Patents by Inventor Kenichiro Hanamura
Kenichiro Hanamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8112881Abstract: A process for manufacturing a multilayer wiring board including the steps of forming an insulating layer on a base provided with a bump for interlayer connection, bonding a copper foil onto the insulating layer by a thermocompression bonding by sandwiching the copper foil between stainless steel plates, and patterning the copper foil, in which a metal foil is interposed at least between each of the stainless plates and the copper foil at the time of the thermocompression bonding. At this time, a mold release layer is formed on a surface of the metal foil to be imposed. Thus, such a multilayer wiring board can be manufactured that prevents sticking of a product after molding (cementing of the copper foil) and excels in dimensional stability without occurrence of wrinkling and ruggedness.Type: GrantFiled: September 29, 2005Date of Patent: February 14, 2012Assignees: Tessera Interconnect Materials, Inc., Sony Chemical & Information Device CorporationInventors: Kazuhiro Shimizu, Masanobu Yagi, Kenichiro Hanamura, Mitsuyuki Takayasu, Kiyoe Nagai, Tomoo Iijima
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Patent number: 7745731Abstract: A transmission cable and method for manufacturing same are provided. A plurality of signal lines are formed on one side of an insulating layer and ground lines are formed between the signal lines. The ground lines are electrically connected with a shield layer formed on a back surface of the insulating layer through metal bumps formed and embedded in the insulating layer. Insulating layers and shield layers may be formed on opposite sides sandwiching the signal lines and the ground lines. In this case, the ground lines are electrically connected with the shield layers, respectively, through metal bumps on both sides thereof. Consequently, a highly reliable transmission cable capable of high rate transfer and large capacity transfer can be provided.Type: GrantFiled: April 29, 2008Date of Patent: June 29, 2010Assignees: Sony Corporation, Sony Chemical & Information Device CorporationInventors: Kazuyoshi Kobayashi, Kenichiro Hanamura, Tomomitsu Hori
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Patent number: 7429702Abstract: A transmission cable and method for manufacturing same are provided. A plurality of signal lines are formed on one side of an insulating layer and ground lines are formed between the signal lines. The ground lines are electrically connected with a shield layer formed on a back surface of the insulating layer through metal bumps formed and embedded in the insulating layer. Insulating layers and shield layers may be formed on opposite sides sandwiching the signal lines and the ground lines. In this case, the ground lines are electrically connected with the shield layers, respectively, through metal bumps on both sides thereof. Consequently, a highly reliable transmission cable capable of high rate transfer and large capacity transfer can be provided.Type: GrantFiled: January 2, 2007Date of Patent: September 30, 2008Assignees: Sony Chemical & Information Device Corporation, Sony CorporationInventors: Kazuyoshi Kobayashi, Kenichiro Hanamura, Tomomitsu Hori
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Publication number: 20080230254Abstract: A transmission cable and method for manufacturing same are provided. A plurality of signal lines are formed on one side of an insulating layer and ground lines are formed between the signal lines. The ground lines are electrically connected with a shield layer formed on a back surface of the insulating layer through metal bumps formed and embedded in the insulating layer. Insulating layers and shield layers may be formed on opposite sides sandwiching the signal lines and the ground lines. In this case, the ground lines are electrically connected with the shield layers, respectively, through metal bumps on both sides thereof. Consequently, a highly reliable transmission cable capable of high rate transfer and large capacity transfer can be provided.Type: ApplicationFiled: April 29, 2008Publication date: September 25, 2008Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATIONInventors: Kazuyoshi Kobayashi, Kenichiro Hanamura, Tomomitsu Hori
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Publication number: 20080110018Abstract: A process for manufacturing a multilayer wiring board including the steps of forming an insulating layer on a base provided with a bump for interlayer connection, bonding a copper foil onto the insulating layer by a thermocompression bonding by sandwiching the copper foil between stainless steel plates, and patterning the copper foil, in which a metal foil is interposed at least between each of the stainless plates and the copper foil at the time of the thermocompression bonding. At this time, a mold release layer is formed on a surface of the metal foil to be imposed. Thus, such a multilayer wiring board can be manufactured that prevents sticking of a product after molding (cementing of the copper foil) and excels in dimensional stability without occurrence of wrinkling and ruggedness.Type: ApplicationFiled: September 29, 2005Publication date: May 15, 2008Applicants: SONY CHEMICAL & INFORMATION DEVICE CORPORATION, TESSERA INTERCONNECT MATERIALS, INC.Inventors: Kazuhiro Shimizu, Masanobu Yagi, Kenichiro Hanamura, Mitsuyuki Takayasu, Kiyoe Nagai, Tomoo Iijima
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Publication number: 20070170598Abstract: There is provided a flexible circuit board 22 that, when deposited on another flexible circuit board 40, causes no gap to occur between wiring films 4a, 4a, of the flexible circuit board 40. Moreover, a plurality of flexible circuit boards are deposited on one another to provide a flexible multi-layer wiring circuit board having no gaps between the flexible circuit boards and having less bowing. In the flexible circuit board 22, the thickness of a bonding layer 16, 16a, on the opposed side of a bowing metallic member 2, of an inter-layer insulating film 10 where which bumps 6 are formed is greater than the thickness of a bonding layer on the side of metallic member 2. When the flexible circuit board 22 is deposited on the other flexible circuit board 40 to form a flexible multi-layer wiring circuit board 50, the bonding layer 16, 16a can be filled between the wiring films 4a, 4a, so that the flexible multi-layer wiring circuit board 50 has no gaps and a less bowing.Type: ApplicationFiled: May 10, 2004Publication date: July 26, 2007Applicants: NORTH CORPORATION, SONY CHEMICALS CORPORATIONInventors: Tomoo Iijima, Kenji Osawa, Kimitaka Endo, Yoshiaki Echigo, Akira Shigeta, Kazuyoshi Kobayashi, Kenichiro Hanamura
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Publication number: 20070120231Abstract: A transmission cable and method for manufacturing same are provided. A plurality of signal lines are formed on one side of an insulating layer and ground lines are formed between the signal lines. The ground lines are electrically connected with a shield layer formed on a back surface of the insulating layer through metal bumps formed and embedded in the insulating layer. Insulating layers and shield layers may be formed on opposite sides sandwiching the signal lines and the ground lines. In this case, the ground lines are electrically connected with the shield layers, respectively, through metal bumps on both sides thereof. Consequently, a highly reliable transmission cable capable of high rate transfer and large capacity transfer can be provided.Type: ApplicationFiled: January 2, 2007Publication date: May 31, 2007Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATIONInventors: Kazuyoshi Kobayashi, Kenichiro Hanamura, Tomomitsu Hori