Abstract: An LED assembly including a wiring substrate with an opening at its center; a heat sink housed inside the opening; an LED chip mounted on the heat sink; a connecting section for electrically coupling the LED chip and wiring substrate; and a transparent resin covering the LED chip and connecting section. Heat generated from the LED chip is efficiently dissipated, and high productivity is also achievable.

Abstract: A multilayer ceramic substrate having a cavity is formed by the steps of laminating a plurality of ceramic green sheets including ceramic green sheets having through holes corresponding to the cavity to form a multilayer body, pressing the multilayer body and firing the pressed body. At this time, a shrinkage suppression green sheet is laminated on the surface of the a ceramic green sheet constituting the outermost layer of the multilayer body, and a shrinkage suppression green sheet piece is disposed on the ceramic green sheet exposed to the bottom of the cavity in accordance with the shape of the cavity. A burnable sheet is further disposed on the shrinkage suppression green sheet piece. Before the pressing step, an embedded green sheet separate from the ceramic green sheets (portion separated by inserting a cut) is disposed on the shrinkage suppression green sheet piece or the burnable sheet so that it is filled in the cavity. After the firing step, the embedded green sheet fired is removed.

Abstract: A technique for improving a circulator element for its temperature characteristic is provided. A circulator element including a garnet type ferrite material, and a permanent magnet for applying a direct-current magnetic field to the garnet type ferrite material, wherein S11 represents the saturation magnetization of said garnet type ferrite material at a temperature T1, S12 represents one at a temperature T2, and S13 represents one at a temperature T3; and S21 represents the saturation magnetization of said permanent magnet at a temperature T1, S22 represents one at a temperature T2, and S23 represents one at a temperature T3, where T1?T2?T3, and the saturation magnetizations S11, S12, S13, S21, S22 and S23 are relative values providing that the saturation magnetizations at the temperature T2 is 1, and wherein the relations |(S12?S11)/(T2?T1)|<|(S22?S21)/(T2?T1)| and |(S13?S12)/(T3?T2)|>|(S23?S22)/(T3?T2)| are satisfied.

Abstract: A dielectric device includes a dielectric substrate that includes at least one resonator unit. An external conductor film covers most of the outer surface of the dielectric substrate, except one end surface. The at least one resonator unit includes a first hole and a second hole. The first hole is provided in the dielectric substrate, extending from the end surface to an opposite surface, being open at the end surface and the opposite surface, and having a first internal conductor inside thereof. The second hole is provided in the dielectric substrate at a predetermined distance from the first hole, extends from the end surface toward the opposite surface, being open at the end surface, closed at the opposite surface, and having a second internal conductor inside thereof. The second internal conductor is connected to the first internal conductor at the end surface.

Abstract: A shield that can prevent the thickness of a dielectric filter from increasing without increasing the manufacturing cost of the dielectric filter is disclosed. The shield of the present invention is to be attached to a dielectric filter and has a first plate, a second plate elongated from the first end of the first plate in a predetermined direction, a third plate elongated from the second end of the first plate opposite to the first end in the predetermined direction, and a projecting part projecting from the first plate at a portion between the first and second ends of the first plate. Since the shield can be fixed to the dielectric filter by pinching the both side of the dielectric block and the projecting part can be in contact with the metallization of the dielectric filter, the total thickness of the dielectric filter does not increase even the shield is attached.

Abstract: The present invention relates to a dielectric device that is suitable for miniaturization and height reduction and is surface-mountable. In a resonator unit Q1, a first hole 41 is provided to a dielectric substarate 1, extends from a surface 21 toward a surface 22 opposite thereto, opens in the surface 21, and has a first internal conductor 61 in the interior. A second hole 51 is provided to the dielectric substarate 1, opens in a surface 23 adjacent to the surface 21, extends from the surface 23 toward a surface 24 opposite thereto, and is connected with the first hole 41 in the interior of the dielectric substarate 1. The second hole 51 has a second internal conductor 81 in the interior, and the second internal conductor 81 is connected to the first internal conductor 61 in the interior of the dielectric substarate 1.

Abstract: A TEM mode &lgr;/4 dielectric resonator includes a rectangular dielectric block having a top planar surface, a bottom planar surface and four side surfaces, a first metal layer coated on the top planar surface, a second metal layer coated on the bottom planar surface, and a third metal layer coated on one of the four side surfaces.

Abstract: The present invention relates to a dielectric device that is suitable for miniaturization and height reduction and is surface-mountable. In a resonator unit Q1, a first hole 41 is provided to a dielectric substarate 1, extends from a surface 21 toward a surface 22 opposite thereto, opens in the surface 21, and has a first internal conductor 61 in the interior. A second hole 51 is provided to the dielectric substarate 1, opens in a surface 23 adjacent to the surface 21, extends from the surface 23 toward a surface 24 opposite thereto, and is connected with the first hole 41 in the interior of the dielectric substarate 1. The second hole 51 has a second internal conductor 81 in the interior, and the second internal conductor 81 is connected to the first internal conductor 61 in the interior of the dielectric substarate 1.

Abstract: An absorptive circuit element includes a core body made of non-conductive material, an inner conductor formed by winding a conductive wire around the core body with a gap provided between adjacent turns, a magnetic material surrounding outside of the inner conductor, the magnetic material being made of composite material containing ferromagnetic fine metal powder and insulating resin, a dielectric surrounding outside of the magnetic material, and an outer conductor formed on a surface of the dielectric.

Abstract: The invention is directed to a dielectric device that comprises a dielectric substrate and at least one resonator unit. An external conductor film covers most of the outer surface of the dielectric substrate, except one end surface. The resonator unit comprises a first hole and a second hole. The first hole is provided in the dielectric substrate, extending from the end surface to an opposite surface, being open at the end surface and the opposite surface, and having a first internal conductor inside thereof. The second hole is provided in the dielectric substrate at a distance from the first hole, extends from the end surface toward the opposite surface, being open at the end surface, closed at a bottom, and having a second internal conductor inside thereof. The second internal conductor is connected to the first internal conductor at the end surface.

Abstract: The invention provides a heat-resistant, low-dielectric polymeric material that is preferably a copolymer in which a non-polar &agr;-olefin base polymer segment and a vinyl aromatic copolymer segment are chemically combined with each other, and that is a thermoplastic resin showing a multi-phase structure in which a dispersion phase formed by one segment is finely dispersed in a continuous phase formed by another segment. It is thus possible to achieve a polymeric material that is excellent in heat resistance, has high strength, and has a low dielectric constant and a reduced dielectric loss, and so is suitable for an electrical insulating material for high-frequency purposes.

Abstract: A high frequency band pass filter using a high frequency multilayered substrate is provided that does not experience interlayer shift during lamination, requires only a small number of printings, does not shrink during firing, avoids distortion in the shape, thickness and spacing of substrate internal patterns and in the location of the internal pattern of the discrete devices after dicing, is free from burr occurrence, is excellent in dicing efficiency during fabrication, is superior in product yield and cost, and has enhanced performance.

Abstract: A shield that can prevent the thickness of a dielectric filter from increasing without increasing the manufacturing cost of the dielectric filter is disclosed. The shield of the present invention is to be attached to a dielectric filter and has a first plate, a second plate elongated from the first end of the first plate in a predetermined direction, a third plate elongated from the second end of the first plate opposite to the first end in the predetermined direction, and a projecting part projecting from the first plate at a portion between the first and second ends of the first plate. Since the shield can be fixed to the dielectric filter by pinching the both side of the dielectric block and the projecting part can be in contact with the metallization of the dielectric filter, the total thickness of the dielectric filter does not increase even the shield is attached.

Abstract: The invention has for its object to provide a composite dielectric material having any desired dielectric constant selectable from a relatively wide range in a high-frequency band and a low dielectric loss tangent, and a film, substrate, electronic part or molded or otherwise formed article using the same. To accomplish this object, there is provided a composite dielectric material composition comprising a heat-resistant, low-dielectric polymeric material that is a resin composition comprising one or two or more resins having a weight-average absolute molecular weight of at least 1,000, wherein the sum of carbon atoms and hydrogen atoms in said composition is at least 99%, and some or all resin molecules have a chemical bond therebetween, and a filler. A film, substrate, electronic part or molded or otherwise formed article is obtained using this composition.

Abstract: A delay line component having merits of small physical size and small insertion loss in a radio frequency. The delay line component with coaxial cable structure includes a center conductor, a dielectric which surrounds the center conductor and an outer conductor which is formed outside the dielectric. The dielectric is made of a ceramic dielectric with a large dielectric constant.

Abstract: An absorptive circuit element includes a core body made of non-conductive material, an inner conductor formed by winding a conductive wire around the core body with a gap provided between adjacent turns, a magnetic material surrounding outside of the inner conductor, the magnetic material being made of composite material containing ferromagnetic fine metal powder and insulating resin, a dielectric surrounding outside of the magnetic material, and an outer conductor formed on a surface of the dielectric.