Patents by Inventor Kenichirou Tada

Kenichirou Tada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing adhesive-free laminate of aramid paper and polyphenylene sulfide film, and insulation material and insulation structure for rotating electric machinery
    Patent number: 8709193
    Abstract: A low-temperature plasma treatment is applied to a surface of an aramid paper so as to allow the surface to have a compositional atomic ratio X (O/C) of the number of oxygen atoms (O) to the number of carbon atoms (C) ranging from 110% to 220% of a theoretical atomic ratio. The treatment is performed at an intensity ranging from 120 to 1500 W·min/m2 with a low-temperature plasma treatment apparatus of internal electrode system. The aramid paper is superposed with a nonhydrolyzable resin film and the resulting article is pressurized to give an aramid-resin film laminate. The laminate is inexpensive, has both superior electrical properties and high mechanical strength, excels in elasticity, and is useful as an insulation material.
    Type: Grant
    Filed: July 29, 2009
    Date of Patent: April 29, 2014
    Assignees: Hitachi Engineering & Services Co., Ltd., Kawamura Sangyo Co., Ltd.
    Inventors: Kenichirou Tada, Satoru Nakanishi, Taku Yamaga, Shun Ito, Kenichi Watanabe, Miyoshi Yokura, Masashi Kato, Hisashi Katsumata
  • Adhesive-free aramid-polyester laminate, method of manufacturing the same and apparatus for manufacturing the same
    Patent number: 7967941
    Abstract: A laminate comprising aramid paper containing aramid fiber and aramid pulp and polyester film, the aramid paper and polyester film having been subjected to plasma surface treatment before laminating, wherein the aramid paper and polyester film are continuously bonded to each other. The disclosure is concerned with a process for manufacturing the laminate and an apparatus for manufacturing the laminate.
    Type: Grant
    Filed: January 25, 2008
    Date of Patent: June 28, 2011
    Assignees: Hitachi Engineering & Services Co., Ltd., Kawamura Sangyo Co., Ltd.
    Inventors: Satoru Nakanishi, Kenichirou Tada, Miyoshi Yokura, Tetsuo Inoue
  • METHOD OF MANUFACTRURING ADHESIVE-FREE LAMINATE OF ARAMID PAPER AND POLYPHENYLENE SULFIDE FILM, AND INSULATION MATERIAL AND INSULATION STRUCTURE FOR ROTATING ELECTRIC MACHINERY
    Publication number: 20100062206
    Abstract: A low-temperature plasma treatment is applied to a surface of an aramid paper so as to allow the surface to have a compositional atomic ratio X (O/C) of the number of oxygen atoms (O) to the number of carbon atoms (C) ranging from 110% to 220% of a theoretical atomic ratio. The treatment is performed at an intensity ranging from 120 to 1500 W·min/m2 with a low-temperature plasma treatment apparatus of internal electrode system. The aramid paper is superposed with a nonhydrolyzable resin film and the resulting article is pressurized to give an aramid-resin film laminate. The laminate is inexpensive, has both superior electrical properties and high mechanical strength, excels in elasticity, and is useful as an insulation material.
    Type: Application
    Filed: July 29, 2009
    Publication date: March 11, 2010
    Inventors: Kenichirou TADA, Satoru Nakanishi
  • ADHESIVE-FREE ARAMID-POLYESTER LAMINATE, METHOD OF MANUFACTURING THE SAME AND APPARATUS FOR MANUFACTURING THE SAME
    Publication number: 20080182098
    Abstract: A laminate comprising aramid paper containing aramid fiber and aramid pulp and polyester film, the aramid paper and polyester film having been subjected to plasma surface treatment before laminating, wherein the aramid paper and polyester film are continuously bonded to each other. The disclosure is concerned with a process for manufacturing the laminate and an apparatus for manufacturing the laminate.
    Type: Application
    Filed: January 25, 2008
    Publication date: July 31, 2008
    Inventors: Satoru NAKANISHI, Kenichirou TADA, Miyoshi YOKURA, Tetsuo INOUE