Patents by Inventor Kenji Ema

Kenji Ema has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12092669
    Abstract: Provided is an AD converter that is capable of converting a wideband noise signal of several GHz or more into a digital signal and that can be used even when an installation space and power supply are severely limited. The AD converter includes: a comparator (10) configured to compare an input voltage of an analog signal to a determination voltage; an adjustment unit (12) configured to shift at least one of the input voltage of the analog signal or the determination voltage; an encoder (11) configured to output time-series data of one bit based on a result of the comparison obtained by the comparator; a processing unit (13) configured to calculate a frequency of appearance of an output code included in the time-series data; and a control unit (14) configured to cause the adjustment unit to operate so that a result of the calculation obtained by the processing unit becomes a predetermined value.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: September 17, 2024
    Assignee: ELECS INDUSTRY CO., LTD.
    Inventors: Noriyuki Kawaguchi, Takashi Maeda, Kenichi Harada, Kenji Ema, Kensuke Ozeki
  • Publication number: 20240255555
    Abstract: Provided is an AD converter that is capable of converting a wideband noise signal of several GHz or more into a digital signal and that can be used even when an installation space and power supply are severely limited. The AD converter includes: a comparator (10) configured to compare an input voltage of an analog signal to a determination voltage; an adjustment unit (12) configured to shift at least one of the input voltage of the analog signal or the determination voltage; an encoder (11) configured to output time-series data of one bit based on a result of the comparison obtained by the comparator; a processing unit (13) configured to calculate a frequency of appearance of an output code included in the time-series data; and a control unit (14) configured to cause the adjustment unit to operate so that a result of the calculation obtained by the processing unit becomes a predetermined value.
    Type: Application
    Filed: March 29, 2022
    Publication date: August 1, 2024
    Applicant: ELECS INDUSTRY CO., LTD.
    Inventors: Noriyuki Kawaguchi, Takashi Maeda, Kenichi Harada, Kenji Ema, Kensuke Ozeki
  • Patent number: 6071008
    Abstract: A tube 12 made of stainless steel is arranged in a thermal bath 13 and an AC current is supplied to the tube to apply an AC heat directly to the tube and a liquid sample contained therein. An AC temperature of the tube 12 is detected by a thermocouple 19. An amplitude of the AC heat, and a phase difference between the AC heat and the AC temperature are detected. The above measurement is performed for the vacant tube, the standard liquid sample containing tube and the liquid sample containing tube to derive amplitudes .DELTA.T.sub.c, .DELTA.T.sub.r and .DELTA.T.sub.s and phase differences .phi..sub.c, .phi..sub.r and .phi..sub.s. Then, a heat capacity .rho..sub.s .multidot.C.sub.s per a unit volume of the liquid sample is calculated from a following equation.rho..sub.s .multidot.C.sub.s =[{sin (.phi..sub.s)/.DELTA.T.sub.s -sin (.phi..sub.c)/.DELTA.T.sub.c }/{sin (.phi..sub.r)/.DELTA.T.sub.r -sin (.phi..sub.c)/.DELTA.T.sub.c }].rho..sub.rwherein C.sub.r and .rho..sub.
    Type: Grant
    Filed: January 28, 1998
    Date of Patent: June 6, 2000
    Assignee: Nagoya University
    Inventors: Ichiro Hatta, Haruhiko Yao, Kenji Ema
  • Patent number: 4797242
    Abstract: A method for molding a thermosetting resin pipe having a balanced compressive strength between the axial direction and the direction normal to the pipe axis is disclosed. The method includes steps of molding a thermosetting resin in a smooth zone in the front section of a screw to such an extent that the resin after being extruded from the cylinder is capable of retaining its own shape, and orienting the resin and/or a fibrous filler randomly. An apparatus for producing such a thermosetting resin, and a thermosetting resin having a balanced compressive strength are also disclosed.
    Type: Grant
    Filed: December 23, 1986
    Date of Patent: January 10, 1989
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Yoshiaki Fukuda, Takeshi Miyasaka, Iori Matsumoto, Nobukatsu Kato, Kenji Ema
  • Patent number: 4544727
    Abstract: A copolymer consisting of 30 to 65 mole % of structural units of the formula ##STR1## 1 to 55 mole % of structural units of the formula ##STR2## and 10 to 60 mole % of structural units of the formula ##STR3## and having a number average molecular weight of 500 to 200,000.
    Type: Grant
    Filed: July 30, 1984
    Date of Patent: October 1, 1985
    Assignee: Wakabayashi Patent Agency
    Inventors: Kenji Ema, Jun Saito, Takatoshi Mitsuishi, Shuhei Ikado
  • Patent number: 4435543
    Abstract: Phenolic resin compositions comprising a polymeric substance having a phenolic OH group such as phenol resins, and a rubber having an epoxy group and an epoxy equivalent of 500 to 30,000 such as butadiene copolymers, acrylic copolymers, chloroprene copolymers and urethane copolymers are provided. These resin compositions exhibit improved properties having overcome the drawback of brittle properties intrinsic of conventional phenolic resins, and also exhibit cold resistance; hence they are used as molding materials, laminating materials, casting materials, binders, etc. Further, molding resin compositions having improved solvent-resistance and metal insert properties are provided.
    Type: Grant
    Filed: April 12, 1982
    Date of Patent: March 6, 1984
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Kenji Ema, Junji Hara, Shuhei Ikado, Hideo Kawashima, Tomohide Yokoo
  • Patent number: 4378450
    Abstract: Phenolic resin compositions comprising a polymeric substance having a phenolic OH group such as phenol resins, and a rubber having an epoxy group and an epoxy equivalent of 500 to 30,000 such as butadiene copolymers, acrylic copolymers, chloroprene copolymers and urethane copolymers are provided. These resin compositions exhibit improved properties having overcome the drawback of brittle properties intrinsic of conventional phenolic resins, and also exhibit cold resistance; hence they are used as molding materials, laminating materials, casting materials, binders, etc. Further, molding resin compositions having improved solvent-resistance and metal insert properties are provided.
    Type: Grant
    Filed: March 14, 1980
    Date of Patent: March 29, 1983
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Kenji Ema, Junji Hara, Shuhei Ikado, Hideo Kawashima, Tomohide Yokoo