Abstract: The present invention provides a thermally conductive insulating sheet having appropriate fluidity upon being heated and pressurized, and free from of the possibility of a material leaking to the outside beyond the original size of the sheet. The thermally conductive insulating sheet according to the present invention contains an uncured material and/or a semi-cured material of a binder resin (R) which is a thermosetting resin. In the present invention, a complex viscosity in a temperature range of 100-200° C. is 10,000-150,000 Pa·s, a ratio (?/?) of the maximum value (?) to the minimum value (?) of the complex viscosity in said temperature range is 1.0-4.0, and the flow value is 90-100%. Flow value(%)=W2/W1×100.

Abstract: A composite member (1) satisfies the following expressions. X/(E×|CTE(B)?CTE(A)|)?50, X/(E×|CTE(B)?CTE(C)|)?50, Y/|CTE(B)?CTE(A)|×L(BA)?50, and Y/|CTE(B)?CTE(C)|×L(BC)?50. X: shear bond strength (MPa) between the heat dissipating base substrate and heat generating member, Y: fracture elongation of the thermoconductive insulating adhesive film, E: modulus of elasticity (MPa) of the thermoconductive insulating adhesive film, CTE(A): linear expansion coefficient (° C.?1) of the heat dissipating base substrate, CTE(B): linear expansion coefficient (° C.?1) of the thermoconductive insulating adhesive film, CTE(C): linear expansion coefficient (° C.

Abstract: A composite member (1) satisfies the following expressions. X/(E×|CTE(B)?CTE(A)|)?50, X/(E×|CTE(B)?CTE(C)|)?50, Y/|CTE(B)?CTE(A)|×L(BA)?50, and Y/|CTE(B)?CTE(C)|×L(BC)?50. X: shear bond strength (MPa) between the heat dissipating base substrate and heat generating member, Y: fracture elongation of the thermoconductive insulating adhesive film, E: modulus of elasticity (MPa) of the thermoconductive insulating adhesive film, CTE(A): linear expansion coefficient (° C.?1) of the heat dissipating base substrate, CTE(B): linear expansion coefficient (° C.?1) of the thermoconductive insulating adhesive film, CTE(C): linear expansion coefficient (° C.

Abstract: The present invention provides a thermally conductive insulating sheet having appropriate fluidity upon being heated and pressurized, and free from of the possibility of a material leaking to the outside beyond the original size of the sheet. The thermally conductive insulating sheet according to the present invention contains an uncured material and/or a semi-cured material of a binder resin (R) which is a thermosetting resin. In the present invention, a complex viscosity in a temperature range of 100-200° C. is 10,000-150,000 Pa·s, a ratio (?/?) of the maximum value (?) to the minimum value (?) of the complex viscosity in said temperature range is 1.0-4.0, and the flow value is 90-100%. Flow value(%)=W2/W1×100.

Abstract: A vertical sweep circuit includes a first transistor supplied with a sawtooth voltage. A voltage drop is developed across a resistor by a vertical sweep current for producing a first voltage across a first load. A second transistor is supplied with the first voltage for producing a second voltage across a second load, and a pair of push-pull connected transistors are supplied with the second voltage for producing the sweep current. An additional transistor of the same conductivity type as the second transistor is included in the circuit. Responsive to the first voltage, the additional transistor produces voltage pulses at a point of connection thereto of an additional load, which is greater than the second load to make the second and additional transistors operate as a linear amplifier transistor and a switching transistor, respectively. Vertical blanking pulses are produced from the voltage pulses.