Abstract: An aluminum alloy brazing sheet including a core material, a sacrificial material provided on one surface of the core material, a brazing filler material provided on the other surface side of the core material, and an intermediate layer provided between the core material and the brazing filler material. The core material contains Si: 0.30 to 1.00 mass %, Mn: 0.50 to 2.00 mass %, Cu: 0.60 to 1.20 mass %, Mg: 0.05 to 0.80 mass %, and Al. The sacrificial material contains Si: 0.10 to 1.20 mass %, Zn: 2.00 to 7.00 mass %, Mn: 0.40 mass % or less, and Al. The intermediate layer contains Si: 0.05 to 1.20 mass %, Mn: 0.50 to 2.00 mass %, Cu: 0.10 to 1.20 mass %, and Al.

Abstract: A display device includes a flexible display unit, an electronic component disposed on one surface thereof, and a coating layer that is elastically deformable to cover the electronic component, the coating layer has a fixed region fixed to one of the one surface of the flexible display unit and an end surface of an end portion, and a coating region configured to cover the electronic component is disposed inside the fixed region to be deformed to absorb distortion upon bending of the flexible display unit.

Abstract: The charging device and the charging system include a storage space for storing plate-like electronic apparatuses having power-receiving coils mounted on the end portion, and power-supplying coils which are provided on a surface facing the end portion and generate inductive currents in the power-receiving coils of the electronic apparatuses stored in the storage space.

Abstract: A display system includes: a display control device that inserts prescribed image data for lessening degradation of image quality in a middle of source data; and a display device that displays an image generated based on the source data and an image generated based on the prescribed image data.

Abstract: Mobile terminal (10) includes display section (103) that has a display maintenance property that eliminates the need to rely on electricity for retaining displayed contents, sensing section (107) that senses whether or not predetermined terminal device (20) is present within a predetermined range, and a display control section (108) that causes the display section (103) to display a predetermined image when the terminal device (20) is present outside the predetermined range.

Abstract: This information processing device (100) has: communication unit (110) that performs near-field wireless communication with other information processing devices; determination unit (120) that determines whether another information processing device (100) has come into proximity on the basis of the communication result of the communication unit (110); and control unit (130) that, if the determination result of the determination unit (120) indicates that another information processing device (100) has come into proximity, causes the communication unit (110) to transition to a reception mode and, if the determination result from the determination unit (120) indicates that another information processing device (100) has not come into proximity, causes the communication unit (110) to transition to a transmission mode.

Abstract: To make it possible to easily keep a terminal device stable while holding lower corner portions (two corners) at both ends of a terminal device with both hands and while placing the terminal device on a horizontal plane in a curved state, the terminal device, which has a first and second end part that are separated from and oppose each other, is provided with a flexible display device and a first constituent part and second constituent part configured from electronic components. The first constituent part is disposed in the first end part, and the second constituent part is disposed in the second end part.

Abstract: An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.

Abstract: An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.

Abstract: An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.

Abstract: A holder of a magnetic storage apparatus is suggested that can efficiently absorb the shock when a vibration or shock is applied to the magnetic storage apparatus. A plurality of holding members (first shock absorbing material foam rubber 340 and second shock absorbing material foam rubber 350) that hold at least two corner parts of the magnetic storage apparatus 320 is included. The holding members are configured in a way that a total sum of holding power to hold one of opposite angles of the magnetic storage apparatus 320 and a total sum of holding power to hold the other of opposite angles are different. The first shock absorbing material foam rubber 340 is disposed on one of opposite angles, and the second shock absorbing material foam rubber 350 is disposed on the other of the opposite angles. The first shock absorbing material foam rubber 340 has greater hardness than the hardness of the second shock absorbing material foam rubber 350.

Abstract: Stress concentration at the connecting portion of the electronic component and the curved board and the area around the connecting portion is suppressed. In a flexible wiring board, insulation layers (11, 13) and wiring layers (12, 15) are piled up alternately and wiring layers (12, 15) are via-connected each other. The board comprises reinforced area (10a) reinforced against external stress, bending area (10c) bending easier than the reinforced area (10a) by external stress, and a stress relaxation area (10b) provided in area between the reinforced area (10a) and the bending area (10c), bending easier than the reinforced area (10a) but not easier than the bending area (10c) by the external stress, and relaxing the stress carried from the bending area (10c) to the reinforced area (10a).

Abstract: An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.

Abstract: A holder of a magnetic storage apparatus is suggested that can efficiently absorb the shock when a vibration or shock is applied to the magnetic storage apparatus. A plurality of holding members (first shock absorbing material foam rubber 340 and second shock absorbing material foam rubber 350) that hold at least two corner parts of the magnetic storage apparatus 320 is included. The holding members are configured in a way that a total sum of holding power to hold one of opposite angles of the magnetic storage apparatus 320 and a total sum of holding power to hold the other of opposite angles are different. The first shock absorbing material foam rubber 340 is disposed on one of opposite angles, and the second shock absorbing material foam rubber 350 is disposed on the other of the opposite angles. The first shock absorbing material foam rubber 340 has greater hardness than the hardness of the second shock absorbing material foam rubber 350.

Abstract: To restrain the stress concentration at the connecting portion of the electronic component and the curved board and the area around the connecting portion even when the electronic component is mounted on the curved board. A flexible wiring board in which a plurality of insulation layers (11, 13) and wiring layers (12, 15) are piled up alternately and the wiring layers (12, 15) are connected each other by a via conductor (14), and the board comprises a reinforced area (10a) being reinforced against an external stress, a bending area (10c) bending easier than the reinforced area (10a) by the external stress, and a stress relaxation area (10b) being provided in an area between the reinforced area (10a) and the bending area (10c), bending easier than the reinforced area (10a) by the external stress and not easier than the bending area (10c) by the external stress, and relaxing the stress carried from the bending area (10c) to the reinforced area (10a).

Abstract: An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.