Patents by Inventor Kenichirou Hanamura

Kenichirou Hanamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7842886
    Abstract: A transmission cable includes multiple signal lines formed on one side of an insulation layer and a ground line between the signal lines. The ground line is electrically connected to a shield layer formed on a back surface side of the insulation layer and to a noise suppressing layer having a high electric resistance value than the shield layer via a metal bump embedded and formed in the insulation layer. The noise suppressing layer has a function to suppress an unwanted emission and/or a noise and has a function as an etching barrier layer serving as an etching stopper in a step for forming the metal bump. Thus, the transmission cable can suppress an increase of an electric resistance and a connection resistance between the ground line and the shield layer.
    Type: Grant
    Filed: November 1, 2006
    Date of Patent: November 30, 2010
    Assignees: Sony Corporation, Sony Chemical & Information Device Corporation
    Inventors: Kazuyoshi Kobayashi, Kenichirou Hanamura, Tomomitsu Hori
  • Publication number: 20090000804
    Abstract: A transmission cable is provided and includes multiple signal lines formed on one side of an insulation layer 1 and a ground line between the signal lines. The ground line is electrically connected to a shield layer formed on a back surface side of the insulation layer and to a noise suppressing layer having a high electric resistance value than the shield layer via a metal bump embedded and formed in the insulation layer. The noise suppressing layer has a function to suppress an unwanted emission and/or a noise and has a function as an etching barrier layer serving as an etching stopper in a step for forming the metal bump. Thus, the transmission cable can simplify a manufacturing process and reduce a manufacturing cost, and can suppress an increase of an electric resistance and a connection resistance between the ground line and the shield layer, thus capable of providing the transmission cable capable of fast transfer and large-capacity transfer with high reliability.
    Type: Application
    Filed: November 1, 2006
    Publication date: January 1, 2009
    Applicant: Sony Chemical & Information Device Corporation
    Inventors: Kazuyoshi Kobayashi, Kenichirou Hanamura, Tomomitsu Hori