Patents by Inventor Kenichiroh MUKAI

Kenichiroh MUKAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for electromagnetic shielding and thermal management of active components
    Patent number: 10249572
    Abstract: The present invention concerns a method for forming a metal layer for electromagnetic shielding and thermal management of active components, preferably by wet chemical metal plating, using an adhesion promotion layer on the layer of molding compound and forming at least one metal layer on the adhesion promotion layer or forming at least one metal layer on the adhesion promotion layer by wet chemical metal plating processes.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: April 2, 2019
    Assignee: Atotech Deutschland GmbH
    Inventors: Kenichiroh Mukai, Kwonil Kim, Lee Gaherty, Lutz Brandt, Tafadzwa Magaya
  • NOVEL METHOD FOR ELECTROMAGNETIC SHIELDING AND THERMAL MANAGEMENT OF ACTIVE COMPONENTS
    Publication number: 20170330861
    Abstract: The present invention concerns a method for forming a metal layer for electromagnetic shielding and thermal management of active components, preferably by wet chemical metal plating, using an adhesion promotion layer on the layer of molding compound and forming at least one metal layer on the adhesion promotion layer or forming at least one metal layer on the adhesion promotion layer by wet chemical metal plating processes.
    Type: Application
    Filed: December 22, 2015
    Publication date: November 16, 2017
    Applicant: Atotech Deustschland GmbH
    Inventors: Kenichiroh MUKAI, Kwonil KIM, Lee GAHERTY, Lutz BRANDT, Tafadzwa MAGAYA