Abstract: An information processing apparatus (10) includes a time and space information acquisition unit (110) that acquires high-risk time and space information indicating a spatial region with an increased possibility of an accident occurring or of a crime being committed and a corresponding time slot, a possible surveillance target acquisition unit (120) that identifies a video to be analyzed from among a plurality of videos generated by capturing an image of each of a plurality of places, on the basis of the high-risk time and space information, and analyzes the identified video to acquire information of a possible surveillance target, and a target time and space identification unit (130) that identifies at least one of a spatial region where surveillance is to be conducted which is at least a portion of the spatial region or a time slot when surveillance is to be conducted, from among the spatial region and the time slot indicated by the high-risk time and space information, on the basis of the information of the

Abstract: A video transmission apparatus (10) includes: a specified-position information acquisition unit (110) that acquires specified-position information indicating a specified position in an area to be surveilled including each imaging region corresponding to each of a plurality of imaging apparatuses; and a video transmission control unit (120) that selects at least one imaging apparatus from among the plurality of imaging apparatuses using imaging position information indicating a position or an imaging range of each of the plurality of imaging apparatuses and the specified-position information and transmits a video captured by the selected imaging apparatus to a video sharing apparatus that is to share the video.

Abstract: An information processing apparatus (5) includes: an information acquisition section (500) configured to acquire polishing conditions including top-ring state information, polishing-table state information, and polishing-fluid-supply-nozzle state information in the chemical mechanical polishing in chemical mechanical polishing of a substrate performed by a substrate processing apparatus including a polishing table configured to rotatably support a polishing pad, a top ring configured to press the substrate against the polishing pad, and a polishing-fluid supply nozzle configured to supply a polishing fluid onto the polishing pad; and a state prediction section (501) configured to predict substrate state information for the substrate on which the chemical mechanical polishing is performed under the polishing conditions by inputting the polishing conditions acquired by the information acquisition section (500) to a learning model (10A) having been generated by machine learning that causes the learning model (10

Abstract: A video transmission apparatus (10) includes: a specified-position information acquisition unit (110) that acquires specified-position information indicating a specified position in an area to be surveilled including each imaging region corresponding to each of a plurality of imaging apparatuses; and a video transmission control unit (120) that selects at least one imaging apparatus from among the plurality of imaging apparatuses using imaging position information indicating a position or an imaging range of each of the plurality of imaging apparatuses and the specified-position information and transmits a video captured by the selected imaging apparatus to a video sharing apparatus that is to share the video.

Abstract: An information processing apparatus (10) includes a time and space information acquisition unit (110) that acquires high-risk time and space information indicating a spatial region with an increased possibility of an accident occurring or of a crime being committed and a corresponding time slot, a possible surveillance target acquisition unit (120) that identifies a video to be analyzed from among a plurality of videos generated by capturing an image of each of a plurality of places, on the basis of the high-risk time and space information, and analyzes the identified video to acquire information of a possible surveillance target, and a target time and space identification unit (130) that identifies at least one of a spatial region where surveillance is to be conducted which is at least a portion of the spatial region or a time slot when surveillance is to be conducted, from among the spatial region and the time slot indicated by the high-risk time and space information, on the basis of the information of the

Abstract: A substrate processing apparatus A1 includes: cup 1 for storing processing solution 92 to process substrate 91; stage 2 to be raised and lowered along lifting shaft 31 extending in vertical direction z in cup 1; mount 4 provided on stage 2 to mount substrate 91; and pivoting member 5 attached to mount 4 such that pivoting member 5 is pivotable about pivoting shaft 51 provided along circumferential direction 6 centered at lifting shaft 31. Pivoting member 5 includes holding portion 52 located inward of pivoting shaft 51 in radial direction r, and abutting portion 53 located outward of pivoting shaft 51 in radial direction r. As stage 2 is lowered, abutting portion 53 abuts against cup 1 to cause pivoting of pivoting member 5, thereby reducing a distance between holding portion 52 and mount 4 with substrate 91 therebetween. These configurations reduce unintended effects in processing substrate 91.

Abstract: An improved apparatus for use in replacing a polishing pad is disclosed. processing system includes: a polishing device configured to polish a workpiece; a pad break-in device configured to perform a pad break-in process of a polishing pad; and a pad transporting device configured to transport a pad structure from the pad break-in device to the polishing device. The pad structure includes at least the polishing pad. The pad transporting device includes a liquid receiving tray arranged under the holding hand and configured to receive liquid dropped from the pad structure.

Abstract: A method for estimating a life of a polishing pad includes: polishing a workpiece by pressing the workpiece against a polishing surface of a polishing pad with an elastic membrane forming a pressure chamber provided in a polishing head; controlling a pressure in the pressure chamber on the basis of a measured value of a film thickness of the workpiece while measuring the film thickness during the polishing of the workpiece; inputting time-series pressure data representing a change in the pressure in the pressure chamber during the polishing of the workpiece into a learned model; and outputting a life index of the polishing pad from the learned model.

Abstract: The present disclosure provides a chemical supply apparatus, a cleaning system, and a chemical supply method that can supply a cleaning chemical to two nozzles and also supply the cleaning chemical at a set flow rate to one of the nozzles.

Abstract: A substrate cleaning device and a substrate polishing device are provided. The substrate cleaning device is provided in a substrate polishing device, which includes a polishing table having a polishing surface for polishing a substrate and a top ring holding the substrate with a membrane while surrounding an outer peripheral part of the substrate with a retainer ring, and cleaning the surface after polishing. The top ring is freely movable between a substrate polishing position above the table and a substrate handover position at a side of the table. The substrate cleaning device is provided corresponding to a cleaning position between the polishing and handover positions, and includes a first spray unit including cleaning nozzles for spraying cleaning liquid on the substrate, membrane, and retainer ring at the cleaning position; and a second spray unit including a substrate rinse nozzle spraying rinse liquid onto the substrate at the cleaning position.

Abstract: A hand for holding the substrate includes a hand main body and a plurality of seating members mounted on the hand main body and on which the substrate is to be seated. Each of the plurality of seating member includes a shaft member supported to the hand main body and a lever member that is supported to the shaft member and includes a first end portion including a seating portion on which the substrate is to be seated and a second end portion disposed on a side opposite to the first end portion across the shaft member. At least a part of the plurality of seating members further includes a biasing member for giving a force of rotating the lever member to the lever member such that the second end portion moves downward and a seating sensor configured to detect an upward movement of the second end portion.

Abstract: An object of the present invention is to provide a polishing table capable of preventing peeling or detachment of a coating of the polishing table, thereby to enable an operation for replacement of a polishing pad to be easily conducted. One embodiment of the present invention provides a polishing table having a support surface configured to support a polishing pad, the polishing pad being adapted to be used for polishing a substrate, the polishing table comprising: a stacked body comprising a stack of a porous layer and a non-porous layer, the porous layer including open pores formed in a surface thereof disposed to face a polishing pad; and a resin-based coating material disposed in the open pores so as to form at least a part of the support surface of the polishing table.

Abstract: A substrate transport apparatus includes a substrate holding unit configured to hold a substrate; a casing; and a drive mechanism at least partially provided within the casing and configured to drive the substrate holding unit using air. The drive mechanism is capable of supplying air into the casing.

Abstract: Disclosed is a turntable cloth peeling jig including: a cylindrical winding cylinder including a slit formed on an outer periphery of the cylindrical winding cylinder and extending in an axial direction thereof; a cloth clamping member disposed inside the winding cylinder and configured to clamp an outer peripheral edge of a cloth inserted into the slit; an extension bar attached to one end portion of the winding cylinder so as to extend coaxially therewith; an engaging portion provided at a tip end portion of the extension bar and engaged with a rotation jig configured to rotate the winding cylinder; and a handle provided in the engaging portion and configured to support the winding cylinder when rotating the rotating jig.

Abstract: The system effectively manipulates the operation of a charged particle flow device by approximating the total force on each ion during a trajectory calculation. The system applies the method in massively parallel general-purpose computing with GPU (GPGPU) to test its performance in simulations with thousands to over a million ions. The method calculates the forces on an ion using ions within an active region near the ion of interest. To decrease computation time, the method approximates the forces by calculating the ion-ion interactions within a first zone and the ion-ion cloud interactions within a second zone. The system adjusts settings of the charged particle flow device to affect the flow and positioning of the charged particles. Such setting may include adjusting the positioning of the charged plates, adjusting the voltage of the plates, and adjusting the pressure within the charged particle flow device.

Abstract: A flexible tube includes a first outer layer covering an outer side of a closely-wound region; a second outer layer forming a second flexible portion which is more difficult to bend than the first flexible portion; a third outer layer covering an outer side of the sparsely-wound region, and forming a third flexible portion which is as difficult to bend as the second flexible portion, or more difficult to bend than the second flexible portion; and a fourth outer layer arranged consecutively between the second and third outer layers to cover the outer side of a boundary position of the closely-wound region and the sparsely-wound region, and reducing a difference in bending difficulty/bending easiness at the boundary position.

Abstract: A flexible tube includes an envelope, a spiral tube and a built-in component. The spiral tube includes a first area portion and a second area portion. The spiral tube is under an initial tension throughout the overall length, and the built-in component includes a supplement area portion which supplements the elasticity of the spiral tube.

Abstract: A substrate processing apparatus includes transport mechanisms 121a to 127a, a sensor 40 for detecting whether a wafer W is held by the transport mechanisms 121a to 127a, a sensor controller 82 for controlling the sensor 40, a position information acquiring part 81 for acquiring position information of the substrate W in the transport passage, a detection result acquiring part 83 for acquiring a detection result from the sensor 40, and a determination processor 84 for determining whether the detection result of the sensor and the position information are consistent with each other. When it is determined that the detection result of the sensor 40 is inconsistent with the position information, the sensor controller 82 makes the sensor 40 retry to detect whether the substrate W is held.

Abstract: An object of the present invention is to provide a polishing table capable of preventing peeling or detachment of a coating of the polishing table, thereby to enable an operation for replacement of a polishing pad to be easily conducted. One embodiment of the present invention provides a polishing table having a support surface configured to support a polishing pad, the polishing pad being adapted to be used for polishing a substrate, the polishing table comprising: a stacked body comprising a stack of a porous layer and a non-porous layer, the porous layer including open pores formed in a surface thereof disposed to face a polishing pad; and a resin-based coating material disposed in the open pores so as to form at least a part of the support surface of the polishing table.

Abstract: A flexible tube includes a helical tube including a closely-wound region and a sparsely-wound region, and an outer tube covering an outer side of the helical tube. The closely-wound region includes a closely-wound portion to which a tight contact force is applied, the tight contact force allowing adjacent parts of a wire member adjacent along the longitudinal axis to become a tight contact state, a sparsely-wound portion which is arranged at a proximal side of the closely-wound portion, and a change portion which is arranged at a proximal side of the sparsely-wound portion and, has the tight contact force between the adjacent parts on the proximal side rather than the distal side along the longitudinal axis reduced more than the tight contact force of the closely-wound portion.