Abstract: A jet soldering apparatus has a first housing; a first supply port provided on the first housing and configured to provide molten solder; a second housing; and a second supply port provided on the second housing and configured to provide the molten solder. The molten solder supplied from the first supply port and the molten solder supplied from the second supply port are mixed. The mixed molten solder is not separated from a substrate conveyed by a conveyance unit between the first supply port and the second supply port.

Abstract: A Magnetic-field melting preform solder that melts by action of an AC magnetic field, wherein the preform solder includes a laminated structure made up of two or more layers, at least two layers constituting the laminated structure is made up of solder material, the at least two layers do not contain ferromagnetic material, each of the at least two layers includes a surface facing with each other, and the surfaces facing with each other are in contact with each other. A bonding method using the preform solder includes a providing the preform solder between an electrode on a substrate and an electrode of an electronic component, and bonding together the electrode on the substrate and the electrode of the electronic component by generating an AC magnetic field around the substrate and thereby melting the preform solder.

Abstract: A magnetic-field melting solder that melts by the action of an AC magnetic field is provided. The magnetic-field melting solder includes solder material; and magnetic material composing of ferrite or Ni, a proportion of the magnetic material to the entire magnetic-field melting solder being 0.005% to 5% by weight. A joining method using the magnetic-field melting solder includes providing the magnetic-field melting solder between an electrode on a substrate and an electrode of an electronic component, and joining together the electrode on the substrate and the electrode of the electronic component by generating an AC magnetic field around the substrate and thereby melting the magnetic-field melting solder.

Abstract: When a printed board is soldered by a dipping method, a great deal of dross is generated on a jet solder tank. The dross is a mixture of melted solder and oxide. A worker takes out the dross from the jet solder tank, and throws it away. Thus, a large amount of the solder is consumed. The present invention relates to a separating device for separating oxide and solder from dross. A container (21) is provided with a heater (22). A cover (24) is set over the container (21) to be freely attachable or detachable, and further a non-oxidizing gas supplying opening (28) is made in the cover (24) or the container (21). A stirring spatula (25) for stirring the surface of a melted solder (23) put into the container (21) is set near the surface of the melted solder (23).

Abstract: When a printed board is soldered by a dipping method, a great deal of dross is generated on a jet solder tank. The dross is a mixture of melted solder and oxide. A worker takes out the dross from the jet solder tank, and throws it away. Thus, a large amount of the solder is consumed. The present invention relates to a separating device for separating oxide and solder from dross. A container (21) is provided with a heater (22). A cover (24) is set over the container (21) to be freely attachable or detachable, and further a non-oxidizing gas supplying opening (28) is made in the cover (24) or the container (21). A stirring spatula (25) for stirring the surface of a melted solder (23) put into the container (21) is set near the surface of the melted solder (23).

Abstract: A jet solder bath is comprised of a bath unit which contains a molten solder, a nozzle member provided within the bath unit and constructing a nozzle mouth, a tank provided in at least one side of the nozzle member along the nozzle mouth and temporarily accumulating a solder jetted from the nozzle mouth, and a molten solder outlet provided on the lower portion of the tank and communicating the tank with a molten solder still area provided within the solder bath unit under the liquid level of the molten solder. According to the above-mentioned arrangement, the molten solder can be suppressed from being oxidized as much as possible and the removal of a resultant oxide can be facilitated.