Patents by Inventor Kenichi Watanabe

Kenichi Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220011213
    Abstract: A particle size distribution measurement device includes a cell holding body 31 that holds a measurement cell 2 containing a measurement sample and a dispersion medium and a reference cell 6 containing a reference sample and is rotated by a motor 322, and a cell discrimination mechanism 7 that discriminates the cells 2, 6 passing through a predetermined rotation position by using a magnetic force or electrostatic capacitance.
    Type: Application
    Filed: October 29, 2019
    Publication date: January 13, 2022
    Inventors: Tetsuji YAMAGUCHI, Hitoshi WATANABE, Hidetaka OSAWA, Ken ASAKURA, Kenichi NEMOTO
  • Patent number: 11220032
    Abstract: To manufacture a sprue-bush which is capable of suitably cooling a melt raw resin in a raw resin-flow path as a whole, there is provided a method for manufacturing a sprue-bush, wherein a shaped part is located on a base part to manufacture the sprue-bush, the base part comprising a raw resin-flow path and a cooling medium-flow path, wherein, in the shaped part, a downstream raw resin-flow path portion is located and a downstream cooling medium-flow path portion is also located, the downstream raw resin-flow path portion corresponding to a downstream side region of a raw resin-flow path of the sprue-bush, the downstream cooling medium-flow path portion being positioned around the downstream raw resin-flow path portion and corresponding to a downstream side region of a cooling medium-flow path of the sprue-bush, and wherein the downstream cooling medium-flow path portion is located to surround the downstream raw resin-flow path portion.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: January 11, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Shinya Watanabe, Satoshi Abe, Kenichi Tanaka, Mikio Mori, Yoshiyuki Uchinono
  • Publication number: 20220004846
    Abstract: Utilizing a trained generative adversarial network (GAN) model to cause a computer to output multivariate forecasted time-series data by providing a trained GAN model, the GAN model comprising dilated convolutional layers for receiving time-series multivariate data, receiving time-series multivariable biometric data, generating, using the GAN model, successive time series multivariate biometric data according to the time-series multivariate biometric data, determining an outcome according to the successive time-series multivariate biometric data, and providing an output associated with the outcome.
    Type: Application
    Filed: July 1, 2020
    Publication date: January 6, 2022
    Inventors: Mari Abe Fukuda, Kenichi Takasaki, Yuka Sasaki, Shoichiro Watanabe, Yasutaka Nishimura
  • Patent number: 11213945
    Abstract: A robot simulator includes a storage device that stores model information related to the robot and an obstacle in the vicinity of the robot, and an acquisition device that obtains first input information defining a start position and an end position of operation of the robot. A processing device generates a path for moving the distal end portion of the robot from the start position to the end position while avoiding collisions between the robot and the obstacle based on the first input information and the model information. The processing device also generates image data including an illustration of the obstacle and an index indicating a via-point of the path.
    Type: Grant
    Filed: February 19, 2018
    Date of Patent: January 4, 2022
    Inventors: Koichi Kuwahara, Yoshifumi Onoyama, Kenichi Yasuda, Wataru Watanabe
  • Publication number: 20210403701
    Abstract: A curable resin composition including components (A), (B), (C) and (D) below: component (A): a bisphenol epoxy resin with a softening point of 80° C. or more, component (B): a bisphenol epoxy resin which is liquid at 25° C., component (C): a bi- or more-functional (meth)acrylate compound, and component (D): a curing agent.
    Type: Application
    Filed: September 9, 2021
    Publication date: December 30, 2021
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Hisaya USHIYAMA, Nao DEGUCHI, Kenichi WATANABE, Juichi FUJIMOTO
  • Patent number: 11207906
    Abstract: A cleaning device includes a cleaning unit which removes foreign matter adhered on a conveyance face of a conveyance member conveying a sheet, by using a belt shaped web; and a unit moving mechanism which displaces the cleaning unit to a cleaning position where the cleaning unit comes into contact with the conveyance face and to a separation position separated away from the cleaning position. The cleaning unit includes a delivery roller delivering the web, a pressure roller bringing the web pressure-contact with the conveyance face and a winding roller winding the web passed the conveyance face. The cleaning unit is tilted such that a cleaning face of the web between the pressure roller and the winding roller faces upward as the cleaning unit is displaced from the cleaning position to the separation position.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: December 28, 2021
    Assignee: KYOCERA Document Solutions Inc.
    Inventors: Kenichi Satake, Takeshi Watanabe, Hiroki Sakane, Yasuhiro Michishita, Masato Usui, Yuzuru Yuasa, Yusuke Tamekuni, Shinobu Ohata, Naoto Miyakoshi, Shunsuke Yamasaki, Hiroatsu Tamai
  • Patent number: 11198172
    Abstract: A method for joining members according to the present invention includes: providing a first member, a second member, a guide shaft member, a rubber member, a first plunger, a second plunger, and a drive mechanism; inserting the second member into a hole portion of the first member; inserting the guide shaft member into a through-hole of the rubber member; inserting the rubber member, into which the guide shaft member is inserted, inside the second member; arranging an assembly in which the first member, the second member, the rubber member, and the guide shaft member so as to horizontally extend; arranging the assembly so as to be sandwiched by the first plunger and the second plunger; and moving the second plunger toward the first plunger; compressing the rubber member by the first plunger and the second plunger in a direction where the guide shaft member extends, and expanding the rubber member radially outside the guide shaft member; and thus expanding and deforming at least a portion of the second member
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: December 14, 2021
    Assignee: Kobe Steel, Ltd.
    Inventors: Yasuhiro Maeda, Toru Hashimura, Kenichi Watanabe, Takayuki Kimura
  • Patent number: 11183232
    Abstract: Disclosed herein is an apparatus that includes: first and second wiring patterns extending in a first direction, first and second transistors arranged adjacent to each other, and third to sixth wiring patterns extending in a second direction. The third wiring pattern is connected between the first wiring pattern and one of source/drain regions of the first transistor, the fourth wiring pattern is connected between the second wiring pattern and other of source/drain regions of the first transistor, the fifth wiring pattern is connected to one of source/drain regions of the second transistor, the fifth wiring pattern overlapping with the first wiring pattern, the sixth wiring pattern is connected to other of source/drain regions of the second transistor, the sixth wiring pattern overlapping with the second wiring pattern. The third and fourth wiring patterns are greater in width in the first direction than the fifth and sixth wiring patterns.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: November 23, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Toshiaki Tsukihashi, Kenichi Watanabe, Kazuyuki Morishige, Moeha Shibuya, Kumiko Ishii
  • Patent number: 11161975
    Abstract: A curable resin composition including components (A), (B), (C) and (D) below: component (A): a bisphenol epoxy resin with a softening point of 80° C. or more, component (B): a bisphenol epoxy resin which is liquid at 25° C., component (C): a bi- or more-functional (meth)acrylate compound, and component (D): a curing agent.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: November 2, 2021
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Hisaya Ushiyama, Nao Deguchi, Kenichi Watanabe, Juichi Fujimoto
  • Publication number: 20210276126
    Abstract: A joint structure is formed by joining a first plate-shaped member made of steel and a second plate-shaped member made of steel that is overlapped on the first plate-shaped member and that is formed in a long shape. A surface of the first plate-shaped member and both edge portions of the second plate-shaped member along a longitudinal direction are joined by a weld metal.
    Type: Application
    Filed: May 31, 2019
    Publication date: September 9, 2021
    Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
    Inventors: Liang CHEN, Kenichi WATANABE, Kazuya YASUI, Dongyong SHI, Masao HADANO, Takayuki KIMURA, Reiichi SUZUKI
  • Patent number: 11110874
    Abstract: A method for joining members according to an embodiment of the present invention includes: providing a bumper stay including two integrated pipe portions extending in an identical direction, the bumper stay including a recess provided between the pipe portions being adjacent to each other, the recess extending in a longitudinal direction of the pipe portions from end surfaces of the pipe portions, a part of the recess serving as a locking portion, and a bumper beam including a rear inclined wall formed with two hole portions into which the pipe portions of the bumper stay are insertable respectively; inserting the bumper stay into the hole portions of the bumper beam until the locking portion abuts on the rear inclined wall; and pipe-expanding an insertion portion of the bumper stay into the bumper beam to join the insertion portion to the bumper beam by press-fitting.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: September 7, 2021
    Assignee: Kobe Steel, Ltd.
    Inventors: Yasuhiro Maeda, Toru Hashimura, Kenichi Watanabe, Ryohei Yukishige, Taiki Yamakawa
  • Publication number: 20210269098
    Abstract: The joined body includes a joint portion including a linear welding portion in which a first metal member and a second metal member are joined. The joint portion includes a main linear portion being linear and extending along a first direction being a direction corresponding to a load assumed to act on a component obtained by machining the joined body. The main linear portion is a portion whose angle formed with the first direction is 0 degrees or more and 15 degrees or less in the joint portion. The joint portion includes a plurality of the main linear portions arranged at intervals in a second direction being a direction intersecting with the first direction.
    Type: Application
    Filed: June 3, 2019
    Publication date: September 2, 2021
    Applicant: KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.)
    Inventors: Kazuya YASUI, Kenichi WATANABE, Dongyong SHI, Masao HADANO, Liang CHEN
  • Publication number: 20210264967
    Abstract: Disclosed herein is an apparatus that includes: first and second wiring patterns extending in a first direction, first and second transistors arranged adjacent to each other, and third to sixth wiring patterns extending in a second direction. The third wiring pattern is connected between the first wiring pattern and one of source/drain regions of the first transistor, the fourth wiring pattern is connected between the second wiring pattern and other of source/drain regions of the first transistor, the fifth wiring pattern is connected to one of source/drain regions of the second transistor, the fifth wiring pattern overlapping with the first wiring pattern, the sixth wiring pattern is connected to other of source/drain regions of the second transistor, the sixth wiring pattern overlapping with the second wiring pattern. The third and fourth wiring patterns are greater in width in the first direction than the fifth and sixth wiring patterns.
    Type: Application
    Filed: February 25, 2020
    Publication date: August 26, 2021
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Toshiaki Tsukihashi, Kenichi Watanabe, Kazuyuki Morishige, Moeha Shibuya, Kumiko Ishii
  • Publication number: 20210229156
    Abstract: A method for manufacturing a press-molded article includes: preparing a patchwork blank in which a thickened portion is formed by welding patchwork to basework; bending only the thickened portion of the patchwork blank; and bending a portion other than the thickened portion in a step different from bending of the thickened portion.
    Type: Application
    Filed: May 13, 2019
    Publication date: July 29, 2021
    Applicant: KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.)
    Inventors: Kazuki SAKAMOTO, Kenichi WATANABE, Dongyong SHI
  • Patent number: 11052448
    Abstract: The member joining device includes: a tubular unit including a tubular assembly that is fixed, a flange portion whose position in a first central axis direction is fixed with respect to the tubular assembly; a shaft unit that includes a shaft assembly inserted into the tubular assembly in a linearly movable manner, and a protrusion portion whose position in a second central axis direction is fixed with respect to the shaft assembly, wherein the protrusion portion is positioned radially outside the first central axis of the tubular assembly, the protrusion portion faces the flange portion in the central axis direction; a rubber member arranged radially outside the tubular assembly, between the protrusion portion and the flange portion in the central axis direction; and a motion mechanism that moves the shaft unit in the central axis direction with respect to the tubular unit.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: July 6, 2021
    Assignee: Kobe Steel, Ltd.
    Inventors: Yasuhiro Maeda, Toru Hashimura, Kenichi Watanabe, Takayuki Kimura
  • Patent number: 11052446
    Abstract: A method for joining members includes: providing a wall surface body which is a die-molded article provided with a hole portion with a draft angle provided from its opposite end portions toward its center portion, a tubular body with a hollow shape, and an elastic body; inserting the tubular body into the hole portion in the wall surface body; inserting the elastic body into the inside of the tubular body; and compressing the elastic body in the direction of an axial line L of the tubular body to expand the elastic body outwardly in the radial direction of the axial line L, thereby deforming and expanding the tubular body to joint the tubular body to the wall surface body by press-fitting.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: July 6, 2021
    Assignee: Kobe Steel, Ltd.
    Inventors: Yasuhiro Maeda, Toru Hashimura, Kenichi Watanabe
  • Publication number: 20210196862
    Abstract: A composite material in one of embodiments includes a crystal phase of titanium fluoride and a metal crystal phase of titanium. The crystal phase of the titanium fluoride is present in a first region located away from a surface in a depth direction.
    Type: Application
    Filed: May 30, 2019
    Publication date: July 1, 2021
    Inventors: Kenichi SAIGA, Kenichi WATANABE, Masayuki KYOMOTO
  • Publication number: 20210175711
    Abstract: A power supply system includes: a synchronous generator connected to a three-phase power distribution system that is connected to a consumer load; an inverter that is connected to the power distribution system, supplies power to the consumer load, and compensates for unbalanced current of the synchronous generator; and a control device that generates a gate command for controlling the inverter. The control device: generates, based on a three-phase voltage and current output from the inverter, a target output voltage which is an amplitude of a vector in a complex plane combining voltages of three phases, and a target output phase which is a phase of the vector in the complex plane combining the voltages of three phases; generates a first compensation voltage, based on a current negative-phase-sequence component relating to the synchronous generator; and generates a gate command from the generated values.
    Type: Application
    Filed: March 6, 2017
    Publication date: June 10, 2021
    Inventors: Jin YOSHIZAWA, Kenichi WATANABE, Toshifumi ISE, Jia LIU
  • Patent number: 11011370
    Abstract: A method for manufacturing a semiconductor device includes: forming an ohmic electrode including Al on a semiconductor substrate; forming a SiN film covering the ohmic electrode; forming a first photoresist on the SiN film, the first photoresist having an opening pattern overlapping the ohmic electrode; performing ultraviolet curing of the first photoresist; forming an opening in the SiN film exposed through the opening pattern and causing a surface of the ohmic electrode to be exposed inside the opening; forming a barrier metal layer on the first photoresist and on the ohmic electrode exposed through the opening; forming a second photoresist in the opening pattern; performing a heat treatment on the second photoresist and covering the barrier metal layer overlapping the opening with the second photoresist; and etching the barrier metal layer using the second photoresist.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: May 18, 2021
    Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventor: Kenichi Watanabe
  • Publication number: 20210143002
    Abstract: A semiconductor device is made by: forming an ohmic electrode including Al on a semiconductor substrate; forming a SiN film covering the ohmic electrode; forming a first photoresist on the SiN film, the first photoresist having an opening pattern overlapping the ohmic electrode; performing ultraviolet curing of the first photoresist; forming an opening in the SiN film exposed through the opening pattern and causing a surface of the ohmic electrode to be exposed inside the opening; forming a barrier metal layer on the first photoresist and on the ohmic electrode exposed through the opening; forming a second photoresist in the opening pattern; performing a heat treatment on the second photoresist and covering the barrier metal layer overlapping the opening with the second photoresist; and etching the barrier metal layer using the second photoresist.
    Type: Application
    Filed: January 21, 2021
    Publication date: May 13, 2021
    Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventor: Kenichi WATANABE