Abstract: A high frequency filter includes: a multilayer substrate including a first substrate for which lands are provided, a second substrate for which lands are provided, and a third substrate for which lands are provided, the third substrate being sandwiched between the first substrate and the second substrate; a columnar conductor electrically connected to the lands in the multilayer substrate; and columnar conductors provided to surround the columnar conductor, electrically connected to a ground plane of the first substrate, and electrically connected to a ground plane of the second substrate. The spacing between the lands of the first substrate and the lands of the third substrate and the spacing between the lands of the second substrate and the lands of the third substrate are electrical lengths of 90 degrees or less at the cutoff frequency.

Abstract: Provided are an input matching circuit, at least one amplifying transistor that receives a signal from the input matching circuit, a first dummy transistor that receives a signal from the input matching circuit, a second dummy transistor that receives a signal from the input matching circuit, and an output matching circuit that outputs an output of the amplifying transistor, the amplifying transistor being arranged between the first dummy transistor and the second dummy transistor, the amplifying transistor, the first dummy transistor, and the second dummy transistor being provided in a row along the input matching circuit.

Abstract: A power amplifier includes: plural amplifiers; a tournament-tree-shaped circuit connected with the plural amplifiers and including plural transmission lines arranged in a tournament-tree shape; and plural difference frequency short circuits shunt-connected with plural nodes of the tournament-tree-shaped circuit, wherein each of the plural difference frequency short circuits includes an inductor and a capacitor connected in series, resonant frequencies of the plural difference frequency short circuits become lower as the plural difference frequency short circuits are more separated from the plural amplifiers, and the difference frequency short circuits having equivalent resonant frequencies are connected with plural nodes in the same stage among the plural nodes.

Abstract: Provided are an input matching circuit, at least one amplifying transistor that receives a signal from the input matching circuit, a first dummy transistor that receives a signal from the input matching circuit, a second dummy transistor that receives a signal from the input matching circuit, and an output matching circuit that outputs an output of the amplifying transistor, the amplifying transistor being arranged between the first dummy transistor and the second dummy transistor, the amplifying transistor, the first dummy transistor, and the second dummy transistor being provided in a row along the input matching circuit.

Abstract: A high frequency module improved in heat dissipation performance includes: a dielectric multilayer substrate including a ground layer and a high frequency electronic component mounted thereon while being in contact with the ground layer, the high frequency electronic component including a heat generating portion; and a cutoff block formed of an upstanding wall portion and a cover portion covering the upstanding wall portion, the cutoff block housing the high frequency electronic component and including a hollow portion having a cutoff characteristic at a frequency of a high frequency signal used by the high frequency electronic component, and the upstanding wall portion of the cutoff block being in contact with the ground layer of the dielectric multilayer substrate.

Abstract: A high-frequency antenna module includes: a substrate; an input port to which an RF signal is inputted; a distribution circuit configured to distribute the RF signal inputted to the input port; a plurality of amplification units which each have a plurality of cascade-connected amplifiers configured to amplify the RF signal distributed by the distribution circuit, and which are arranged on a side of the substrate provided with the distribution circuit to be rotationally symmetric about the distribution circuit; a plurality of antennas provided on a side of the substrate opposite to the side provided with the amplification units, and each configured to emit the RF signal amplified by the amplification unit corresponding thereto to a space; and a plurality of RF signal supplying portions each configured to supply the RF signal amplified by the amplification unit to the antenna corresponding thereto.

Abstract: A high frequency module improved in heat dissipation performance includes: a dielectric multilayer substrate including a ground layer and a high frequency electronic component mounted thereon while being in contact with the ground layer, the high frequency electronic component including a heat generating portion; and a cutoff block formed of an upstanding wall portion and a cover portion covering the upstanding wall portion, the cutoff block housing the high frequency electronic component and including a hollow portion having a cutoff characteristic at a frequency of a high frequency signal used by the high frequency electronic component, and the upstanding wall portion of the cutoff block being in contact with the ground layer of the dielectric multilayer substrate.

Abstract: A high-frequency antenna module includes: a substrate; an input port to which an RF signal is inputted; a distribution circuit configured to distribute the RF signal inputted to the input port; a plurality of amplification units which each have a plurality of cascade-connected amplifiers configured to amplify the RF signal distributed by the distribution circuit, and which are arranged on a side of the substrate provided with the distribution circuit to be rotationally symmetric about the distribution circuit; a plurality of antennas provided on a side of the substrate opposite to the side provided with the amplification units, and each configured to emit the RF signal amplified by the amplification unit corresponding thereto to a space; and a plurality of RF signal supplying portions each configured to supply the RF signal amplified by the amplification unit to the antenna corresponding thereto.

Abstract: A high frequency module improved in heat dissipation performance includes: a dielectric multilayer substrate including a ground layer and a high frequency electronic component mounted thereon while being in contact with the ground layer, the high frequency electronic component including a heat generating portion; and a cutoff block formed of an upstanding wall portion and a cover portion covering the upstanding wall portion, the cutoff block housing the high frequency electronic component and including a hollow portion having a cutoff characteristic at a frequency of a high frequency signal used by the high frequency electronic component, and the upstanding wall portion of the cutoff block being in contact with the ground layer of the dielectric multilayer substrate.

Abstract: A high frequency module improved in heat dissipation performance includes: a dielectric multilayer substrate including a ground layer and a high frequency electronic component mounted thereon while being in contact with the ground layer, the high frequency electronic component including a heat generating portion; and a cutoff block formed of an upstanding wall portion and a cover portion covering the upstanding wall portion, the cutoff block housing the high frequency electronic component and including a hollow portion having a cutoff characteristic at a frequency of a high frequency signal used by the high frequency electronic component, and the upstanding wall portion of the cutoff block being in contact with the ground layer of the dielectric multilayer substrate.