Abstract: The present invention continuously performs batch processing and single-wafer processing on substrates by connecting a batch processing apparatus and a single-wafer processing apparatus separated from each other by a relay apparatus. With such a configuration, it is possible to relatively easily achieve a substrate processing system capable of continuously performing batch processing and single-wafer processing on substrates by surely utilizing technologies cultivated in individual batch processing-type and single-wafer processing-type apparatuses.

Abstract: Disclosed is a substrate treating apparatus provided with a treating block. The treating block includes a wet transportation region adjoining a batch treatment region and a single-wafer transportation region. The wet transportation region contains a second posture turning mechanism provided on an extension line of a line of six batch process tanks and configured to turn a posture of substrates, on which immersion treatment is performed, from vertical to horizontal, a belt conveyor mechanism configured to receive the substrates in a horizontal posture one by one from the second posture turning mechanism and transport the substrates to the single-wafer transportation region, and a liquid supplying unit configured to supply a liquid to wet the substrates, transported by the belt conveyor mechanism, with the liquid.

Abstract: A substrate processing method includes an intermediate processing step of processing the pattern forming surface by the intermediate processing liquid after a chemical liquid processing step, a filler discharging step of discharging a filler after the intermediate processing step, a filler spreading step of spreading the filler, a solidified film forming step of solidifying the filler, a lower position disposing step of making a blocking member be disposed at a lower position prior to start of the chemical liquid processing step, and a blocking member elevating step of starting elevation of the blocking member toward an upper position in a state where the pattern forming surface is covered with the intermediate processing liquid. The chemical liquid is discharged from a central nozzle. Spreading of the filler is started in a state where the blocking member is positioned at the upper position.

Abstract: A substrate processing method includes an intermediate processing step of processing the pattern forming surface by the intermediate processing liquid after a chemical liquid processing step, a filler discharging step of discharging a filler after the intermediate processing step, a filler spreading step of spreading the filler, a solidified film forming step of solidifying the filler, a lower position disposing step of making a blocking member be disposed at a lower position prior to start of the chemical liquid processing step, and a blocking member elevating step of starting elevation of the blocking member toward an upper position in a state where the pattern forming surface is covered with the intermediate processing liquid. The chemical liquid is discharged from a central nozzle. Spreading of the filler is started in a state where the blocking member is positioned at the upper position.

Abstract: The substrate processing apparatus includes a substrate holding unit that holds a substrate horizontally, a substrate rotating unit that rotates the substrate held by the substrate holding unit around a prescribed rotational axis extending along a vertical direction, a processing liquid supply nozzle that moves in a horizontal direction and supplies a processing liquid onto an upper surface of the substrate held by the substrate holding unit, a shielding member that shields an atmosphere between the shielding member and the upper surface of the substrate held by the substrate holding unit from an ambient atmosphere, an inert gas supply unit that supplies an inert gas between the upper surface of the substrate held by the substrate holding unit and the shielding member, and a shielding member rotating unit that rotates the shielding member around the rotational axis.

Abstract: The substrate processing apparatus includes a substrate holding unit that holds a substrate horizontally, a substrate rotating unit that rotates the substrate held by the substrate holding unit around a prescribed rotational axis extending along a vertical direction, a processing liquid supply nozzle that moves in a horizontal direction and supplies a processing liquid onto an upper surface of the substrate held by the substrate holding unit, a shielding member that shields an atmosphere between the shielding member and the upper surface of the substrate held by the substrate holding unit from an ambient atmosphere, an inert gas supply unit that supplies an inert gas between the upper surface of the substrate held by the substrate holding unit and the shielding member, and a shielding member rotating unit that rotates the shielding member around the rotational axis.