Patents by Inventor Kenji Chichii

Kenji Chichii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pattern data processing system, pattern data processing method, and pattern data processing program
    Patent number: 7907771
    Abstract: A pattern data processing method comprising, obtaining pattern data on a mask pattern, determining whether a processing time for the mask pattern in a processing software is reduced by rotating the mask pattern by a predetermined angle than a case where the mask pattern is processed in the processing software without being rotated, obtaining pattern data on a rotated pattern formed by rotating the mask pattern by the predetermined angle in the case that the processing time is reduced, processing the pattern data on the rotated pattern by using the processing software, and causing the mask pattern to return to its original direction.
    Type: Grant
    Filed: August 31, 2007
    Date of Patent: March 15, 2011
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Mitsuo Sakurai, Takahisa Itoh, Taketoshi Omata, Kenji Chichii
  • Multilayer interconnection structure and method for forming the same
    Patent number: 7514355
    Abstract: A multilayer interconnection structure of the present invention includes first interconnection, second interconnection belonging to an interconnection layer different from an interconnection layer to which the first layer belongs, and third interconnection for connecting the first and second interconnections, the third interconnection belonging to a different interconnection layer and including interconnection along a body diagonal for connecting two points in different planes belong to different interconnection layers. A method for producing the multilayer interconnection structure includes a step of forming the third interconnection, the step including a step of forming a through hole along the body diagonal, and a step of filling the through hole with a conductive material.
    Type: Grant
    Filed: June 10, 2005
    Date of Patent: April 7, 2009
    Assignee: Fujitsu Microelectronics Limited
    Inventors: Syuji Katase, Kouichi Suzuki, Kenji Chichii, Katsuji Tabara
  • PATTERN DATA PROCESSING SYSTEM, PATTERN DATA PROCESSING METHOD, AND PATTERN DATA PROCESSING PROGRAM
    Publication number: 20080063259
    Abstract: A pattern data processing method comprising, obtaining pattern data on a mask pattern, determining whether a processing time for the mask pattern in a processing software is reduced by rotating the mask pattern by a predetermined angle than a case where the mask pattern is processed in the processing software without being rotated, obtaining pattern data on a rotated pattern formed by rotating the mask pattern by the predetermined angle in the case that the processing time is reduced, processing the pattern data on the rotated pattern by using the processing software, and causing the mask pattern to return to its original direction.
    Type: Application
    Filed: August 31, 2007
    Publication date: March 13, 2008
    Applicant: FUJITSU LIMITED
    Inventors: Mitsuo SAKURAI, Takahisa ITOH, Taketoshi OMATA, Kenji CHICHII
  • Multilayer interconnection structure and method for forming the same
    Publication number: 20050287800
    Abstract: A multilayer interconnection structure of the present invention includes first interconnection, second interconnection belonging to an interconnection layer different from an interconnection layer to which the first layer belongs, and third interconnection for connecting the first and second interconnections, the third interconnection belonging to a different interconnection layer and including interconnection along a body diagonal for connecting two points in different planes belong to different interconnection layers. A method for producing the multilayer interconnection structure includes a step of forming the third interconnection, the step including a step of forming a through hole along the body diagonal, and a step of filling the through hole with a conductive material.
    Type: Application
    Filed: June 10, 2005
    Publication date: December 29, 2005
    Applicant: FUJITSU LIMITED
    Inventors: Syuji Katase, Kouichi Suzuki, Kenji Chichii, Katsuji Tabara