Patents by Inventor Kenichiro Kai

Kenichiro Kai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating stacked nitride-compound semiconductor structure and method for fabricating nitride-compound semiconductor light emitting device
    Patent number: 8980664
    Abstract: According to one embodiment, a method for fabricating a stacked nitride-compound semiconductor structure includes forming a first protection film on a second surface of a substrate, forming a first nitride-compound semiconductor layer on the first surface of the substrate, forming a second protection film on the first nitride-compound semiconductor layer, removing the first protection film to expose the second surface of the substrate, forming a second nitride-compound semiconductor layer on the second surface of the substrate, and removing the second protection film to expose the first surface of the second nitride-compound semiconductor layer.
    Type: Grant
    Filed: March 9, 2012
    Date of Patent: March 17, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kenichiro Kai, Hideto Sugawara
  • METHOD FOR FABRICATING STACKED NITRIDE-COMPOUND SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING NITRIDE-COMPOUND SEMICONDUCTOR LIGHT EMMITING DEVICE
    Publication number: 20130065341
    Abstract: According to one embodiment, a method for fabricating a stacked nitride-compound semiconductor structure includes forming a first protection film on a second surface of a substrate, forming a first nitride-compound semiconductor layer on the first surface of the substrate, forming a second protection film on the first nitride-compound semiconductor layer, removing the first protection film to expose the second surface of the substrate, forming a second nitride-compound semiconductor layer on the second surface of the substrate, and removing the second protection film to expose the first surface of the second nitride-compound semiconductor layer.
    Type: Application
    Filed: March 9, 2012
    Publication date: March 14, 2013
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Kenichiro KAI, Hideto Sugawara
  • Sheet-like heating elements and preparation thereof
    Patent number: 5382382
    Abstract: A sheet-like heating element using an electrically conductive polymer complex consisting of a) a polycation of polyheteroaromatic compound; and b) a polyanion of thermoplastic polymer, containing a sulfated alcohol group in the repeating structural unit, having film-forming properties.
    Type: Grant
    Filed: March 11, 1993
    Date of Patent: January 17, 1995
    Assignee: Japat Ltd.
    Inventors: Toshikage Asakura, Wolfgang Wernet, Masaki Ohwa, Kenichiro Kai