Abstract: A thermally conductive silicone composition that has high thermal conductivity and excellent workability and misalignment resistance, and contains, in specific ratios: a silicone gel cross-linked product (A); a silicone oil (B) not containing either aliphatic unsaturated bonds or SiH groups and being used as a surface treatment agent for components (C) and (D); an aluminum powder (C) including (C-1)-(C-3), (C-1) being an aluminum powder having an average particle diameter of 40-100 ?m, (C-2) being an aluminum powder having an average particle diameter of at least 6 ?m and less than 40 ?m, and (C-3) being an aluminum powder having an average particle diameter of at least 0.4 ?m and less than 6 ?m; a zinc oxide powder (D) having an average particle diameter of 0.1-10 ?m; and a volatile solvent (E).

Abstract: Provided are a thermal conductive silicone composition having a favorable heat dissipation property; and a semiconductor device using such composition. The thermal conductive silicone composition contains: (A) an organopolysiloxane that has a kinetic viscosity of 10 to 100,000 mm2/s at 25° C., and is represented by the following average composition formula (1) R1aSiO(4-a)/2??(1) wherein R1 represents a hydrogen atom, a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms or a hydroxy group, and a represents a number satisfying 1.8?a?2.2; (B) a silver powder having a tap density of not lower than 3.0 g/cm3, a specific surface area of not larger than 2.0 m2/g and an aspect ratio of 1 to 30; (C) an elemental gallium and/or gallium alloy having a melting point of 0 to 70° C. and being present at a mass ratio [Component (C)/{Component (B)+Component (C)}] of 0.001 to 0.1; and (D) a catalyst.

Abstract: Provided is a curable organopolysiloxane composition that is in the form of a grease before curing, has an excellent workability and heat dissipation effect, and is capable of being turned into a cured product exhibiting no cracks and voids at the time of curing. The composition contains: (A) organopolysiloxanes (A-1) and (A-2) each having at least two silicon atom-bonded alkenyl groups per molecule, and exhibiting different viscosities which are 0.01 to 10 Pa·s for (A-1), and 11 to 1,000 Pa·s for (A-2); (B) an organohydrogenpolysiloxane; (C) gallium and/or gallium alloy(s) that have melting points of ?20 to 70° C.; (D) a thermally conductive filler; (E) a platinum group metal catalyst; and (G-1) an organopolysiloxane represented by the following general formula (1), wherein R1s represent alkyl groups, R2 represents an alkyl group, a is an integer of 5 to 100, b is an integer of 1 to 3.

Abstract: A thermally conductive silicone composition including: (A) an organopolysiloxane represented by the following general formula (1) having a kinematic viscosity at 25° C. of 10 to 10,000 mm2/s, (B) an organopolysiloxane other than the component (A), represented by the following general formula (2) and having a kinematic viscosity at 25° C. of 1,000 to 100,000 mm2/s, (C) an organosilane represented by the following general formula (3), and (D) a thermally conductive filler having a thermal conductivity of 10 W/m·° C. or more. A thermally conductive silicone composition which does not cause a thickening phenomenon during preservation and has excellent shift resistance is provided.

Abstract: A thermally conductive silicone composition that has high thermal conductivity and excellent workability and misalignment resistance, and contains, in specific ratios: a silicone gel cross-linked product (A); a silicone oil (B) not containing either aliphatic unsaturated bonds or SiH groups and being used as a surface treatment agent for components (C) and (D); an aluminum powder (C) including (C-1)-(C-3), (C-1) being an aluminum powder having an average particle diameter of 40-100 ?m, (C-2) being an aluminum powder having an average particle diameter of at least 6 ?m and less than 40 ?m, and (C-3) being an aluminum powder having an average particle diameter of at least 0.4 ?m and less than 6 ?m; a zinc oxide powder (D) having an average particle diameter of 0.1-10 ?m; and a volatile solvent (E).

Abstract: Provided are a thermal conductive silicone composition having a favorable heat dissipation property; and a semiconductor device using such composition. The thermal conductive silicone composition contains: (A) an organopolysiloxane that has a kinetic viscosity of 10 to 100,000 mm2/s at 25° C., and is represented by the following average composition formula (1) R1aSiO(4-a)/2??(1) wherein R1 represents a hydrogen atom, a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms or a hydroxy group, and a represents a number satisfying 1.8?a?2.2; (B) a silver powder having a tap density of not lower than 3.0 g/cm3, a specific surface area of not larger than 2.0 m2/g and an aspect ratio of 1 to 30; (C) an elemental gallium and/or gallium alloy having a melting point of 0 to 70° C. and being present at a mass ratio [Component (C)/{Component (B)+Component (C)}] of 0.001 to 0.1; and (D) a catalyst.

Abstract: Provided is a thermal conductive silicone composition containing: (A) an organopolysiloxane having a kinetic viscosity of 10 to 100,000 mm2/s at 25° C., and represented by the following average composition formula (1) R1aSiO(4-a)/2??(1) wherein R1 represents a hydrogen atom or a monovalent hydrocarbon group, and a represents a number satisfying 1.8?a?2.2; (B) silver nanoparticles having an average particle size of 3 to 600 nm; (C) a thermal conductive filler other than the component (B), having an average particle size of 0.7 to 100 ?m and a thermal conductivity of 10 W/m° C. or higher; and (D) a catalyst selected from the group consisting of a platinum based catalyst, an organic peroxide and a catalyst for condensation reaction.

Abstract: With respect to an addition-curable thermally conductive silicone composition in which a silver filler is blended, a catalyst having a specific structure and an organohydrogen polysiloxane having a specific structure are used for the purpose of extending the working life at room temperature, while maintaining the flexibility, so that a thermally conductive silicone composition which is able to have a good balance between flexibility after curing and storage stability in one pack, while having extremely low thermal resistance and excellent reliability is achieved.

Abstract: With respect to an addition-curable thermally conductive silicone composition in which a silver filler is blended, a catalyst having a specific structure and an organohydrogen polysiloxane having a specific structure are used for the purpose of extending the working life at room temperature, while maintaining the flexibility, so that a thermally conductive silicone composition which is able to have a good balance between flexibility after curing and storage stability in one pack, while having extremely low thermal resistance and excellent reliability is achieved.

Abstract: Provided is a thermal conductive silicone composition containing: (A) an organopolysiloxane having a kinetic viscosity of 10 to 100,000 mm2/s at 25° C., and represented by the following average composition formula (1) R1aSiO(4-a)/2 ??(1) wherein R1 represents a hydrogen atom or a monovalent hydrocarbon group, and a represents a number satisfying 1.8?a?2.2; (B) silver nanoparticles having an average particle size of 3 to 600 nm; (C) a thermal conductive filler other than the component (B), having an average particle size of 0.7 to 100 ?m and a thermal conductivity of 10 W/m° C. or higher; and (D) a catalyst selected from the group consisting of a platinum based catalyst, an organic peroxide and a catalyst for condensation reaction.

Abstract: This thermally-conductive silicone composition comprises: (A) an organopolysiloxane having two or more alkenyl groups per molecule, and having a kinetic viscosity of 10-100,000 mm2/s at 25° C., (B) a hydrolyzable methyl polysiloxane which is represented by formula (1) (R1 represents an alkyl group, and a is 5-100) and of which one end is trifunctional, (C) a thermally-conductive filler having a thermal conductivity of 10 W/m·° C. or more, (D) an organohydrogen polysiloxane having two or more Si—H groups per molecule, (E) a catalyst selected from the group consisting of platinum and platinum compounds, and (F) a benzotriazole derivative represented by formula (2) (R2 represents H or a monovalent hydrocarbon group, and R3 represents a monovalent organic group). The composition can inhibit the decrease of the curing speed.

Abstract: This thermally-conductive silicone composition comprises: (A) an organopolysiloxane having two or more alkenyl groups per molecule, and having a kinetic viscosity of 10-100,000 mm2/s at 25° C., (B) a hydrolyzable methyl polysiloxane which is represented by formula (1) (R1 represents an alkyl group, and a is 5-100) and of which one end is trifunctional, (C) a thermally-conductive filler having a thermal conductivity of 10 W/m·° C. or more, (D) an organohydrogen polysiloxane having two or more Si—H groups per molecule, (E) a catalyst selected from the group consisting of platinum and platinum compounds, and (F) a benzotriazole derivative represented by formula (2) (R2 represents H or a monovalent hydrocarbon group, and R3 represents a monovalent organic group). The composition can inhibit the decrease of the curing speed.

Abstract: Provided is a thermal conductive silicone composition exhibiting no peeling of a heat dissipation grease and capable of maintaining a low thermal resistance, even under a severe condition. The thermal conductive silicone composition contains: (A) an organopolysiloxane having at least two alkenyl groups in one molecule and exhibiting a kinetic viscosity of 10 to 100,000 mm2/s at 25° C.; (B) a one-terminal-trifunctional hydrolyzable methylpolysiloxane; (C) an aluminum powder; (D) a zinc oxide powder; (E) an organohydrogenpolysiloxane; (F) an organohydrogenpolysiloxane other than the component (E); and (G) a platinum-based catalyst for hydrosilylation, wherein when a liquid obtained by mixing and dispersing the composition in toluene which is twice the amount of the composition has been sieved, a residue of not more than 5 ppm will be observed if using a 250 mesh sieve, and a residue of not less than 200 ppm will be observed if using a 440 mesh sieve.

Abstract: The composition is a thermally conductive silicone composition containing the following components (A) to (C) and (D). The component (A) is an organopolysiloxane that exhibits a kinetic viscosity of 10 to 100,000 mm2/s at 25° C., and is represented by an average composition formula (1) R1aSiO(4-a)/2??(1) wherein R1 represents a hydrogen atom, a hydroxy group or a monovalent hydrocarbon group, and a satisfies 1.8?a?2.2. The component (B) is a silver powder having a tap density of not lower than 3.0 g/cm3, a specific surface area of not larger than 2.0 m2/g, and an aspect ratio of 2.0 to 150.0. The component (C) is a thermally conductive filler other than the component (B), having an average particle size of 5 to 100 ?m and a thermal conductivity of not lower than 10 W/m° C. The component (D) is a platinum-based catalyst, an organic peroxide and/or a catalyst for condensation reaction.

Abstract: Provided is a thermal conductive silicone composition exhibiting no peeling of a heat dissipation grease and capable of maintaining a low thermal resistance, even under a severe condition. The thermal conductive silicone composition contains: (A) an organopolysiloxane having at least two alkenyl groups in one molecule and exhibiting a kinetic viscosity of 10 to 100,000 mm2/s at 25° C.; (B) a one-terminal-trifunctional hydrolyzable methylpolysiloxane; (C) an aluminum powder; (D) a zinc oxide powder; (E) an organohydrogenpolysiloxane; (F) an organohydrogenpolysiloxane other than the component (E); and (G) a platinum-based catalyst for hydrosilylation, wherein when a liquid obtained by mixing and dispersing the composition in toluene which is twice the amount of the composition has been sieved, a residue of not more than 5 ppm will be observed if using a 250 mesh sieve, and a residue of not less than 200 ppm will be observed if using a 440 mesh sieve.

Abstract: Provided is a thermal conductive silicone composition having a superior thermal conductivity. The thermal conductive silicone composition contains: (A) an organopolysiloxane that exhibits a kinetic viscosity of 10 to 100,000 mm2/s at 25° C., and is represented by the following average composition formula (1) R1aSiO(4-a)/2??(1) wherein R1 represents a hydrogen atom or at least one group selected from a hydroxy group and a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms, and a satisfies 1.8?a?2.2; and (B) a silver powder having a tap density of not lower than 3.0 g/cm3 and a specific surface area of not larger than 2.0 m2/g, such silver powder being in an amount of 300 to 11,000 parts by mass with respect to 100 parts by mass of the component (A).

Abstract: Provided is a heat conductive silicone composition disposed between a heat generating electronic component and a member for dispersing heat, wherein the heat conductive silicone composition contains (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a dynamic viscosity at 25° C. of 10 to 100,000 mm2/s, (B) a hydrolyzable dimethylpolysiloxane having three functional groups at one end expressed by formula (1), (C) a heat conductive filler having a heat conductivity of 10 W/m° C. or higher, (D) an organohydrogenpolysiloxane expressed by formula (2), (E) an organohydrogenpolysiloxane containing a hydrogen directly bonded to at least two silicon atoms in one molecule other than component (D), and (F) a catalyst selected from the group consisting of platinum and platinum compounds.

Abstract: Provided is a thermal conductive silicone composition having a superior thermal conductivity. The thermal conductive silicone composition contains: (A) an organopolysiloxane that exhibits a kinetic viscosity of 10 to 100,000 mm2/s at 25° C., and is represented by the following average composition formula (1) R1aSiO(4-a)/2??(1) wherein R1 represents a hydrogen atom or at least one group selected from a hydroxy group and a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms, and a satisfies 1.8?a?2.2; and (B) a silver powder having a tap density of not lower than 3.0 g/cm3 and a specific surface area of not larger than 2.0 m2/g, such silver powder being in an amount of 300 to 11,000 parts by mass with respect to 100 parts by mass of the component (A).

Abstract: Provided is a thermally-curable heat-conductive silicone grease composition which has a high shape-retaining property in an early stage even when the viscosity of the composition is low (i.e., the composition is easy to apply) in the early stage, and which becomes soft (has low hardness) after being cured. A thermally-curable heat-conductive silicone grease composition comprising, as essential components: (A) an organopolysiloxane having a viscosity of 100 to 100,000 mPa·s at 25° C.

Abstract: The present invention provides a thermally conductive grease composition which scarcely increases in hardness during high-temperature heating and has a minimized reduction in growth, containing: (A) an organopolysiloxane including at least two alkenyl groups per molecule, the 25° C. kinetic viscosity being 5,000 to 100,000 mm2/s; (B) a hydrolysable methyl polysiloxane, trifunctional at one terminus, represented by general formula (1) (R1 is a C1-6 alkyl group, and a is an integer 5 to 100); (C) a thermally conductive filler having a thermal conductivity of 10 W/m·° C. or greater; (D) an organohydrogenpolysiloxane containing two to five hydrogen atoms directly bonded to a silicon atom (Si—H group) per molecule; (E) an adhesion promoter having a triazine ring and at least one alkenyl group per molecule; and (F) a catalyst selected from the group consisting of platinum and platinum compounds.