Patents by Inventor Kenji Ando

Kenji Ando has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240119965
    Abstract: A recording medium includes a recording layer. The recording layer includes an aliphatic polymer, and a multiphoton absorption compound containing at least one bond selected from the group consisting of a carbon-carbon double bond, a carbon-nitrogen double bond, and a carbon-carbon triple bond, and having a multiphoton absorption characteristic. When the thickness of the recording layer is 100 ?m, the transmittance of the recording layer in the thickness direction with respect to light having a wavelength of 405 nm is greater than or equal to 80%.
    Type: Application
    Filed: November 10, 2023
    Publication date: April 11, 2024
    Inventors: KOTA ANDO, MASAKO YOKOYAMA, NAOYA SAKATA, KENJI TAGASHIRA, HIDEKAZU ARASE
  • Patent number: 11912133
    Abstract: A vehicle drive unit includes an internal combustion engine (21), an electromotive unit (23) having a first electric motor (31) and a second electric motor (33), an inverter (27) disposed above the electromotive unit, a first harness (41) that electrically connects the inverter and a first terminal block (61) of the first electric motor, and a second harness (42) that electrically connects the inverter and a second terminal block (62) of the second electric motor. The first electric motor and the second electric motor are disposed in a vehicle front-rear direction. Of the first electric motor and the second electric motor, one electric motor is disposed on the front side in the front-rear direction, and the other electric motor is disposed on the rear side in the front-rear direction. The other electric motor is offset upward in the up-down direction with respect to the one electric motor.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: February 27, 2024
    Assignee: MITSUBISHI JIDOSHA KOGYO KABUSHIKI KAISHA
    Inventors: Shoji Tanizawa, Shinsuke Horibe, Masaharu Yamagishi, Chika Takaba, Toshihiko Ando, Kohei Higashitani, Kenji Umemura
  • Patent number: 11754344
    Abstract: A boiling cooler includes a boiling part, a condensing part arranged in a substantially horizontal direction with respect to the boiling part, and a connecting pipe that connects the boiling part to the condensing part. The condensing part includes a plurality of stages of refrigerant passages, a first external passage provided between the refrigerant passages, and a second external passage provided on an outer surface of at least one of an uppermost refrigerant passage and a lowermost refrigerant passage.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: September 12, 2023
    Assignee: Sumitomo Precision Products Co., Ltd.
    Inventors: Shota Hanafusa, Keiji Miki, Kenji Ando
  • Publication number: 20230252153
    Abstract: Provided is a technique for enabling software having different memory maps to be written in a nonvolatile memory of an electronic control device in reprogramming of control software. The electronic control device includes a microcomputer including a CPU and a nonvolatile memory. The nonvolatile memory includes activation software, control software, and validity confirmation information for confirming validity of the control software. A storage area of the validity confirmation information in the nonvolatile memory is different from a storage area of the activation software.
    Type: Application
    Filed: February 5, 2021
    Publication date: August 10, 2023
    Applicant: Hitachi Astemo, Ltd.
    Inventors: Shun KINUGASA, Kenji ANDO, Yusuke ABE
  • Publication number: 20230160637
    Abstract: A heat exchanger (1) includes a heat exchanger (1) including a separate plate (10) and a first flow path (11) which is divided by a plurality of fin portions (13a) and through which air flows, a fan (2), and a control unit (3) that perform s control for switching between a first mode where heat exchange is performed by forcing air to flow in and a second mode where heat exchange is performed by natural convection, the plurality of fin portions (13a) are disposed in parallel at predetermined intervals (p1), and are formed to have an undulating shape from one end (11b) toward the other end (11c) of the first flow path (11) in a width direction of the first flow path (11), and the first flow path (11) is configured to be used in both the first mode and the second mode.
    Type: Application
    Filed: March 30, 2021
    Publication date: May 25, 2023
    Inventors: Shota HANAFUSA, Kenji ANDO
  • Patent number: 11284534
    Abstract: A cooling device includes a main body unit that has, on a surface thereof, a plurality of disposition regions where objects to be cooled are disposed, and a refrigerant flow passage provided in the main body unit. The refrigerant flow passage includes a first flow passage portion and a second flow passage portion. The first flow passage portion is formed at a predetermined position of overlapping a part of an inside of a predetermined disposition region to allow a refrigerant to pass therethrough more intensively than the second flow passage portion.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: March 22, 2022
    Assignee: Sumitomo Precision Products Co., Ltd.
    Inventors: Ryo Yamaguchi, Kenji Ando, Keiji Miki
  • Patent number: 11172599
    Abstract: An electromagnetic-wave shielding sheet is an electromagnetic-wave shielding sheet used to form an electronic component-mounted substrate, the electronic component-mounted substrate including an electromagnetic-wave shielding layer covering at least a part of a step part and an exposed surface of a substrate, in which the electromagnetic-wave shielding sheet is a laminate including a cushion layer and a conductive layer, the conductive layer is an isotropic conductive layer containing a binder resin and a conductive filler, a thickness of the conductive layer is 8 to 70 ?m, and a content of the conductive filler in a region on a side opposite to a cushion layer side in the conductive layer is larger than that in a region on the cushion layer side in the conductive layer.
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: November 9, 2021
    Assignees: TOYO INK SC HOLDINGS CO., LTD., TOYOCHEM CO., LTD.
    Inventors: Shota Mori, Kazunori Matsudo, Kenji Ando, Tsutomu Hayasaka
  • Publication number: 20210251111
    Abstract: An electromagnetic-wave shielding sheet is an electromagnetic-wave shielding sheet used to form an electronic component-mounted substrate, the electronic component-mounted substrate including an electromagnetic-wave shielding layer covering at least a part of a step part and an exposed surface of a substrate, in which the electromagnetic-wave shielding sheet is a laminate including a cushion layer and a conductive layer, the conductive layer is an isotropic conductive layer containing a binder resin and a conductive filler, a thickness of the conductive layer is 8 to 70 ?m, and a content of the conductive filler in a region on a side opposite to a cushion layer side in the conductive layer is larger than that in a region on the cushion layer side in the conductive layer.
    Type: Application
    Filed: October 1, 2019
    Publication date: August 12, 2021
    Applicants: TOYO INK SC HOLDINGS CO., LTD., TOYOCHEM CO., LTD.
    Inventors: Shota MORI, Kazunori MATSUDO, Kenji ANDO, Tsutomu HAYASAKA
  • Publication number: 20210242137
    Abstract: An electromagnetic wave shielding sheet according to the present embodiments is an electromagnetic wave shielding sheet for forming an electromagnetic wave shielding layer used for a component-mounting substrate including a substrate, an electronic component and an electromagnetic wave shielding layer, in which the electromagnetic wave shielding sheet includes at least one of a conductive layer before thermal pressing of the electromagnetic wave reflection layer and a conductive layer before thermal pressing of the electromagnetic wave absorption layer, the conductive layer before thermal pressing of the electromagnetic wave reflection layer includes a binder resin and a conductive filler, and the conductive layer before thermal pressing of the electromagnetic wave absorption layer includes a binder resin and an electromagnetic wave absorption filler. The Young's modulus of the conductive layer at 23° C. is set to 10 to 700 MPa.
    Type: Application
    Filed: April 15, 2019
    Publication date: August 5, 2021
    Applicants: TOYO INK SC HOLDINGS CO., LTD., TOYOCHEM CO., LTD.
    Inventors: Kazunori MATSUDO, Ryota UMEZAWA, Kenji ANDO, Tsutomu HAYASAKA
  • Publication number: 20200340754
    Abstract: A boiling cooler includes a boiling part, a condensing part arranged in a substantially horizontal direction with respect to the boiling part, and a connecting pipe that connects the boiling part to the condensing part. The condensing part includes a plurality of stages of refrigerant passages, a first external passage provided between the refrigerant passages, and a second external passage provided on an outer surface of at least one of an uppermost refrigerant passage and a lowermost refrigerant passage.
    Type: Application
    Filed: January 19, 2018
    Publication date: October 29, 2020
    Inventors: Shota HANAFUSA, Keiji MIKI, Kenji ANDO
  • Publication number: 20190239389
    Abstract: A cooling device includes a main body unit that has, on a surface thereof, a plurality of disposition regions where objects to be cooled are disposed, and a refrigerant flow passage provided in the main body unit. The refrigerant flow passage includes a first flow passage portion and a second flow passage portion. The first flow passage portion is formed at a predetermined position of overlapping a part of an inside of a predetermined disposition region to allow a refrigerant to pass therethrough more intensively than the second flow passage portion.
    Type: Application
    Filed: August 1, 2017
    Publication date: August 1, 2019
    Applicant: Sumitomo Precision Products Co., Ltd.
    Inventors: Ryo YAMAGUCHI, Kenji ANDO, Keiji MIKI
  • Patent number: 10335895
    Abstract: A friction stir welding device includes: a control device which causes a pin part to be inserted into members to be joined while causing a joining tool to rotate and which causes a joining head to move along a joint line via a robot main body; and an image pickup device which detects a junction deviation that is a deviation between the joining head and a direction along the joint line. Also, when a junction deviation is generated, this control device causes the joining head to move in a direction toward the joint line and thus resolves the junction deviation.
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: July 2, 2019
    Assignee: Hitachi Power Solutions Co., Ltd.
    Inventors: Tomio Odakura, Koichi Ishiguro, Kenji Ando
  • Patent number: 10328667
    Abstract: The present invention provides a method for continuously manufacturing a stretchable sheet (3) with a thread-shaped elastic body (7) fixed between a pair of belt-shaped sheets (50, 60) in a stretched state, the method including a supply process of introducing the fed thread-shaped elastic body (7) to elastic body winding means (14) in a stretched state, a conveyance process of continuously winding the thread-shaped elastic body (7) to a thread-conveying longitudinal structure (12, 13) using the elastic body winding means (14) and conveying the wound thread-shaped elastic body in a longitudinal direction of the structure (12, 14), and an integration process of fixing the thread-shaped elastic body (7) as sandwiching between the sheets (50, 60).
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: June 25, 2019
    Assignee: KAO CORPORATION
    Inventors: Takuo Yanashima, Akio Morita, Makoto Kokubo, Kenji Ando
  • Publication number: 20180221986
    Abstract: A temperature sensor is provided inside the protrusion portion of the welding tool, and when welding is performed, the control device controls a rotation speed, a movement speed, or both rotation speed and movement speed of the welding tool, and thus the temperature detected by the temperature sensor is managed so as to fall within the predetermined management temperature range, and welding quality is equalized.
    Type: Application
    Filed: July 25, 2016
    Publication date: August 9, 2018
    Inventors: Tomio ODAKURA, Hiroki ABE, Kenji ANDO
  • Publication number: 20180071860
    Abstract: A friction stir welding device includes: a control device which causes a pin part to be inserted into members to be joined while causing a joining tool to rotate and which causes a joining head to move along a joint line via a robot main body; and an image pickup device which detects a junction deviation that is a deviation between the joining head and a direction along the joint line. Also, when a junction deviation is generated, this control device causes the joining head to move in a direction toward the joint line and thus resolves the junction deviation.
    Type: Application
    Filed: April 7, 2016
    Publication date: March 15, 2018
    Inventors: Tomio ODAKURA, Koichi ISHIGURO, Kenji ANDO
  • Patent number: 9301881
    Abstract: A wearing article (1) of the invention has edge sections (leg edge sections and waist edge section) configured including sheets. On the sheets in the edge sections, elastic members (6, 7, 8) are disposed in their stretched state along the edge sections. Draw-processed sections (P1, P2) are formed by performing draw processing, in the stretching direction of the elastic members (6, 7, 8), on the disposition sections of the sheets where the elastic members (6, 7, 8) have been disposed. Furthermore, a draw-processed section (P3) is formed by performing draw processing, in the stretching direction of an elastic member (5), on the disposition section of a band-shaped sheet (15), which configures three-dimensional gathers (18), where the elastic member (5) has been disposed.
    Type: Grant
    Filed: December 24, 2009
    Date of Patent: April 5, 2016
    Assignee: KAO CORPORATION
    Inventors: Kenji Ando, Yasuhiro Umeki, Toshiaki Ichimata
  • Patent number: 9011404
    Abstract: A pull-on absorbent article including a front outer cover to be worn around a wearer's front side, a rear outer cover to be worn around the wearer's rear side, and an absorbent assembly fixed to the front and the rear outer cover so as to bridge them and having a pair of side seals. The length of each of the front and the outer cover in the longitudinal direction of the article is uniform in the lateral direction and larger than that of the side seals so that the front and the outer cover have extension portions that extend downward from the side seals. The extension portions of the front and/or the rear outer cover have an elasticized region extensible in the lateral direction in a region located laterally outward of each side edge of the absorbent assembly.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: April 21, 2015
    Assignee: Kao Corporation
    Inventors: Kenji Kobayashi, Ryoichi Yamamoto, Kenji Ando, Takuo Yanashima, Akio Morita
  • Patent number: 8945452
    Abstract: A method for producing a flexible sheet includes a stretching step in which a base sheet (10) is fed from between a pair of first drive rollers (42, 43) into the bite of a pair of intermeshing corrugated rollers (2, 3) and stretched in the machine direction between the corrugated rollers (2, 3). In the method, the peripheral velocity V1 of the first drive rollers (42, 43) and the peripheral velocity V2 of the corrugated rollers (2, 3) have a relation of V1>V2.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: February 3, 2015
    Assignee: Kao Corporation
    Inventors: Shinnosuke Morita, Kenji Ando
  • Publication number: 20140311676
    Abstract: A substrate mounting table (94) is equipped with a mounting table (2), an electrostatic chuck (6), and a bevel covering (5). The electrostatic chuck (6) has a supporting surface (6e) which is in contact with the whole of the rear surface of a wafer (W). The annular bevel covering (5) has an outer diameter (DA) which is greater than that of the supporting surface (6e), and an inner diameter (DI) which is smaller than that of the wafer (W). The bevel covering (5) is disposed such that, when viewed from the direction orthogonal to the supporting surface (6e), the bevel covering (5) surrounds the periphery of the wafer (W) supported on the supporting surface (6e).
    Type: Application
    Filed: January 15, 2013
    Publication date: October 23, 2014
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Hideyuki Hatoh, Shigeki Doba, Shinya Yamamoto, Satoshi YAMADA, Hiroto Mori, Kenji Ando
  • Patent number: 8813832
    Abstract: A heat sink which is mounted in a movable body and which is to be exposed to a traveling air stream generated while the movable body moves includes a base and a heat dissipating portion having a plurality of fins. At least in a front end portion of the heat dissipating portion, the heat dissipating portion includes a rectifying portion provided so as to extend across a predetermined area in a longitudinal direction in front portions of slit-shaped flow paths at an upstanding end (i.e., an end apart from the base).
    Type: Grant
    Filed: March 12, 2010
    Date of Patent: August 26, 2014
    Assignee: Sumitomo Precision Products Co., Ltd.
    Inventors: Keiji Miki, Kenji Ando