Patents by Inventor Kenichiro Abe

Kenichiro Abe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6384371
    Abstract: A laser beam machining apparatus capable of highly accurate machining at a high speed. A parallel link mechanism including a plurality of links is fixed to a frame and a workpiece holder having moving means is provided thereunder. The links of the parallel link mechanism connect a movable member with a stationary member, and the movable member is moved with respect to the stationary member by the extending/retracting operation of the links. A laser head serving as a machining head is attached to the movable member. A supply line includes a laser transmitting optical fiber, pipes for supplying water, assist gas, etc., and an electrical signal line. A laser beam LB outputted from the laser head performs machining on a workpiece W on the workpiece holder. The supply line passes through a through hole formed inside link joint portions on the stationary member. Hollow motors for driving the links of the parallel link mechanism are mounted on the stationary member.
    Type: Grant
    Filed: October 8, 1999
    Date of Patent: May 7, 2002
    Assignee: Fanuc Ltd.
    Inventors: Ryo Hinei, Masaaki Uematu, Kuniyasu Matsumoto, Kenichiro Abe
  • Patent number: 6239413
    Abstract: In a light radiation annealing apparatus for annealing a semiconductor wafer, an infrared radiation cut filter is inserted between a lamp heater and the semiconductor wafer to cut an infrared component of light emitted from the light source. Thus, the semiconductor wafer is annealed by the light irradiation apparatus to an approximate temperature irrespective of the resistivity of the semiconductor substrate.
    Type: Grant
    Filed: November 12, 1999
    Date of Patent: May 29, 2001
    Assignee: NEC Corporation
    Inventor: Kenichiro Abe
  • Patent number: 6222738
    Abstract: A packaging structure of semiconductor elements and for mounting such elements on which high density pads are formed on a board at a high production yield, where bumps or gold wires are bonded in a staggered manner within a pad on a semiconductor element. The spaces between bumps or gold wires can be widened without changing the semiconductor element.
    Type: Grant
    Filed: March 18, 1998
    Date of Patent: April 24, 2001
    Assignee: Fujitsu Limited
    Inventors: Yoshinobu Maeno, Kenichiro Abe, Kouzi Soekawa
  • Patent number: 6180898
    Abstract: An emergency stop switch mechanism for a robot which can take an emergency position when an external operation force is released and when a strong external operation force is applied. When the robot operation is started, a main lever La is pushed down from the OFF state with a normal external operation force. Since an elastic biasing force S2 is sufficiently larger than S1, a second ancillary lever Lc is pushed by a plunger PL and is turned downward together with a first ancillary lever Lb. A movable contact element ME of a contact mechanism section CM is moved to the ON position by the second ancillary lever Lc, so that the ON state (motion permitting state) is established. If emergency stop becomes necessary, the pressure of the main lever La is released from this state, or a specially strong force is applied to the main lever La. When the former is selected, the movable contact element ME is returned to the OFF position.
    Type: Grant
    Filed: December 21, 1998
    Date of Patent: January 30, 2001
    Assignee: Fanuc Ltd.
    Inventors: Akihiro Terada, Mitsuhiro Yasumura, Kenichiro Abe
  • Patent number: 5743145
    Abstract: A gear mechanism in which the backlash between bevel gears can be easily adjusted is provided. The gear mechanism has first and second bevel gears which engage with each other; a supporting member, including first and second threaded portions, for the first and second bevel gears, and first and second bearings for rotatably supporting the first and second bevel gears on the supporting member. The first and second bearing include cylindrical members with threaded portions for engagement with the first and second threaded portions of the supporting member.
    Type: Grant
    Filed: December 27, 1995
    Date of Patent: April 28, 1998
    Assignee: Fanuc Ltd.
    Inventors: Akihiro Terada, Kenichiro Abe
  • Patent number: 5549778
    Abstract: A manufacturing method for a multilayer ceramic substrate superior in adhesion between the substrate and thick film pads formed on the surface of the substrate. Copper paste is screen-printed on a glass-ceramics green sheet for forming a surface layer to form a plurality of surface thick film pads respectively connected to a plurality of vias formed in the green sheet. Each of the surface thick film pads is partially covered with a dielectric material. Then, a plurality of green sheets for forming inner layers and the surface-layer green sheet are laminated together so that the surface-layer green sheet forms an uppermost layer. The laminated sheets are bonded integrally with each other by applying heat and pressure, and are then fired at a predetermined temperature for a predetermined time.
    Type: Grant
    Filed: August 25, 1995
    Date of Patent: August 27, 1996
    Assignee: Fujitsu Limited
    Inventors: Hiromitsu Yokoyama, Katsuto Takeuchi, Koji Soekawa, Kenichiro Abe, Syouichi Hattori, Hitoshi Suzuki, Nobuhide Okada
  • Patent number: 5116657
    Abstract: Vias each having no pore are formed in a multilayer ceramic substrate by filling through holes of green sheets with conducting material obtained by: kneading mixed powder particles, the powder particles produced by adding copper oxide powder particles in the amount of 50% (in weight) or less to copper powder particles, with a solution including methyl ethyl ketone and 0.5% (in weight) of isosulfonyltridecylbenzene titanate; drying and cracking the kneaded mixed powder particles, producing cracked mixed powder particles; classifying the cracked mixed powder particles with a 100 mesh filter, producing classified mixed powder particles; spheroidizing the classified mixed powder particles with a collision method performed in gases flowing at high speed; and firing the green sheets at a temperature of about 800.degree. C.
    Type: Grant
    Filed: December 1, 1989
    Date of Patent: May 26, 1992
    Assignee: Fujitsu Limited
    Inventor: Kenichiro Abe
  • Patent number: 5087413
    Abstract: Vias each having no pore are formed in a multilayer ceramic substrate by filling through holes of green sheets with conducting material obtained by: kneading mixed powder particles, the powder particles produced by adding copper oxide powder particles in the amount of 50% (in weight) or less to copper powder particles, with a solution including methyl ethyl ketone and 0.5% (in weight) of isosulfonyltridecylbenzene titanate; drying and cracking the kneaded mixed powder particles, producing cracked mixed powder particles; classifying the cracked mixed powder particles with a 100 mesh filter, producing classified mixed powder particles; spheroidizing the classified mixed powder particles with a collision method performed in gases flowing at high speed; and firing the green sheets at a temperature of about 800.degree. C.
    Type: Grant
    Filed: January 9, 1991
    Date of Patent: February 11, 1992
    Assignee: Fujitsu Limited
    Inventor: Kenichiro Abe
  • Patent number: 5080966
    Abstract: Vias each having no pore are formed in a multilayer ceramic substrate by filling through holes of green sheets with conducting material obtained by: kneading mixed powder particles, adding copper oxide powder particles 50% (in weight) or less to copper powder particles, with a solution including methyl ethyl ketone and 0.5% (in weight) of isosulfonyltridecylbenzene titanate; drying and cracking the kneaded mixed powder particles, producing cracked mixed powder particles; classifying the cracked mixed powder particles with a 100 mesh filter, producing classified mixed powder particles; spheroidizing the classified mixed powder particles with a collision method performed in gases flowing at high speed; and firing the green sheets at a temperature of about 800.degree. C.
    Type: Grant
    Filed: January 9, 1991
    Date of Patent: January 14, 1992
    Assignee: Fujitsu Limited
    Inventor: Kenichiro Abe
  • Patent number: D415121
    Type: Grant
    Filed: July 9, 1998
    Date of Patent: October 12, 1999
    Assignee: FANUC Limited
    Inventors: Masaaki Uematsu, Kenichiro Abe
  • Patent number: D433043
    Type: Grant
    Filed: September 9, 1999
    Date of Patent: October 31, 2000
    Assignee: Fanuc Ltd.
    Inventors: Masaaki Uematsu, Kuniyasu Matsumoto, Kenichiro Abe