Abstract: The cyanate ester compound of the present invention is obtained by cyanating a modified naphthalene formaldehyde resin.

Abstract: A resin composition for a printed wiring board including: a cyanate compound represented by the following general formula (1); and an epoxy resin,

Abstract: The present invention is a cyanate ester compound represented by the following formula (1): wherein Ar represents an aromatic ring; R1 each independently represents a hydrogen atom, an alkyl group, or an aryl group; n each independently represents an integer of 1 to 3; m+n is the same as the total number of hydrogen atoms in a monovalent aromatic group containing the aromatic ring and the hydrogen atoms; R2 represents a hydrogen atom (excluding a case where Ar represents a benzene ring; n each represents 1; R1 represents a hydrogen atom; m each represents 4, and a cyanate group is bonded to the benzene ring in the 4-position relative to an adamantyl group), or an alkyl group having 1 to 4 carbon atoms; and R3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.

Abstract: A resin composition for a printed wiring board including: a cyanate compound represented by the following general formula (1); and an epoxy resin,

Abstract: The present invention is a cyanate ester compound represented by the following formula (1): wherein Ar represents an aromatic ring; R1 each independently represents a hydrogen atom, an alkyl group, or an aryl group; n each independently represents an integer of 1 to 3; m+n is the same as the total number of hydrogen atoms in a monovalent aromatic group containing the aromatic ring and the hydrogen atoms; R2 represents a hydrogen atom (excluding a case where Ar represents a benzene ring; n each represents 1; R1 represents a hydrogen atom; m each represents 4, and a cyanate group is bonded to the benzene ring in the 4-position relative to an adamantyl group), or an alkyl group having 1 to 4 carbon atoms; and R3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.

Abstract: It is an object of the present invention to provide a resin composition which can realize a printed wired board having not only low water-absorbing property but also excellent heat resistance after moisture absorption, flame retardancy, and solvent solubility. It is another object of the present invention to provide a prepreg and a monolayer or laminate which use the resin composition, and a metal foil clad laminate and a printed wired board which use the prepreg. A resin composition of the present invention contains one or two or more cyanate ester compounds (A) represented by the following formula (1) and an epoxy resin (B): wherein R1, R2, R3, and R4 represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and may be the same or different from each other; and n represents an integer of 1 to 50.

Abstract: The resin composition of the present invention comprises a cyanate ester compound (A) obtained by cyanating a modified naphthalene formaldehyde resin, and an epoxy resin (B).

Abstract: The cyanate ester compound of the present invention is obtained by cyanating a modified naphthalene formaldehyde resin.

Abstract: A resin composition that can allow allowing a drying step after impregnation coating of a prepreg and lamination pressing performed at low temperatures in a short time and, at the same time, can maintain storage stability of the prepreg, comprises (A) an imidazole compound represented by formula (I), (B) an epoxy compound, and (C1) a cyanate compound or (C2) a BT resin. R1 and R2 represent an alkyl group, an alkenyl group an alkoxyl group, or a substituted or unsubstituted aromatic substituent; and R3 represents hydrogen, an alkyl group, an alkenyl group, an alkoxy group, a substituted or unsubstituted aromatic substituent, or a halogen group.