Abstract: The possibility of information acquired from a recording device not being correct can be detected. A management server 20 has an information reader 63 that reads related information stored in nonvolatile memory 74 of an ink cartridge 13, an information acquisition unit 62 that acquires related information by communication from a coupon printer CP, and a information comparison unit 64 that compares the related information read by the information reader 63 with the related information acquired by the information acquisition unit 62.

Abstract: What ink cartridge is best suited to a recording device can be determined. A management server includes a related information acquisition unit that gets related information, which is information related to recording using an ink cartridge in a coupon printer, from a central server; and a model information output unit that based on the acquired related information outputs model information including information identifying the model of ink cartridge suited to use by the coupon printer.

Abstract: An optical reading device has an optical reading unit having optical elements disposed in a line that reads a medium; a storage unit having a ring buffer formed in the storage space; and a control unit that writes scanned data read by the optical reading unit to the ring buffer, reads the scanned data written to the ring buffer, and transfers the scanned data that was read. The control unit also manages positions in the ring buffer for writing and reading the scanned data using a write pointer denoting the position for writing the scanned data to the ring buffer, and a read pointer denoting the position of scanned data that has not been read.

Abstract: Unintended image inversion is prevented when an optical reading device processes images captured by an optical reading device that uses a linear image sensor having the photodetectors arrayed in a line. An optical reading unit has a linear image sensor with photodetectors arrayed perpendicularly to the transportation direction of the recording medium S to be scanned, optically reads the conveyed recording medium by means of the linear image sensor, and sequentially outputs the detection values of the photodetectors from an end of the linear image sensor. A gate array and CPU generate scanned image data based on the detection values read by the optical reading unit, add thereto information describing the relationship between the scanning sequence of the photodetectors of the linear image sensor and the pixel order of the scanned image data, and output to another device.

Abstract: The length of the process from capturing an image by an optical reading unit to discharging the medium is shortened, and throughput improved. A media transportation mechanism conveys a medium to be scanned. An optical reader disposed to the medium transportation path optically reads the conveyed medium. A storage unit stores the captured image. A transmission unit reads and transmits the captured image stored in the storage unit to another device. A discharge control unit discharges the medium while the captured image is being transmitted to the other device after the optical reader finishes scanning the medium.

Abstract: There are provided plural suspension links, one end of each of which is coupled to a wheel and the other end of each of which is coupled to a vehicle body. The suspension links are disposed so as to extend substantially in a vehicle width direction. A drive motor is disposed so as to be offset from a center of a wheel on a side that is away from disposition location of the suspension links. The drive motor and the wheel are coupled by a drive-force transmitting mechanism so that a drive force can be transmitted. Accordingly, there can be provided the disposition structure of a drive device for a vehicle that can provide both the drive motors and the suspension links without any improper interference, ensuring proper controlling of the wheel positions.

Abstract: A trunk lid is provided so as to rotate around a front end portion thereof in such a manner that its back face in an open state faces substantially upward, and there is provided a support mechanism to support the trunk lid in the open state. Accordingly, there can be provided a baggage compartment structure of a vehicle which comprises a trunk room which is provided at a rear portion of a vehicle body so that an opening formed at an upper face thereof can be closed with the trunk lid, which can properly load various types of large-sized baggage without having the large and complex structure and damaging the vehicle design improperly.

Abstract: There are provided plural suspension links, one end of each of which is coupled to a wheel and the other end of each of which is coupled to a vehicle body. The suspension links are disposed so as to extend substantially in a vehicle width direction. A drive motor is disposed so as to be offset from a center of a wheel on a side that is away from disposition location of the suspension links. The drive motor and the wheel are coupled by a drive-force transmitting mechanism so that a drive force can be transmitted. Accordingly, there can be provided the disposition structure of a drive device for a vehicle that can provide both the drive motors and the suspension links without any improper interference, ensuring proper controlling of the wheel positions.

Abstract: In a semiconductor device, bonding-wires can be applied parallel to each other to electrodes of high-speed signal lines when mounting a highly densified semiconductor element on a low-cost substrate while reducing a length of the bonding-wires. An impedance-matched substrate having wiring that impedance-matched with circuits of a semiconductor element is mounted on a substrate. A plurality of first metal wires connect between first electrodes of the semiconductor element and electrodes of the substrate. A plurality of second metal wires connect between second electrodes of the semiconductor element and first electrodes of the impedance-matched substrate. A plurality of third metal wires connect between second electrodes of the impedance-matched substrate and electrodes of the substrate. The second metal wires extend parallel to each other, and the third metal wires also extend parallel to each other.

Abstract: In a semiconductor device, bonding-wires can be applied parallel to each other to electrodes of high-speed signal lines when mounting a highly densified semiconductor element on a low-cost substrate while reducing a length of the bonding-wires. An impedance-matched substrate having wiring that impedance-matched with circuits of a semiconductor element is mounted on a substrate. A plurality of first metal wires connect between first electrodes of the semiconductor element and electrodes of the substrate. A plurality of second metal wires connect between second electrodes of the semiconductor element and first electrodes of the impedance-matched substrate. A plurality of third metal wires connect between second electrodes of the impedance-matched substrate and electrodes of the substrate. The second metal wires extend parallel to each other, and the third metal wires also extend parallel to each other.

Abstract: According to the present invention, for a multi-layer plastic package having bonding pads at multiple levels, a plurality of electrically independent side wall conductive layers can be provided by forming side wall conductive layer on the side wall of an opening in each insulating layer. In particular, when the insulating layer forms a multi-layer structure, side wall conductive layers are formed on each of the individual side walls of the multi insulating layers, and a pre-impregnated layer is inserted between each two insulation layers, so that a plurality of electrically independent side wall conductive layers can be provided. Even for an insulating layer having a single layer structure, side wall conductive layers are formed so as to be electrically separated from each other, so that a plurality of side wall conductive layers can be provided.

Abstract: An LSI package including an area for mounting an LSI device thereon and a plurality of lines for connecting the LSI device and external terminals. At least two of the plurality of lines, in which differential signals are transmitted and are adjacent to each other in the LSI package, have equal lengths.

Abstract: A semiconductor device has an electrical circuit and a grounding terminal. A multilayer substrate has a plurality of insulator layers and conductor layers in a stacked arrangement and a surface with first and second regions, the conductor layers making electrical contact with the electrical circuit and the grounding terminal of the semiconductor device. The first region generally surrounds the semiconductor device and has first connecting conductors penetrating at least a part of the multilayer substrate so that each of the first conductors makes contact with one or a plurality of corresponding conductor layers. The second region generally surrounds the first region and has second connecting conductors penetrating at least a part of the multilayer substrate and only making contact with one or a plurality of conductor layers coupled to the grounding terminal of the semiconductor device.

Abstract: An agent for preventing vinyl chloride polymer build-up, which contains as the effective ingredient a reaction product of ammonium salt or a metal salt of N-nitrosophenylhydroxylamine with an aldehyde.