Abstract: The present invention relates to a compound represented by the following General Formula (1) or a salt thereof. In General Formula (1), R1, R2, R3 and R4 each independently represent a hydrogen atom, a linear or branched alkyl group which may have a substituent or the like. R1 and R2 may be bonded to each other to form a ring. R3 and R4 may be bonded to each other to form a ring. R1 and/or R2 may be bonded to a 6-membered ring to which —NR1R2 is bonded to form a ring. R3 and/or R4 may be bonded to a 6-membered ring to which —NR3R4 is bonded to form a ring. R5 represents —11CH3, a linear or branched alkyl group which may have a substituent or the like. R6 represents —F, —18F or the like. X, Y and Z each independently represent a carbon atom, an oxygen atom or the like. n is 0 or 1.

Abstract: The present invention relates to a method of analyzing a polyamine having a plurality of amino groups in the same molecule or a monoamine having an amino group and a phenolic hydroxyl group in the same molecule on the basis of the measurement result of the intensity of excimer fluorescence emitted as a result of the derivatization of the polyamine or the monoamine with a fluorescence derivatization reagent having a pyrene group. The method is characterized in that the fluorescence derivatization reagent comprises 2-chloro-4-methoxy-6-(4-(pyren-1-yl) butoxy)-1, 3, 5-triazine represented by the formula (2).

Abstract: The present invention relates to a method of analyzing a polyamine having a plurality of amino groups in the same molecule or a monoamine having an amino group and a phenolic hydroxyl group in the same molecule on the basis of the measurement result of the intensity of excimer fluorescence emitted as a result of the derivatization of the polyamine or the monoamine with a fluorescence derivatization reagent having a pyrene group. The method is characterized in that the fluorescence derivatization reagent comprises 2-chloro-4-methoxy-6-(4-(pyren-1-yl) butoxy)-1, 3, 5-triazine represented by the formula (2).

Abstract: A connection structure of the present invention has a board with a through hole perforating therethrough, a land formed around the through hole, and a lead extending from an electronic component and disposed in the through hole. The land includes a wall surface land portion formed on a wall surface of the through hole, and front and back surface land portions formed on the front and back surfaces of the board respectively. A fillet connecting the land and the lead includes upper and lower fillet portions respectively contacting with the front and back surface land portions. A profile of the upper fillet portion is smaller than that of the lower fillet portion and is not smaller than that of the through hole. Therefore, occurrence of lift-off is effectively reduced while using a lead-free solder material.

Abstract: A connection structure of the present invention has a board with a through hole perforating therethrough, a land formed around the through hole, and a lead extending from an electronic component and disposed in the through hole. The land includes a wall surface land portion formed on a wall surface of the through hole, and front and back surface land portions formed on the front and back surfaces of the board respectively. A fillet connecting the land and the lead includes upper and lower fillet portions respectively contacting with the front and back surface land portions. A profile of the upper fillet portion is smaller than that of the lower fillet portion and is not smaller than that of the through hole. Therefore, occurrence of lift-off is effectively reduced while using a lead-free solder material.