Abstract: A storage control program for causing a storage control device to perform: receiving, from a higher-level device, an input/output request including a logical address specifying a logical block within a volume; and determining a storage control device for processing the input/output request from among a plurality of storage control devices that may access a storage having a physical storage area assigned to the volume based on the logical address included in the received input/output request, the number of logical blocks per divided block size partitioning the volume, and number of the plurality of storage control devices.

Abstract: A semiconductor device includes a nonvolatile memory, and an interface configured to transfer data to and from the nonvolatile memory. The interface includes a security logic unit which controls a security level for the data written to the nonvolatile memory, in accordance with a plurality of preset security codes and a lock code that is written to a specific area in the nonvolatile memory.

Abstract: A semiconductor device includes a nonvolatile memory, and an interface configured to transfer data to and from the nonvolatile memory. The interface includes a security logic unit which controls a security level for the data written to the nonvolatile memory, in accordance with a plurality of preset security codes and a lock code that is written to a specific area in the nonvolatile memory.

Abstract: A hermetically sealing package for an optical semiconductor equipped with a light transmitting window whose light transmitting surface is inclined at least six degrees from the vertical line of the package bottom plate and which is joined to a cylindrical component on the package side wall by the use of a solder brazing material, in which the window material is made of a light-transmitting ceramic (such as alumina or spinel) plate in a substantially regular hexagonal or disk form in which a metallized portion is formed around the periphery, leaving a circular light transmitting portion in the center of the plate; and an optical semiconductor module that makes use of the package. The hermetically sealing package and the optical semiconductor module are easy and inexpensive to manufacture, have high reliability, and do not deform the plane of polarization.

Abstract: A hermetically sealing package for an optical semiconductor equipped with a light transmitting window whose light transmitting surface is inclined at least six degrees from the vertical line of the package bottom plate and which is joined to a cylindrical component on the package side wall by the use of a solder brazing material, in which the window material is made of a light-transmitting ceramic (such as alumina or spinel) plate in a substantially regular hexagonal or disk form in which a metallized portion is formed around the periphery, leaving a circular light transmitting portion in the center of the plate; and an optical semiconductor module that makes use of the package. The hermetically sealing package and the optical semiconductor module are easy and inexpensive to manufacture, have high reliability, and do not deform the plane of polarization.

Abstract: A jar can for a secondary battery is formed by deep-drawing a clad material prepared by bonding an aluminum sheet and an iron sheet to each other. A nickel layer is formed between the iron sheet and the aluminum sheet. Another nickel layer is formed on another surface of the iron sheet. Thus, a lightweight jar can for a secondary battery having high rigidity is obtained.

Abstract: Zinc sulfide and an optical component are provided that significantly reduces transmission for visible light and infrared rays of not more than 3 .mu.m in wavelength, having high transmittance for infrared rays in the wavelength range of 8-12 .mu.m, and that shields visible light. The optical component is constituted by a polycrystalline zinc sulfide sintered compact formed by hot compression molding fine zinc sulfide powder of high impurity at the temperature of 900-1000.degree. C. and the pressure of 150-800 kg/cm.sup.2. The light transmittance at the region where the thickness is 2 mm is 0% to 3% at the wavelength range of visible light, 0% to 20% at the wavelength range of 2.5-3 .mu.m, 30% to 75% at the wavelength range of 8-12 .mu.m, and 50% to 90% at the same wavelength range with the formation of antireflection coating film.

Abstract: The present invention provides a method of producing an infrared ray transmitting material, a large-sized one which can be manufactured at a low price, consisting of a polycrystal not liable to cleavage, which makes only a slight absorption of infrared rays all over the region of 8-11 .mu.m wave lengths, thus being highly transmissive. The material is a polycrystalline barium fluoride sintered body excellent in transmission to infrared region of 8-11 .mu.

Abstract: The present invention provides an infrared ray transmitting material, even large-sized one being manufacturable at a low price, consisting of a polycrystal not liable to cleavage, which makes only a slight absorption of infrared rays all over the region of 8-11 .mu.m wave lengths, thus being highly transmissive. The material is a polycrystalline barium fluoride sintered body excellent in transmission to infrared region of 8-11 .mu.m wave lengths, one that is most excellent in the infrared transmission being produced by a method comprising the hot press sintering and the HIP treatment in combination, one that gives somewhat inferior transmission but which is low-priced by a method comprising the CIP molding and the normal pressure sintering in combination, and one that regarded as intermediate between the aforementioned two by a method comprising the CIP molding, normal-pressure sintering and the HIP treatment in combination, in all cases entirely without addition of any binder or sintering aid.

Abstract: A composite material comprising a magnetic metal plate and an aluminum or aluminum alloy plate, the magnetic metal plate and the aluminum or aluminum alloy plate being clad together by an axial hot pressing. A process for producing a composite material which comprises the step of: cladding a magnetic metal plate with an aluminum or aluminum alloy plate by an axial hot pressing. A process for producing a composite material molding which comprises the steps of: cladding a magnetic metal plate with an aluminum or aluminum alloy plate by an axial hot pressing thereby obtaining a composite plate material; and subsequently subjecting the composite plate material to press molding and/or stamping and cutting.

Abstract: A polycrystalline spinel sintered body is provided herein which is superior in light transmission, such that it can be used in an infrared light-transmitting window at a thickness of 2 mm or more. The present invention also provides a method of producing such light-transmitting spinel sintered body by hot pressing the spinel powders having high purity at temperatures of 1,200.degree. to 1,700.degree. C. and pressures of 100 to 500 kg/cm.sup.2 to compact the sintered body until a density of 95% relative to the theoretical density is achieved and then subjecting the thus sintered compact to a hot isostatic pressure treatment at temperatures of 1400.degree. to 1800.degree. C. and pressures of 500 kg/cm.sup.2 or more. Other variations of this basic method can be employed as disclosed in the specification. According to Applicants' method, a sintered body of high density and excellent light transmission can be achieved which is superior to prior art methods.

Abstract: A light transmitting yttria sintered body having good light transmission, can be prepared by a method of preparing a light transmitting yttria sintered body which comprises steps of densifying yttria powder having purity of not lower than 99.9% and a BET specific surface area of not smaller than 10 m.sup.2 /g by a hot press at a temperature of 1300.degree. to 1700.degree. C. under a pressure of 100 to 500 kg/cm.sup.2 in a vacuum circumstance so as to achieve the theoretical density ratio of not lower than 95% and then hot isotropically pressing densified yttria at a temperature of 1400.degree. to 1900.degree. C. under a pressure of not lower than 500 kg/cm.sup.2.