sumio Yoshida, Hirokazu Suzuki, Yoshitsugu Matsuura
  • Publication number: 20120244275
    Abstract: A process for production of a flexible laminated sheet having one or more laminated bodies each provided with a metal foil formed on one side of a resin film. The process includes coating a varnish containing a polyamic acid and a solvent onto the metal foil, holding the coated film, drying in which at least a portion of the solvent in the varnish is removed to form a layer composed of a resin composition, and forming the resin in which the layer composed of the resin composition is heated to form a resin film containing a polyimide resin. The conditions for each step from the coating up to the resin film-forming are adjusted based on a target for the content of metal elements in the resin film.
    Type: Application
    Filed: March 27, 2012
    Publication date: September 27, 2012
    Inventors: Masahiko SUZUKI, Kazuhito OBATA, Katsuyuki MASUDA, Kenichi TOMIOKA, Masaki TAKEUCHI, Sumio YOSHIDA, Hirokazu SUZUKI, Yoshitsugu MATSUURA
  • Publication number: 20100170701
    Abstract: A polyamide-imide resin obtained by a process comprising the step of reacting an aromatic diisocyanate with a diimide dicarboxylic acid containing 40 mol % or more of a compound represented by the following general formula (1) and 20 mol % or more of a compound represented by the following general formula (2).
    Type: Application
    Filed: August 20, 2007
    Publication date: July 8, 2010
    Inventors: Masaki Takeuchi, Katsuyuki Masuda, Kenichi Tomioka, Takako Ejiri
  • Publication number: 20090081426
    Abstract: A process for production of a flexible laminated sheet having one or more laminated bodies each provided with a metal foil formed on one side of a resin film, the process comprising a coating step in which a varnish containing a polyamic acid and a solvent is coated onto the metal foil to form a coated film, a holding step in which the coated film formed on the metal foil is held, a drying step in which at least a portion of the solvent in the varnish is removed to form a layer composed of a resin composition, and a resin film-forming step in which the layer composed of the resin composition is heated to form a resin film containing a polyimide resin. The conditions for each step from the coating step up to the resin film-forming step are adjusted based on a target for the content of metal elements in the resin film.
    Type: Application
    Filed: October 19, 2006
    Publication date: March 26, 2009
    Inventors: Masahiko Suzuki, Kazuhito Obata, Katsuyuki Masuda, Kenichi Tomioka, Masaki Takeuchi, Sumio Yoshida, Hirokazu Suzuki, Yoshisugu Matsuura
  • Publication number: 20070207326
    Abstract: A resin composition comprising a cyanate compound (A) having 2 or more cyanato groups in the molecule; a phenol compound (B); a silicone polymer (D) having at least one siloxane unit selected from the group consisting of a tri-functional siloxane unit represented by the formula RSiO3/2 and tetra-functional siloxane unit represented by SiO4/2, polymerization degree of 7,000 or less, and at least one terminal functional group reactive with hydroxyl group; and inorganic filler (E).
    Type: Application
    Filed: December 29, 2006
    Publication date: September 6, 2007
    Inventors: Yasuyuki Mizuno, Daisuke Fujimoto, Kenichi Tomioka, Nozomu Takano
  • Patent number: 7208539
    Abstract: The present invention relates to a thermosetting resin composition comprising: (1) a metal salt of a disubstituted phosphinic acid, and (2) a resin having a dielectric constant of 2.9 or less at a frequency of 1 GHz or more, and a prepreg and a laminated board using the same.
    Type: Grant
    Filed: April 16, 2003
    Date of Patent: April 24, 2007
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Shinji Tsuchikawa, Michitoshi Arata, Kenichi Tomioka, Kazuhito Kobayashi
  • Patent number: 7157506
    Abstract: A resin composition comprising a cyanate compound (A) having 2 or more cyanato groups in the molecule; a phenol compound (B); a silicone polymer (D) having at least one siloxane unit selected from the group consisting of a tri-functional siloxane unit represented by the formula RSiO3/2 and tetra-functional siloxane unit represented by SiO4/2, polymerization degree of 7,000 or less, and at least one terminal functional group reactive with hydroxyl group; and inorganic filler (E).
    Type: Grant
    Filed: March 21, 2001
    Date of Patent: January 2, 2007
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Yasuyuki Mizuno, Daisuke Fujimoto, Kenichi Tomioka, Nozomu Takano
  • Publication number: 20060099391
    Abstract: The present invention provides a thermosetting resin composition superior with respect to all characteristics of dielectric characteristics, heat resistance, moisture resistance, electrolytic corrosion resistance, adhesiveness with a copper foil, chemical resistance and flame retardancy using a halogen-free flame retardant, its use, and for example, a prepreg, laminated board and printed wiring board. The present invention relates to: (1) a resin thermosetting resin composition comprising: (A) a phenol-modified cyanate ester oligomer obtained by reacting a cyanate compound (a) containing two or more cyanato groups in a single molecule, and (b) a phenol compound represented by the formula (I) and/or formula (II), such that a blending equivalence ratio of hydroxyl group (b)/cyanato group (a) is within a range of 0.01 to 0.
    Type: Application
    Filed: November 2, 2005
    Publication date: May 11, 2006
    Inventors: Kenichi Tomioka, Hiroshi Shimizu, Nobuyuki Minami, Harumi Negishi, Shinichi Kamoshida
  • Publication number: 20050234173
    Abstract: The present invention relates to a thermosetting resin composition comprising: (1) a metal salt of a disubstituted phosphinic acid, and (2) a resin having a dielectric constant of 2.9 or less at a frequency of 1 GHz or more, and a prepreg and a laminated board using the same.
    Type: Application
    Filed: April 16, 2003
    Publication date: October 20, 2005
    Applicant: Hitachi Chemical Co., Ltd.
    Inventors: Shinji Tsuchikawa, Michitoshi Arata, Kenichi Tomioka, Kazuhito Kobayashi
  • Publication number: 20030130412
    Abstract: A resin composition comprising a cyanate compound (A) having 2 or more cyanato groups in the molecule; a phenol compound (B); a silicone polymer (D) having at least one siloxane unit selected from the group consisting of a tri-functional siloxane unit represented by the formula RSiO3/2 and tetra-functional siloxane unit represented by SiO4/2, polymerization degree of 7,000 or less, and at least one terminal functional group reactive with hydroxyl group; and inorganic filler (E).
    Type: Application
    Filed: November 15, 2002
    Publication date: July 10, 2003
    Inventors: Yasuyuki Mizuno, Daisuke Fujimoto, Kenichi Tomioka, Nozomu Takano
  • Patent number: 6462147
    Abstract: An epoxy resin composition for a printed circuit board includes an epoxy resin; a multi-functional phenol group; a hardening accelerator; and at least one of a compound having a triazine or isocyanurate ring, and a compound containing less than 60 weight percent nitrogen, but not containing a urea derivative. A printed circuit board comprising the epoxy resin composition has low water absorption, excellent heat endurance, and a good adhesion with copper foil.
    Type: Grant
    Filed: March 23, 1999
    Date of Patent: October 8, 2002
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Michitoshi Arata, Nozomu Takano, Tomio Fukuda, Kenichi Tomioka
  • Patent number: 5258395
    Abstract: Novel heterocyclic compounds shown by the general formula ##STR1## or the pharmaceutically acceptable salts thereof useful as medicament in particular as antagonist of slow reacting substance of anaphylaxis (SRS-A).
    Type: Grant
    Filed: October 13, 1992
    Date of Patent: November 2, 1993
    Assignee: Yamanouchi Pharmaceutical Co., Ltd.
    Inventors: Kiyoshi Murase, Toshiyasyu Mase, Hiromu Hara, Kenichi Tomioka
  • Patent number: 5180730
    Abstract: This invention relates to novel heterocyclic compounds structurally characterized by containing a specific heterocyclic group and by the presence of --CH.sub.2 --S--directly bound to the specific heterocyclic group. These heterocyclic compounds are useful as medicines, particularly as antagonists of SRS-A (slow reacting substance of anaphylaxis).
    Type: Grant
    Filed: April 5, 1991
    Date of Patent: January 19, 1993
    Assignee: Yamanouchi Pharmaceutical Co., Ltd.
    Inventors: Toshiyasu Mase, Ryuji Tsuzuki, Hiromu Hara, Kiyoshi Murase, Kenichi Tomioka
  • Patent number: 5177215
    Abstract: Novel heterocyclic compounds shown by the general formula ##STR1## or the pharmaceutically acceptable salts thereof useful as medicament in particular as antagonist of slow reacting substance of anaphylaxis (SRS-A).
    Type: Grant
    Filed: February 28, 1990
    Date of Patent: January 5, 1993
    Assignee: Yamanouchi Pharmaceutical Co., Ltd.
    Inventors: Kiyoshi Murase, Toshiyasu Mase, Hiromu Hara, Kenichi Tomioka