Patents by Inventor Kenji Akeyama

Kenji Akeyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked high mounting density semiconductor devices
    Patent number: 5602420
    Abstract: A semiconductor device is provided with a stack of a plurality of semiconductor elements each having a bump deposited on each of surface electrodes, and a plurality of leads disposed closely adjacent to the stacked semiconductor elements, the leads being bonded to the bumps respectively thereby structurally integrally assembling the plural semiconductor elements.
    Type: Grant
    Filed: April 27, 1995
    Date of Patent: February 11, 1997
    Assignee: Hitachi, Ltd.
    Inventors: Masatsugu Ogata, Teruo Kitamura, Shuji Eguchi, Kenji Akeyama