Abstract: A water-impermeable cover includes an opening part extending toward an opening part of a holding ring of a stub shaft of a propeller shaft, and is disposed to face the opening part of the holding ring. The water-impermeable cover is fixed at a position to face the opening part of the holding ring of the stub shaft, and the opening part of the water-impermeable cover extends to approach the opening part of the holding ring: therefore, even if muddy water etc. scatters obliquely toward the opening part of the holding ring, the risk of muddy water etc. entering the opening part of the holding ring is reduced, and as a result, also the risk of muddy water etc. entering an interior of a center bearing is reduced.

Abstract: An electronic component package includes a circuit board which has a mounting surface that does not show wettability for fluxless solder and on which a semiconductor element is mounted, a soldering pattern that shows wettability for the fluxless solder and is formed to surround an area on which the semiconductor element is mounted, a lid that has a shape such that a cavity is formed between the lid and the circuit board, a bonding surface to the soldering pattern is formed in a ring shape, and does not show wettability for the fluxless solder, a solder bonded part that is formed by heating a solder precoat formed of the fluxless solder on a bonding surface of the lid, and a ventilation hole that is formed by providing a bonding surface of the lid exposed in a discontinuous part of the solder precoat after the solder bonded part is formed.

Abstract: An electronic component package includes a circuit board which has a mounting surface that does not show wettability for fluxless solder and on which a semiconductor element is mounted, a soldering pattern that shows wettability for the fluxless solder and is formed to surround an area on which the semiconductor element is mounted, a lid that has a shape such that a cavity is formed between the lid and the circuit board, a bonding surface to the soldering pattern is formed in a ring shape, and does not show wettability for the fluxless solder, a solder bonded part that is formed by heating a solder precoat formed of the fluxless solder on a bonding surface of the lid, and a ventilation hole that is formed by providing a bonding surface of the lid exposed in a discontinuous part of the solder precoat after the solder bonded part is formed.