Abstract: An impeller of a centrifugal includes, a plurality of full blades provided from the fluid inlet part to the fluid outlet part of the impeller; a plurality of splitter blades provided on the hub surface, wherein the geometry of a flow entering part of the splitter blade is compatible with the complicated flow inside the compressor so that the evenly distributed flow rate distribution, the increased pressure ratio and the enhanced efficiency are achieved. The leading edge blade angle ? in the tip end part of the flow entering front-end-part of the splitter blade 7 in the area of the higher height level from the hub surface is further inclined smoothly toward the blade suction surface side Sb of the full blade 5 in comparison with the inclination standard curve, the increased inclination angle becoming smoothly greater in response to the increase of the height level.

Abstract: It is intended to provide a cooling structure for a bearing housing for a turbocharger, the cooling structure being configured so that the cooling structure is manufactured with improved productivity, the occurrence of heat soak-back is reduced, and the cooling structure has improved cooling performance. The cooling structure is configured to cool both a bearing housing 13 and a bearing 52 by cooling water flowing through an annular cooling water path 13f formed in the bearing housing 13, and is provided with: a water path inlet 13h for supplying the cooling water and a water path outlet 13j for discharging the cooling water, which are provided in the bearing housing 13 so as to communicate with the annular cooling water path 13f and a partial partition 14a in the bearing housing 13 to partially close a water path which forms the shortest route between the water path inlet 13h and the water path outlet 13j.

Abstract: An axial cross-sectional shape of a scroll flow path 13 is a roughly circular shape, a diffuser outlet connected to the roughly circular shape is shifted to a position which is closer to a circle center than to a position of a tangent line to the circular shape and which does not reach the circle center, the circular shape is formed from a scroll chamber 30 which juts out in the axial direction relative to the position of the diffuser outlet 11a and a shift chamber 32 that forms a remainder of the roughly circular shape in a direction opposite to the scroll chamber 30, and the shift chamber 32 is at least formed on the scroll flow path 13 of a winding end portion 19 in a circumferential direction of a spiral.

Abstract: In a scroll shape of a centrifugal compressor, an enlargement rate of a ratio A/R of a cross-sectional area A of a scroll portion 12 to a radius R from an axis L1 of a compressor impeller 3 to a centroid P0 of a cross section of the scroll portion is reduced from a winding start to a winding end of the scroll portion.

Abstract: A scroll structure of a centrifugal compressor 1 having a spirally formed scroll passage 13. The scroll passage 13 includes: a flat connecting portion A at a flow passage joint 23 where a scroll start and a scroll end of the scroll passage 13 meet, this flat connecting portion having a flat cross-sectional shape with a same height as that of an outlet passage of a diffuser; and a transition part 21 where the flat cross-sectional shape of the flat connecting portion A gradually changes back to a circular cross-sectional shape along a circumferential direction.

Abstract: An impeller for a centrifugal compressor is characterized in that a shroud side of a front edge 7a of a splitter blade 7 is disposed so as to be displaced toward a negative-pressure surface Sb of a full blade 5F from a position equidistant from the full blades 5R and 5F in a circumferential direction such that a blade-end leakage vortex generated during a high flow rate which occurs from a blade-end clearance between the tip of the full blade 5F and a shroud toward the portion of the front edge 7a of the splitter blade 7 gets over the front edge 7a of the splitter blade 7.

Abstract: Interference of a leakage vortex flow generated at the tip end side of the full blade with the leading edge of the splitter blade is avoided and high pressure ratio and enhanced efficiency can be achieved. A throat of am impeller is formed so that a distance from a leading edge of a rear side full blade on the rear side of the rotation direction of the compressor to a front side full blade adjacent to the rear side full blade is minimized, and the leading edge of the splitter blade is placed in a fluid flow streaming along the flow passage between the mutually adjacent full blades, on the downstream side of a leakage vortex line formed to connect the middle location of the throat to the leading edge of the front side full blade.

Abstract: Present invention provides an electrodeposited copper foil with carrier foil that assure high bonding strength between a surface of the bulk copper layer and a resin substrate layer even when surface roughness is low, and hardly occurs delamination even when pin holes and the like remain in a bulk copper layer or in the side wall of the through holes or via holes and the like after contact with a desmear solution and the like. To solve such a problem, electrodeposited copper foil with carrier foil with a primer resin layer comprising a bonding interface layer, a bulk copper layer, a plated Ni—Zn alloy layer and a primer resin layer which is formed in this order at least on one surface of the carrier foil is applied.

Abstract: Providing an impeller of a centrifugal compressor, the impeller including, but not limited to: a plurality of full blades provided from the fluid inlet part to the fluid outlet part of the impeller, each full blade being arranged next to the adjacent full blade; a plurality of splitter blades provided on the hub surface, each splitter blade being provide between a full blade and the adjacent full blade from a location on a part way of the flow passage between the full blades to the fluid outlet part of the impeller, wherein the geometry of the flow entering part of the splitter blade is compatible with the complicated flow inside the compressor so that the evenly distributed flow rate distribution, the increased pressure ratio and the enhanced efficiency are achieved.

Abstract: The object is to provide copper foil of high adhesion even when the roughness Rz of a nodular surface of the copper foil is low, and a method of manufacturing the copper foil. To achieve this object, there is adopted a copper foil which is characterized in that an area coefficient C(S), which is defined by A(S)/B(S) from a three-dimensional surface area A(S), which is obtained by performing three-dimensional measurement of a surface area of a nodular surface of a copper foil sample S under a laser microscope, and from a measuring region area B(S), which is an area of a measuring region of the three-dimensional surface area A(S), and a roughness Rz(S) of a nodular surface of the copper foil sample S, which is measured by a stylus-type roughness meter, have a relationship of equation (1) below, and in that the roughness Rz(S) is 1.0 ?m to 3.0 ?m, 0.5×Rz(S)+0.5?C(S)??(1) where Rz(S) is a numerical value represented by ?m.

Abstract: The object is to provide copper foil of high adhesion even when the roughness Rz of a nodular surface of the copper foil is low, and a method of manufacturing the copper foil. To achieve this object, there is adopted a copper foil which is characterized in that an area coefficient C(S), which is defined by A(S)/B(S) from a three-dimensional surface area A(S), which is obtained by performing three-dimensional measurement of a surface area of a nodular surface of a copper foil sample S under a laser microscope, and from a measuring region area B(S), which is an area of a measuring region of the three-dimensional surface area A(S), and a roughness Rz(S) of a nodular surface of the copper foil sample S, which is measured by a stylus-type roughness meter, have a relationship of equation (1) below, and in that the roughness Rz(S) is 1.0 ?m to 3.0 ?m, 0.5×Rz(S)+0.5?C(S) ??(1) where Rz(S) is a numerical value represented by ?m.

Abstract: Present invention provides an electrodeposited copper foil with carrier foil that assure high bonding strength between a surface of the bulk copper layer and a resin substrate layer even when surface roughness is low, and hardly occurs delamination even when pin holes and the like remain in a bulk copper layer or in the side wall of the through holes or via holes and the like after contact with a desmear solution and the like. To solve such a problem, electrodeposited copper foil with carrier foil with a primer resin layer comprising a bonding interface layer, a bulk copper layer, a plated Ni—Zn alloy layer and a primer resin layer which is formed in this order at least on one surface of the carrier foil is applied.

Abstract: The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by press working at temperatures of not less than 200°C.

Abstract: The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by press working at temperatures of not less than 200° C.

Abstract: The invention provides a resin-coated composite foil characterized in that an organic insulating layer is disposed on an ultra-thin copper foil is disposed on a supporting metal layer through an intermediate organic release layer. The resin-coated composite foil is free from the peeling or blistering between the supporting metal foil and the ultra-thin copper foil during the production of a copper clad laminate.

Abstract: A composite material for use in making printed wiring boards comprising a carrier having releasable conductive fine particles on its surface. The composite is laminated to a substrate with the conductive fine particles facing the substrate and the carrier removed, leaving the surface of the conductive fine particles exposed. Printed wiring is formed using the conductive fine particles as its base, thus providing improved peel strength and permitting formation of fine wiring lines and spaces.

Abstract: A composite material for use in making printed wiring boards comprising a carrier having releasable conductive fine particles on its surface. The composite is laminated to a substrate with the conductive fine particles facing the substrate and the carrier removed, leaving the surface of the conductive fine particles exposed. Printed wiring is formed using the conductive fine particles as its base, thus providing improved peel strength and permitting formation of fine wiring lines and spaces.

Abstract: This invention provides a composite foil comprising an organic release layer between a metal carrier layer and an ultra-thin copper foil, and a process for producing such composite foils comprising the steps of depositing the organic release layer on the metal carrier layer and then forming an ultra-thin copper foil layer on said organic release layer, preferably by electrodeposition. The organic release layer preferably is a heterocyclic compound selected from triazoles, thiazoles, imidazoles, or their derivatives, and provides a uniform bond strength which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate. The invention also includes laminates made from such composite foils and printed wiring boards made from such laminates.

Abstract: This invention provides a composite foil comprising an organic release layer between a metal carrier layer and an ultra-thin copper foil, and a process for producing such composite foils comprising the steps of depositing the organic release layer on the metal carrier layer and then forming an ultra-thin copper foil layer on said organic release layer, preferably by electrodeposition. The organic release layer preferably is a heterocyclic compound selected from triazoles, thiazoles, imidazoles, or their derivatives, and provides a uniform bond strength which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate. The invention also includes laminates made from such composite foils and printed wiring boards made from such laminates.

Abstract: This invention provides a composite foil comprising an organic release layer between a metal carrier layer and an ultra-thin copper foil, and a process for producing such composite foils comprising the steps of depositing the organic release layer on the metal carrier layer and then forming an ultra-thin copper foil layer on said organic release layer by electrodeposition. The organic release layer preferably is a nitrogen-containing compound, a sulfur-containing compound, or a carboxylic acid, which provides a uniform bond strength which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate. The invention also includes laminates made from such composite foils and printed wiring boards made from such laminates.