Patents by Inventor Kenji Emori

Kenji Emori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Anisotropic conductive adhesive film
    Patent number: 5330684
    Abstract: A composition for forming a moisture resistant, anisotropic conductive film having a rapid curing speed, high heat resistance, high humidity resistance, long shelf life and excellent repairability comprising an adhesive composition containing about 100 parts cyanate ester, from about 0.01 part to 10 parts of a curing catalyst, from about 10 parts to about 300 parts of a film-formable thermoplastic resin, and from about 10 to about 500 parts of an epoxy resin, and from about 0.1 part to about 20 parts conductive particles per 100 parts total adhesive composition.
    Type: Grant
    Filed: November 3, 1992
    Date of Patent: July 19, 1994
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Kenji Emori, Yoshihiko Tasaka
  • Process for formation of metallic relief
    Patent number: 4865954
    Abstract: The present invention provides a method for forming a metal image in which a resist film is provided at an image portion and then etching processing is performed to thereby form the metal image comprising the steps of: (1) forming an image comprised of concave surface portions on a metal surface; (2) forming a resist film on the metal surface; and (3) exposing the resist film to such an extent that at the concave portions of the resist film is not made wholly soluble.
    Type: Grant
    Filed: January 27, 1987
    Date of Patent: September 12, 1989
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Yoshichi Hagiwara, Naoya Kimura, Kenji Emori