Patents by Inventor Kenishiro Fukuyama

Kenishiro Fukuyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interface materials and methods of production and use thereof
    Patent number: 7608324
    Abstract: Layered interface materials described herein comprise at least one crosslinkable thermal interface component and at least one compliant fibrous interface component coupled to the thermal interface component. A method of forming layered interface materials comprises: a) providing a crosslinkable thermal interface component; b) providing a compliant fibrous interface component; and c) physically coupling the thermal interface component and the compliant fibrous interface component. At least one additional layer, including a substrate layer, can be coupled to the layered interface material.
    Type: Grant
    Filed: May 30, 2002
    Date of Patent: October 27, 2009
    Assignee: Honeywell International Inc.
    Inventors: My N. Nguyen, Nancy Dean, Kenishiro Fukuyama
  • Interface materials and methods of production and use thereof
    Publication number: 20070098971
    Abstract: Layered interlace materials described herein comprise at least one crosslinkable thermal interface component and at least one compliant fibrous interface component coupled to the thermal interface component. A method of forming layered interface materials comprises: a) providing a crosslinkable thermal interface component; b) providing a compliant fibrous interface component; and c) physically coupling the thermal interface component and the compliant fibrous interface component. At least one additional layer, including a substrate layer, can be coupled to the layered interface material.
    Type: Application
    Filed: May 30, 2002
    Publication date: May 3, 2007
    Inventors: My Nguyen, Nancy Dean, Kenishiro Fukuyama