Abstract: A heat treating device (50) has a cooling sleeve that covers a treating vessel (56) and a heater (100). The cooling sleeve has a cylindrical base member (110) and a cooling pipe (112) spirally wound on the outer peripheral surface hereof. The cooling pipe (112) is brazed to the base member (110).

Abstract: The present invention is a thermal processing unit including: a heating-furnace body whose upper end has an opening; a heating unit provided on an inside wall of the heating-furnace body; a reaction container consisting of a single tube contained in the heating-furnace body; a gas-discharging-pipe connecting portion formed at an upper portion of the reaction container; and a first temperature controlling unit provided around the gas-discharging-pipe connecting portion.

Abstract: There is provided a heat processing furnace capable of quickly increasing and decreasing a temperature, while achieving improvement in durability. A heat processing furnace 2 comprises: a processing vessel 3 for accommodating an object to be processed w and performing thereto a heat process; and a cylindrical heater 5 disposed to surround an outer circumference of the processing vessel 3, for heating the object to be processed w. The heater 5 includes a cylindrical heat insulating member 16, and heating resistors 18 arranged along an inner circumferential surface of the heat insulating member 16. Each of the heating resistors 18 is formed of a strip-shaped member that is bent into a waveform having peak portions and trough portions. Pin members 20 are arranged in the heat insulating member 16 at suitable intervals therebetween, the pin members 20 holding the heating resistor 18 such that the heating resistor 18 is movable in a radial direction of the heater.

Abstract: The present invention is a heat processing furnace comprising: a processing vessel for accommodating an object to be processed and performing thereto a heat process; and a cylindrical heater disposed to surround a circumference of the processing vessel, for heating the object to be processed; wherein: the heater includes a cylindrical heat insulating member, ribbed shelf sections that are axially formed in a tier-like manner on an inner circumference of the heat insulating member, and heating resistance wires of a helical pattern that are placed along the respective shelf sections; and pin members are arranged in the heat insulating member at suitable intervals therebetween, the pin members holding the heating resistance wires such that the heating resistance wires are movable in a radial direction of the heater, while preventing dropout of the heating resistance wires from the shelf sections.

Abstract: The present invention provides a heating apparatus for heating objects to be processed, which can detect a temperature of the objects to be processed with higher precision and accuracy, thereby to achieve higher precision temperature control. A heating apparatus 2 includes a processing vessel 8 configured to contain therein a plurality of objects W to be processed, the objects W including objects 58a to 58e to be processed for temperature measurement, each object 58a to 58e having each corresponding elastic wave element 60a to 60e, a heating means 10 adapted for heating the objects W to be processed, and a holding means 22 adapted to hold the objects W to be processed. To the processing vessel 8, a transmitter antenna 52 adapted to transmit an electric wave for measurement toward each elastic wave element 60a to 60e, and a receiver antenna 52 adapted to receive an electric wave having a frequency corresponding to the temperature and generated from each elastic wave element 60a to 60e are provided.

Abstract: A heat-processing furnace comprises: a processing vessel for housing an object to be processed to thermally heat the object to be processed; a cylindrical heat insulating member surrounding the processing vessel; a helical heating resistor disposed along an inner circumferential surface of the heat insulating member; and support members axially disposed on the inner circumferential surface of the heat insulating member, for supporting the heating resistor at predetermined pitches. A plurality of terminal plates are disposed outside the heating resistor at suitable intervals therebetween and attached to the heating resistor, the terminal plates radially passing through the heat insulating member to be extended outside. A plurality of fixing plates are disposed outside the heating resistor at suitable intervals therebetween and attached to the heating resistor, the fixing plates being fixed in the heat insulating member.

Abstract: The present invention is a thermal processing unit including: a heating-furnace body whose upper end has an opening; a reaction tube consisting of a single tube contained in the heating-furnace body; a gas-discharging-unit connecting portion formed at an upper portion of the reaction tube, the gas-discharging-unit connecting portion having a narrow diameter; a substrate-to-be-processed supporting member for supporting a substrate to be processed, contained in the heating-furnace body; and a heating unit for heating the substrate to be processed supported by the substrate-to-be-processed supporting member.

Abstract: A single-substrate heat-processing apparatus (2) for a semiconductor processing system includes a process container (4) configured to accommodate a target substrate (W). A support member (6) is disposed in the process container (4) and configured to support the target substrate (W) substantially in a horizontal state, while a bottom surface of the target substrate is exposed. A heating gas supply section (20) is disposed to generate a heating gas and supply the heating gas toward the bottom surface of the target substrate (W). A distribution member (16) is disposed within a flow passage of the heating gas supplied from the heating gas supply section (20), and configured to improve distribution uniformity of the heating gas onto the bottom surface of the target substrate (W).

Abstract: The present invention is a thermal processing unit including: a heating-furnace body whose upper end has an opening; a heating unit provided on an inside wall of the heating-furnace body; a reaction container consisting of a single tube contained in the heating-furnace body; a gas-discharging-pipe connecting portion formed at an upper portion of the reaction container; and a first temperature controlling unit provided around the gas-discharging-pipe connecting portion.

Abstract: The present invention is a thermal processing unit including: a heating-furnace body whose upper end has an opening; a heating unit provided on an inside wall of the heating-furnace body; a reaction container consisting of a single tube contained in the heating-furnace body; a gas-discharging-pipe connecting portion formed at an upper portion of the reaction container; and a first temperature controlling unit provided around the gas-discharging-pipe connecting portion.

Abstract: The present invention is a thermal processing unit that includes: a tubular processing container; an object-to-be-processed holding unit that holds a plurality of objects to be processed in a tier-like manner and that can be inserted into and taken out from the processing container; a process-gas introducing unit that introduces a predetermined process gas into the processing container; a heating unit provided in the processing container, the heating unit heating the plurality of objects to be processed held by the object-to-be-processed holding unit when the object-to-be-processed holding unit is inserted into the processing container; and a container cooling unit that cools an outside wall surface of the processing container.

Abstract: A single-substrate heat-processing apparatus (2) for a semiconductor processing system includes a process container (4) configured to accommodate a target substrate (W). A support member (6) is disposed in the process container (4) and configured to support the target substrate (W) substantially in a horizontal state, while a bottom surface of the target substrate is exposed. A heating gas supply section (20) is disposed to generate a heating gas and supply the heating gas toward the bottom surface of the target substrate (W). A distribution member (16) is disposed within a flow passage of the heating gas supplied from the heating gas supply section (20), and configured to improve distribution uniformity of the heating gas onto the bottom surface of the target substrate (W).

Abstract: The present invention is a thermal processing unit including: a heating-furnace body whose upper end has an opening; a reaction tube consisting of a single tube contained in the heating-furnace body; a gas-discharging-unit connecting portion formed at an upper portion of the reaction tube, the gas-discharging-unit connecting portion having a narrow diameter; a substrate-to-be-processed supporting member for supporting a substrate to be processed, contained in the heating-furnace body; and a heating unit for heating the substrate to be processed supported by the substrate-to-be-processed supporting member.

Abstract: A heat treating device (50) has a cooling sleeve that covers a treating vessel (56) and a heater (100). The cooling sleeve has a cylindrical base member (110) and a cooling pipe (112) spirally wound on the outer peripheral surface hereof. The cooling pipe (112) is brazed to the base member (110).

Abstract: The present invention is a thermal processing unit that includes: a tubular processing container; an object-to-be-processed holding unit that holds a plurality of objects to be processed in a tier-like manner and that can be inserted into and taken out from the processing container; a process-gas introducing unit that introduces a predetermined process gas into the processing container; a heating unit provided in the processing container, the heating unit heating the plurality of objects to be processed held by the object-to-be-processed holding unit when the object-to-be-processed holding unit is inserted into the processing container; and a container cooling unit that cools an outside wall surface of the processing container.

Abstract: The present invention is a thermal processing unit including: a heating-furnace body whose upper end has an opening; a heating unit provided on an inside wall of the heating-furnace body; a reaction container consisting of a single tube contained in the heating-furnace body; a gas-discharging-pipe connecting portion formed at an upper portion of the reaction container; and a first temperature controlling unit provided around the gas-discharging-pipe connecting portion.

Abstract: A closed-type cassette is mounted on a cassette stand disposed in a working region at a position corresponding to an opening formed in a wall separating the working region from a loading region. When the cassette is mounted on the cassette stand, a detecting device gives a signal to that effect to a controller. Then, the controller closes a valve to interrupt nitrogen gas supply into the loading region. A lid of the cassette is opened 20 to 30 sec after the interruption of nitrogen gas supply into the loading region and, then, nitrogen gas supply is resumed. The pressure difference between the loading region and the interior of the cassette is decreased by interrupting nitrogen gas supply into the loading region, so that the lid can be easily opened.

Abstract: A thermal processing apparatus includes a reaction vessel into which an object to be processed is conveyed, a furnace body disposed so as to surround the reaction vessel, and a heater disposed in a region surrounding the reaction vessel in the furnace body. The heater includes heating elements, each having a sealing member made of a ceramic material and a linear flexible resistance heat generating member sealed by the sealing member.

Abstract: A closed-type cassette is mounted on a cassette stand disposed in a working region at a position corresponding to an opening formed in a wall separating the working region from a loading region. When the cassette is mounted on the cassette stand, a detecting device gives a signal to that effect to a controller. Then, the controller closes a valve to interrupt nitrogen gas supply into the loading region. A lid of the cassette is opened 20 to 30 sec after the interruption of nitrogen gas supply into the loading region and, then, nitrogen gas supply is resumed. The pressure difference between the loading region and the interior of the cassette is decreased by interrupting nitrogen gas supply into the loading region, so that the lid can be easily opened.

Abstract: A thermal processing apparatus includes a reaction vessel into which an object to be processed is conveyed, a furnace body disposed so as to surround the reaction vessel, and a heater disposed in a region surrounding the reaction vessel in the furnace body. The heater includes heating elements, each having a sealing member made of a ceramic material and a linear flexible resistance heat generating member sealed by the sealing member.