Abstract: Provided is a solder material that has a high melting point and exhibits superior mechanical characteristics, and therefore can form a connecting portion with high heat-resistant reliability.

Abstract: Provided is a solder material that has a high melting point and exhibits superior mechanical characteristics, and therefore can form a connecting portion with high heat-resistant reliability.

Abstract: A solder material includes 1.0-4.0% by weight of Ag, 4.0-6.0% by weight of In, 0.1-1.0% by weight of Bi, 1% by weight or less (excluding 0% by weight) of a sum of one or more elements selected from the group consisting of Cu, Ni, Co, Fe and Sb, and a remainder of Sn. When a copper-containing electrode part of an electronic component is connected to a copper-containing electrode land of a substrate by using this solder material, a part having an excellent stress relaxation property can be formed in the solder-connecting part and a Cu—Sn intermetallic compound can be rapidly grown from the electrode land and the electrode part to form a strong blocking structure.

Abstract: A bonding material that has a melting temperature of 270° C. or higher and that does not contain lead is inexpensively provided. An electronic element and an electrode of an electronic component are bonded using a bonding material containing an alloy that contains Bi as the main component and that contains 0.2 to 0.8 wt % Cu and 0.02 to 0.2 wt % Ge.

Abstract: The present invention provides a flow soldering apparatus that can suppress the occurrence of soldering defects, even if VOC-free flux or low-VOC flux is applied to an electronic circuit substrate. In other words, the flow soldering apparatus according to the present invention includes: a water content sensor for measuring a residual water content of a surface of a substrate; and a monitoring device for judging whether soldering quality is satisfactory or not by using a residual water content value of the surface of the substrate acquired from the residual water content measured by the water content sensor, on the basis of a correlation between a residual water content value of a surface of a sample substrate and a residual water content value of through holes of the sample substrate, as acquired previously by using a plurality of substrate samples.

Abstract: A lead-free solder material is provided, which shows a high thermal fatigue resistance and is able to effectively reduce occurrence of connection failure that would cause a function of a product to stop. A solder material comprises 1.0-4.0% by weight of Ag, 4.0-6.0% by weight of In, 0.1-1.0% by weight of Bi, 1% by weight or less (excluding 0% by weight) of a sum of one or more elements selected from the group consisting of Cu, Ni, Co, Fe and Sb, and a remainder of Sn. When a copper-containing electrode part (3a) of an electronic component (3) is connected to a copper-containing electrode land (1a) of a substrate (1) by using this solder material, a part (5b) having an excellent stress relaxation property can be formed in the solder-connecting part and a Cu—Sn intermetallic compound (5a) can be rapidly grown from the electrode land (1a) and the electrode part (3a) to form a strong blocking structure.

Abstract: The present invention provides a flow soldering apparatus that can suppress the occurrence of soldering defects, even if VOC-free flux or low-VOC flux is applied to an electronic circuit substrate. In other words, the flow soldering apparatus according to the present invention includes: a water content sensor for measuring a residual water content of a surface of a substrate; and a monitoring device for judging whether soldering quality is satisfactory or not by using a residual water content value of the surface of the substrate acquired from the residual water content measured by the water content sensor, on the basis of a correlation between a residual water content value of a surface of a sample substrate and a residual water content value of through holes of the sample substrate, as acquired previously by using a plurality of substrate samples.

Abstract: A bonding material containing 2 to 10.5% by weight of Cu, 0.02 to 0.2% by weight of Ge and 89.3 to 97.98% by weight of Bi has heat resistance of up to 275° C. and superior wettability, and a bonding material containing 2 to 10.5% by weight of Cu, 0.02 to 0.2% by weight of Ge, 0.02 to 0.11% by weight of Ni and 89.19 to 97.96% by weight of Bi has more superior heat resistance.

Abstract: A soldering apparatus has a conveyor which conveys an electronic circuit board, a fluxer which applies a flux having water as a solvent to a surface of the electronic circuit board to be soldered, a first heating device which heats the electronic circuit board, a water removal device which removes water attached to the electronic circuit board, a second heating device which heats the electronic circuit board to maintain the electronic circuit board at a temperature at which the flux exerts its activating action, a flow soldering bath in which molten solder is attached to the electronic circuit board, and a cooler. The water removal device includes a gas blowing portion having a first jig which blows a gas to an electronic component disposition surface, and a drawing portion having a second jig which draws water from the surface to be soldered.

Abstract: A bonding material that has a melting temperature of 270° C. or higher and that does not contain lead is inexpensively provided. An electronic element and an electrode of an electronic component are bonded using a bonding material containing an alloy that contains Bi as the main component and that contains 0.2 to 0.8 wt % Cu and to 0.2 wt % Ge.

Abstract: A soldering apparatus has a conveyor which conveys an electronic circuit board, a fluxer which applies a flux having water as a solvent to a surface of the electronic circuit board to be soldered, a first heating device which heats the electronic circuit board, a water removal device which removes water attached to the electronic circuit board, a second heating device which heats the electronic circuit board to maintain the electronic circuit board at a temperature at which the flux exerts its activating action, a flow soldering bath in which molten solder is attached to the electronic circuit board, and a cooler. The water removal device includes a gas blowing portion having a first jig which blows a gas to an electronic component disposition surface, and a drawing portion having a second jig which draws water from the surface to be soldered.

Abstract: A recycling method of wastes of an electrical appliance containing an article having a circuit soldered with parts soldered with a lead free solder. The method includes discriminating a first article having a circuit soldered with lead free parts from a second article having a circuit soldered with lead containing parts; recovering, grinding and melting each of the first and second articles to separate materials of the first article and materials of the second article; recycling reusable valuables contained in the materials of the first article and second article; and shredding a portion of the first and second article not containing the reusable valuables and burying/treating the portion at a stabilizing dumping ground or a controlled dumping ground for disposal.

Abstract: The disclosure provides an article having a circuit mounted with parts characterized by comprising an electronic part soldered with a lead free solder and having an identification marking indicating no inclusion of lead and an electrical appliance including the same. The present invention also provides a recycling method of wastes of the same. The present invention can offer an article having a circuit mounted with parts and an electrical appliance including the same both of which facilitate identification whether lead which is poisonous to human body is contained or not.

Abstract: An electronic part processing method for peeling off a resin coating of an electronic part having a terminal section. The method includes a step of irradiating, with plasma, a coated wire having copper as a principal constituent and a surface coated with a resin.

Abstract: A connecting material can form a detachable connecting structure. According to the connecting material, a connecting portion between a certain object and another object can be more readily formed, and the certain object can be more readily detached from the another object after formation of the connecting portion. The connecting material comprises a solder material and a hydrogen storage metal material which is able to occlude hydrogen, and which is in the form of particles dispersed in the connecting material.

Abstract: An electronic part processing method for peeling off a resin coating of an electronic part having a terminal section, which includes a step of irradiating, with plasma, a coated wire having copper as a principal constituent and a surface coated with a resin.

Abstract: There is provided a flow soldering process for mounting an electronic component onto a board by a solder material, which process is appropriate for using a lead-free solder material as the solder material. In the flow soldering process, thermal efficiency of flow soldering is improved in preheating step and/or solder material supplying step thereof. In one aspect of the present invention, a heating cover is located above a preheater, and the flow soldering is conducted while the board passes between the heating cover and the preheater. In another aspect of the present invention, a gap between a preheater and a solder bath is 20 to 60 mm. In yet another aspect of the present invention, a distance between a primary wave and a secondary wave is not larger than 60 mm.

Abstract: There are provided a method of soldering a lead-free solder which lowers a melting point of the lead-free solder and prevents deterioration of a joining strength at a portion joined by the lead-free solder, and a joined object soldered with the use of the soldering method. The lead-free solder as an alloy of tin with no lead contained is melted, and ultrasonic vibration is acted at least either to the join object to be joined by the lead-free solder or to the lead-free solder when the molten lead-free solder is solidified. Therefore crystals of contained components in the lead-free solder are made fine and the contained components are prevented from being segregated at a joining interface of the joined object, so that the joining strength at the joining interface can be increased.

Abstract: There are provided a method of soldering a lead-free solder which lowers a melting point of the lead-free solder and prevents deterioration of a joining strength at a portion joined by the lead-free solder, and a joined object soldered with the use of the soldering method. The lead-free solder as an alloy of tin with no lead contained is melted, and ultrasonic vibration is acted at least either to the join object to be joined by the lead-free solder or to the lead-free solder when the molten lead-free solder is solidified. Therefore crystals of contained components in the lead-free solder are made fine and the contained components are prevented from being segregated at a joining interface of the joined object, so that the joining strength at the joining interface can be increased.

Abstract: A connection structure of the present invention has a board with a through hole perforating therethrough, a land formed around the through hole, and a lead extending from an electronic component and disposed in the through hole. The land includes a wall surface land portion formed on a wall surface of the through hole, and front and back surface land portions formed on the front and back surfaces of the board respectively. A fillet connecting the land and the lead includes upper and lower fillet portions respectively contacting with the front and back surface land portions. A profile of the upper fillet portion is smaller than that of the lower fillet portion and is not smaller than that of the through hole. Therefore, occurrence of lift-off is effectively reduced while using a lead-free solder material.