Patents by Inventor Kenichi Ueda
Kenichi Ueda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240116277Abstract: A method of producing component-attached vehicle window glass includes disposing a component on a main surface of a glass plate having a heat absorbing layer via an adhesive, locally heating the heat absorbing layer, and transferring heat from the heat absorbing layer to the adhesive to heat and cure the adhesive.Type: ApplicationFiled: December 4, 2023Publication date: April 11, 2024Applicant: AGC Inc.Inventors: Shunji UEDA, Kenichi EBATA
-
Publication number: 20240100915Abstract: A method of producing metal component-attached vehicle window glass includes disposing a metal component on a main surface of window glass via an adhesive, locally heating the metal component, and transferring heat from the metal component to the adhesive to heat and cure the adhesive.Type: ApplicationFiled: December 4, 2023Publication date: March 28, 2024Applicant: AGC Inc.Inventors: Shunji UEDA, Kenichi Ebata, Yuta Akashi
-
Publication number: 20240038533Abstract: The present disclosure provides a substrate processing method and a substrate processing apparatus which are effective in preventing pattern collapse of an uneven pattern. The substrate processing method according to an exemplary embodiment includes replacing a liquid in a recess of a substrate having an uneven pattern of a negative type resist including a metal formed on a surface of the substrate with a solid-state stiffener, and subjecting the substrate to a molecular weight reduction processing that reduces the number of intermolecular bonds contained in the solid-state stiffener while maintaining the solid-state stiffener in a solid state.Type: ApplicationFiled: August 10, 2021Publication date: February 1, 2024Inventors: Hiroki TADATOMO, Makoto MURAMATSU, Kenichi UEDA, Arnaud Alain Jean DAUENDORFFER, Tomoya ONITSUKA, Keisuke YOSHIDA
-
Publication number: 20230169257Abstract: A combined sentence generating device 20 that generates combined sentences of images and characters includes: a sentence reading module 21 that reads natural language sentences; a conversion object specifying module 22 that specifies a conversion object portion out of the natural language sentences; and an object to image converting module 23. The object to image converting module 23 specifies a converted image corresponding to the conversion object portion in reference to an image database 30 storing images in association with words expressing contents of the respective images, converts the conversion object portion of the natural language sentences to the converted image to generate the combined sentences, and makes the combined sentences displayed. A part of the natural language sentences are thus converted to the image.Type: ApplicationFiled: November 24, 2021Publication date: June 1, 2023Applicant: ADEU.NEK CorporationInventor: Kenichi UEDA
-
Patent number: 10862261Abstract: A laser medium unit includes: a plate-shaped laser gain medium which includes a first surface and a second surface opposite to the first surface and generates emission light by the irradiation of excitation light from the first surface; a reflection member that is provided on the second surface so as to reflect the excitation light and the emission light; and a cooling member that cools the laser gain medium. The laser gain medium includes an irradiation area which is irradiated with the excitation light and an outer area which is located outside the irradiation area when viewed from a thickness direction intersecting the first surface and the second surface. The cooling member is thermally connected to the second surface through the reflection member so that a cooling area of the laser gain medium is formed on the second surface.Type: GrantFiled: February 5, 2018Date of Patent: December 8, 2020Assignee: HAMAMATSU PHOTONICS K.K.Inventors: Kenichi Ueda, Koichi Iyama, Yoshinori Kato, Takashi Sekine, Toshiyuki Kawashima
-
Patent number: 10826263Abstract: A laser medium unit includes: a plate-shaped laser gain medium which includes a first surface and a second surface opposite to the first surface and generates emission light by the irradiation of excitation light from the first surface; a reflection member that is provided on the second surface so as to reflect the excitation light and the emission light; and a cooling member that cools the laser gain medium. The laser gain medium includes an irradiation area which is irradiated with the excitation light and an outer area which is located outside the irradiation area when viewed from a thickness direction intersecting the first surface and the second surface. The cooling member is thermally connected to the second surface through the reflection member so that a cooling area of the laser gain medium is formed on the second surface.Type: GrantFiled: February 5, 2018Date of Patent: November 3, 2020Assignee: Hamamatsu Photonics K.K.Inventors: Kenichi Ueda, Koichi Iyama, Yoshinori Kato, Takashi Sekine, Toshiyuki Kawashima
-
Publication number: 20190356105Abstract: A laser medium unit includes: a plate-shaped laser gain medium which includes a first surface and a second surface opposite to the first surface and generates emission light by the irradiation of excitation light from the first surface; a reflection member that is provided on the second surface so as to reflect the excitation light and the emission light; and a cooling member that cools the laser gain medium. The laser gain medium includes an irradiation area which is irradiated with the excitation light and an outer area which is located outside the irradiation area when viewed from a thickness direction intersecting the first surface and the second surface. The cooling member is thermally connected to the second surface through the reflection member so that a cooling area of the laser gain medium is formed on the second surface.Type: ApplicationFiled: February 5, 2018Publication date: November 21, 2019Applicant: HAMAMATSU PHOTONICS K.K.Inventors: Kenichi UEDA, Koichi IYAMA, Yoshinori KATO, Takashi SEKINE, Toshiyuki KAWASHIMA
-
Patent number: 9695513Abstract: A hydrophobization treatment apparatus includes a cooling device which cools a substrate, a light irradiation device which irradiates thermal radiation light from light sources onto front surface of the substrate, a gas supply device which supplies hydrophobization-treatment gas to the substrate, an exhaust device which exhausts the gas, a lifting device which moves the substrate such that the lifting device raises and lowers the substrate between the cooling device and light sources, and a control device which has circuitry to control the light irradiation device, the gas supply device, the exhaust device and the lifting device. The circuitry of the control device executes first gas supply control to discharge and exhaust the gas into and from the space between the gas container and substrate, and after the first control, second gas supply control to discharge and exhaust the gas into and from the space between the gas container and substrate.Type: GrantFiled: August 27, 2015Date of Patent: July 4, 2017Assignee: TOKYO ELECTRON LIMITEDInventor: Kenichi Ueda
-
Patent number: 9558960Abstract: A substrate processing method includes a coating step that applies a coating liquid to a substrate having a front surface on which a pattern is formed, thereby forming a coating film on the substrate, a film removing step that heats the substrate to gasify components of the coating film thereby to reduce a thickness of the film, and a film curing step that is performed after or simultaneously with the film removing step and that heats the substrate to cure the coating film through crosslinking reaction. The film removing step is performed under conditions ensuring that an average thickness of the cured coating film is not greater than 80% of an average thickness of the coating film before being subjected to the film removing step.Type: GrantFiled: December 24, 2015Date of Patent: January 31, 2017Assignee: Tokyo Electron LimitedInventors: Takahiro Shiozawa, Kenichi Ueda
-
Patent number: 9552987Abstract: A substrate processing method is performed to improve surface roughness of a pattern mask formed on a substrate by being exposed and developed. The method includes supplying a first solvent in a gaseous state to a surface of the substrate to dissolve the pattern mask, and supplying a second solvent to the surface of the substrate, which is supplied with the first solvent, to dissolve the pattern mask, wherein a permeability of the second solvent is lower than a permeability of the first solvent.Type: GrantFiled: June 6, 2014Date of Patent: January 24, 2017Assignee: TOKYO ELECTRON LIMITEDInventors: Yuichiro Miyata, Keiichi Tanaka, Kenichi Ueda, Takahiro Shiozawa
-
Patent number: 9434094Abstract: A molding die includes a die having a mold plane; and gloss control granules composed of 50 to 80 pbw of a shape retention fixation base material such as a thermosetting resin; 30 to 80 pbw of a diffuse reflecting surface formation core material such as a ceramic powder; and 5 to 10 pbw of a roughness enhancement material such as an inorganic fiber, adhered to the mold plane in a spaced-apart manner. The gloss control granules are each independently adhered in the spaced-apart manner to form gloss control projections on the mold plane of the die so that a surface of a molded product molded on the die forms a surface having a small specular reflection or a diffuse reflection, and the gloss control projections having fine, uneven surfaces with recesses and projections are formed on the mold plane at a coating rate of 40 to 80%.Type: GrantFiled: February 21, 2012Date of Patent: September 6, 2016Assignee: TANAZAWA HAKKOSHA CO., LTD.Inventors: Kenichi Ueda, Mitsushi Sogabe
-
Publication number: 20160189974Abstract: A substrate processing method includes a coating step that applies a coating liquid to a substrate having a front surface on which a pattern is formed, thereby forming a coating film on the substrate, a film removing step that heats the substrate to gasify components of the coating film thereby to reduce a thickness of the film, and a film curing step that is performed after or simultaneously with the film removing step and that heats the substrate to cure the coating film through crosslinking reaction. The film removing step is performed under conditions ensuring that an average thickness of the cured coating film is not greater than 80% of an average thickness of the coating film before being subjected to the film removing step.Type: ApplicationFiled: December 24, 2015Publication date: June 30, 2016Inventors: Takahiro Shiozawa, Kenichi Ueda
-
Publication number: 20150361559Abstract: A hydrophobization treatment apparatus includes a cooling device which cools a substrate, a light irradiation device which irradiates thermal radiation light from light sources onto front surface of the substrate, a gas supply device which supplies hydrophobization-treatment gas to the substrate, an exhaust device which exhausts the gas, a lifting device which moves the substrate such that the lifting device raises and lowers the substrate between the cooling device and light sources, and a control device which has circuitry to control the light irradiation device, the gas supply device, the exhaust device and the lifting device. The circuitry of the control device executes first gas supply control to discharge and exhaust the gas into and from the space between the gas container and substrate, and after the first control, second gas supply control to discharge and exhaust the gas into and from the space between the gas container and substrate.Type: ApplicationFiled: August 27, 2015Publication date: December 17, 2015Applicant: TOKYO ELECTRON LIMITEDInventor: Kenichi Ueda
-
Publication number: 20150212960Abstract: The power consumption of a USB 3.0 hub is reduced, and the interconnection between the USB 3.0 hub and USB 3.0 devices is improved. On receiving a data transfer request packet, which is transferred by a DS port in a low power consumption state, from a host, an SS controller of an SS hub makes the DS port transmit an LFPS for returning a destination device of the data transfer request packet to U0 state, and transmits a transfer enable packet, which is generated by the SS controller itself and shows that the destination device has become ready to correspond to the data transfer, to the host after transmitting a transfer deferment packet to the host. The SS controller does not execute a process that is specified in USB 3.0, and in which a transfer deferment packet is transmitted to the destination device after the DS port return to U0 state.Type: ApplicationFiled: December 30, 2014Publication date: July 30, 2015Inventors: Kenichi Ueda, Tadahiro Watanabe, Chie Hinoma
-
Publication number: 20140363976Abstract: A substrate processing method is performed to improve surface roughness of a pattern mask formed on a substrate by being exposed and developed. The method includes supplying a first solvent in a gaseous state to a surface of the substrate to dissolve the pattern mask, and supplying a second solvent to the surface of the substrate, which is supplied with the first solvent, to dissolve the pattern mask, wherein a permeability of the second solvent is lower than a permeability of the first solvent.Type: ApplicationFiled: June 6, 2014Publication date: December 11, 2014Inventors: Yuichiro MIYATA, Keiichi TANAKA, Kenichi UEDA, Takahiro SHIOZAWA
-
Publication number: 20130141792Abstract: [Problem to be Solved] Provided are a molding die by which a molded article with a reduced gloss can be molded; and a manufacturing method therefor, and provided are a method for matching the gloss levels of molded articles, by which the glosses of the surfaces of the molded articles molded with materials such as different synthetic resins can be matched; a molding die; and a manufacturing method therefor.Type: ApplicationFiled: February 21, 2012Publication date: June 6, 2013Applicant: TANAZAWA HAKKOSHA CO., LTD.Inventors: Kenichi Ueda, Mitsushi Sogabe
-
Patent number: 7972680Abstract: To realize a resin composition which enables formation of a film having excellent film formability and bending resistance and having a small retardation. A resin composition of the present invention comprises: an acrylic resin as a main component; and organic fine particles whose average particle diameter ranges from 0.01 ?m to 1 ?m, wherein a glass transition temperature of the acrylic resin ranges from 110° C. to 200° C., and each of the organic fine particles has a structural unit of a vinyl cyanide monomer and a structural unit of an aromatic vinyl monomer.Type: GrantFiled: February 21, 2007Date of Patent: July 5, 2011Assignee: Nippon Shokubai Co., Ltd.Inventors: Kenichi Ueda, Shigeo Otome, Akio Naka
-
Publication number: 20100168340Abstract: To realize a resin composition which enables formation of a film having excellent film formability and bending resistance and having a small retardation. A resin composition of the present invention comprises: an acrylic resin as a main component; and organic fine particles whose average particle diameter ranges from 0.01 ?m to 1 ?m, wherein a glass transition temperature of the acrylic resin ranges from 110° C. to 200° C., and each of the organic fine particles has a structural unit of a vinyl cyanide monomer and a structural unit of an aromatic vinyl monomer.Type: ApplicationFiled: February 21, 2007Publication date: July 1, 2010Applicant: NIPPON SHOKUBAI CO., LTDInventors: Kenichi Ueda, Shigeo Otome, Akio Naka
-
Patent number: 7657673Abstract: A data transfer control device, which transfers a large capacity of data speedily and sequentially, has three buffers that are used as a WR (write) buffer, an intermediate buffer, and an RD (read) buffer. To send data sequentially, the data transfer control device switches-over the buffers in one of the following three ways (A), (B), and (C), using determination flags indicating whether the buffers store effective data (data not yet referenced). A buffer control device switches-over (A) the WR buffer and RD buffer if a WR buffer effective flag 33 is on and an intermediate buffer effective flag 34 and an RD buffer effective flag 35 are off, (B) the WR buffer and the intermediate buffer if the WR buffer effective flag 33 and the RD buffer effective flag 35 are on and the intermediate buffer effective flag 34 is off, and (C) the intermediate buffer and the RD buffer if the intermediate buffer effective flag 34 is on and the RD buffer effective flag 35 is off.Type: GrantFiled: February 24, 2006Date of Patent: February 2, 2010Assignee: NEC Electronics CorporationInventor: Kenichi Ueda
-
Patent number: 7448087Abstract: A recording medium is provided which is protected against unauthorized use and has heightened security. The recording medium stores storage authentication information that authenticates a user, and has an area that corresponds to the storage authentication information. The recording medium further includes a tamper-resistant authentication unit that judges whether or not received authentication information that authenticates a user matches the storage authentication information. The authentication unit is prevented from being decoded or tampered by third parties. In addition, it is possible to restrict access to the area according to the content of authentication.Type: GrantFiled: July 17, 2003Date of Patent: November 4, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Motoji Ohmori, Kenichi Ueda, Eiji Ueda