Abstract: There is provided with an electronic device including: a main board, a plurality of electronic substrates, a first chain, a measuring unit and a controller, in which the plurality of electronic substrates each are mounted on the main board via solder joints, the first chain connects the solder joints in series throughout all of the electronic substrates, comprising a plurality of second chains each being a part of the first chain and connecting the solder joints in each corresponding one of the electronic substrates, the measuring unit measures an electrical resistance of the first chain and electrical resistances of the second chains, and the controller detects, if the electrical resistance of the first chain is equal to or higher than a first threshold value, the second chain having an electrical resistance equal to or higher than a corresponding second threshold value from among the second chains.

Abstract: According to one embodiment, an electronic device includes a housing, a first heating element, a second heating element, a first sensor, a second sensor, and a calculator. The first heating element is housed in the housing. The second heating element is housed in the housing and a temporal change in amount of heat generation of the second heating element is smaller than a temporal change of the first heating element. The first sensor is housed in the housing and detects a temperature of the second heating element. The second sensor detects an ambient temperature. The calculator calculates a flow rate of airflow in the housing based on a difference between the temperature detected by the first sensor and the temperature detected by the second sensor.

Abstract: According to an embodiment, an image analyzing device includes a first acquirer, a constructor, a first calculator, a second calculator, and a third calculator. The first acquirer is configured to acquire image information on a joint of a subject and bones connected to the joint. The constructor is configured to construct a three-dimensional shape of the bones and the joint, and relation characteristics between a load and deformation in the bones and the joint from the image information. The first calculator is configured to calculate a positional relation between the bones connected to the joint. The second calculator is configured to calculate acting force a muscle acting on the bones connected to the joint based on the positional relation. The third calculator is configured to calculate first stress acting on the joint based on the three-dimensional shape, the relation characteristics, and the acting force.

Abstract: According to one embodiment, in an electronic apparatus, a first pair of electrodes has a first electrode and a second electrode. A second pair of electrodes is disposed in parallel with the first pair, and has a third electrode and a fourth electrode. A third pair of electrodes is disposed between the first pair and the second pair in parallel with the first pair and the second pair, and has a fifth electrode and a sixth electrode. A first wire electrically connects the first electrode and the second electrode. A second wire electrically connects the third electrode and the fourth electrode. A third wire electrically connects the fifth electrode and the sixth electrode. A gel covers the first wire, the second wire, and the third wire. A first detection unit detects a break status of the first wire or the second wire.

Abstract: According to one embodiment, a structuring circuitry temporarily structures a dynamical model of analysis processing based on the time-series medical image. The identification circuitry identifies a latent variable of the dynamical model so that at least one of a prediction value of a blood vessel morphology and a prediction value of a bloodstream based on the temporarily structured dynamical model is in conformity with at least one of an observation value of the blood vessel morphology and an observation value of the bloodstream measured in advance. The analysis circuitry analyzes the dynamical model to which the identified latent variable is allocated.

Abstract: An image processing apparatus according to an embodiment includes a processing circuitry. The processing circuitry is configured to obtain images in a time series including images of a blood vessel of a subject and correlation information indicating a correlational relationship between physical indices of the blood vessel and function indices of the blood vessel related to vascular hemodynamics, calculate blood vessel morphology indices in a time series indicating morphology of the blood vessel of the subject, on a basis of the images in the time series, and identify a function index of the blood vessel of the subject, by using a physical index of the blood vessel of the subject obtained from the blood vessel morphology indices, on a basis of the correlation information.

Abstract: There is provided a medical image processing apparatus which includes a first extraction unit configured to extract coronary arteries depicted in images of a plurality of time phases relating to the heart, and to extract at least one stenosed part depicted in each coronary artery; a calculation unit configured to calculate a pressure gradient of each of the extracted coronary arteries, based on tissue blood flow volumes of the coronary arteries; a second extraction unit configured to extract an ischemic region depicted in the images; and a specifying unit configured to specify a responsible blood vessel of the ischemic region by referring to a dominance map, in which each of the extracted coronary arteries and a dominance territory are associated, for the extracted ischemic region, and to specify a responsible stenosis, based on the pressure gradient corresponding to a stenosed part in the specified responsible blood vessel.

Abstract: A centerline extraction unit extracts at least two coronary artery centerline structures from at least two images respectively corresponding to at least two cardiac phases concerning a heart, an interpolation processing unit interpolates coronary artery centerline structures concerning other cardiac phases from the at least two extracted coronary artery centerline structures to generate coronary artery centerline structures respectively corresponding to a plurality of cardiac phases throughout one heartbeat of the heart, and a displacement distribution calculation unit calculates a plurality of displacement distributions between the respective cardiac phases from a plurality of coronary artery centerline structures throughout the one heartbeat.

Abstract: According to one embodiment, a medical image diagnostic apparatus includes a storage memory, processing circuitry, and a display. The storage memory stores data of a plurality of FFR distribution maps constituting a time series regarding a coronary artery, and data of a plurality of morphological images corresponding to the time series. The processing circuitry converts the plurality of FFR distribution maps into a plurality of corresponding color maps, respectively. The display displays a plurality of superposed images obtained by superposing the plurality of color maps and the plurality of morphological images respectively corresponding in phase to the plurality of color maps. The display restricts display targets for the plurality of color maps based on the plurality of FFR distribution maps or the plurality of morphological images.

Abstract: A time-series morphology index and a time-series shape deformation index of the analysis target region on a time-series medical image are calculated by image processing. A dynamical model of a structural fluid analysis of the analysis target region is temporarily structured, based on the time-series morphology index, the time-series shape deformation index, and the time-series medical image. A latent variable of the identification region is identified so that at least one of a prediction value of a blood vessel morphology index and a blood flow volume index based on the temporarily structured dynamical model match with at least one of an observation value of the blood vessel morphology index and the blood flow volume index measured.

Abstract: According to one embodiment, a first joint unit and a second joint unit are disposed with space on a heat radiation substrate. A joint area of the second joint unit is larger than that of the first joint unit. An insulated substrate is disposed on the first joint unit and the second joint unit. A corner region of the insulated substrate contacts the first joint unit. A first sensor to measure an acceleration of vibration applied to the insulated substrate is disposed thereon. The first sensor is more adjacent to the first joint unit than the second joint unit. A response spectrum of the acceleration is calculated. An extension status of joint failure of the first joint unit is decided by comparing a frequency of a maximum peak of the response spectrum with a reference frequency.

Abstract: According to an embodiment, a semiconductor component includes a circuit board; a semiconductor chip; and a bond part formed by sintering a paste containing metal particles between the circuit board and the semiconductor chip to bond the circuit board and the semiconductor chip. The bond part includes a first area immediately under the semiconductor chip and a second area adjacent to the first area. The second area has a porosity equal to or lower than that of the first area.

Abstract: A life predicting method for a solder joint includes a step of referring to a temperature history of a measurement object having a solder joint, a step of examining at least one physical quantity selected from the group consisting of amplitude, a cycle number, a mean temperature, and a periodic length of a temperature variation with a cycle count method from the temperature history, a step of calculating a strain range by utilizing a previously prepared response surface from the physical quantity examined with the cycle count method, and a step of calculating a strain range increasing rate from a strain range with reference to a previously obtained damage index and a strain variation history of the strain range.

Abstract: According to one embodiment, a semiconductor module comprises a substrate, a first wiring, an electrode pad, a junction, an oscillator, and a detector. The first wiring is disposed on the substrate, and has a characteristic impedance Z0. The electrode pad is connected to the first wiring. The junction is disposed on the electrode pad, and has an impedance Z1. The oscillator is disposed in contact with the first wiring, and oscillates a pulse wave of a voltage toward the junction via the first wiring. The detector is disposed in contact with the first wiring, and detects an output wave of the pulse wave from the junction. The characteristic impedance Z0 and the impedance Z1 satisfy a following relationship (1), ? Z ? ? 0 - Z ? ? 1 Z ? ? 0 ? ? 0.05 .

Abstract: According to one embodiment, a semiconductor module comprises a substrate, a first wiring, an electrode pad, a junction, an oscillator, and a detector. The first wiring is disposed on the substrate, and has a characteristic impedance Z0. The electrode pad is connected to the first wiring. The junction is disposed on the electrode pad, and has an impedance Z1. The oscillator is disposed in contact with the first wiring, and oscillates a pulse wave of a voltage toward the junction via the first wiring. The detector is disposed in contact with the first wiring, and detects an output wave of the pulse wave from the junction. The characteristic impedance Z0 and the impedance Z1 satisfy a following relationship (1), ? Z ? ? 0 - Z ? ? 1 Z ? ? 0 ? ? 0.05 .

Abstract: A medical image diagnostic apparatus according to an embodiment includes an estimation unit, an extraction unit, and a specifying unit. The estimation unit estimates a position of a plaque in a blood vessel based on data of CT images constituting a time series, with the blood vessel being enhanced by a contrast medium. The extraction unit extracts regions constituting the blood vessel from the CT images. The specifying unit specifies stress values respectively corresponding to the regions based on a moving displacement due to cardiac pulsation in each of the regions, and specifies an exfoliation risk of the plaque based on an index indicating hardness of the plaque and the stress value in the region corresponding to the position of the plaque.

Abstract: According to one embodiment, each monitoring device acquires monitoring variables from an observation target, generates an individual multidimensional distribution of the monitoring variables, and transmits the individual multidimensional distribution to a server. The server generates sampling data using the individual multidimensional distribution received from each monitoring device, generates an overall multidimensional distribution of the monitoring variables using the sampling data, determines a statistical model of each index using the overall multidimensional distribution, generates an overall index multidimensional distribution of indexes using the statistical model and the overall multidimensional distribution, and transmits the overall index multidimensional distribution and statistical models to each monitoring device.

Abstract: A medical apparatus includes a power device, a temperature sensor, a conversion processing unit and a prediction time period calculation unit. The temperature sensor detects temperature data. The conversion processing unit refers to temperature data obtained by the temperature sensor in a table in which at least one of temperature data for inside a case covering the power device and temperature data for a wire bonded to the power device is associated with data of actually measured temperatures, and obtains at least one of the temperature data for inside the case and the temperature data for the wire. The prediction time period calculation unit calculates a prediction time period until a failure of the power device based on the obtained temperature data.

Abstract: According to one embodiment, a semiconductor device includes a circuit board, a plurality of semiconductor chips stacked above the circuit board, first and second bumps, third and fourth bumps, and first and second detection units. The first and second bumps are provided in either a gap between the circuit board and the semiconductor chip or a gap between the two semiconductor chips. The third and fourth bumps are provided in any of gaps other than the gap in which the first and second bumps are provided. The first detection unit is electrically connected to the first bump to detect damage of the first bump and to generate a first signal indicating the damage of the first bump. The second detection unit is electrically connected to the third bump to detect damage of the third bump and to generate a second signal indicating the damage of the third bump.

Abstract: A RAID system to transfer data to and from host equipment includes a semiconductor storage unit, a semiconductor-memory selector, and a memory controller. The semiconductor storage unit includes two or more semiconductor memories, a mounting board, and solder joints. The semiconductor memories are mounted on the mounting board. The solder joints are between the semiconductor memories and the mounting board. The semiconductor-memory selector selects a combination of the semiconductor memories to dispersively record the data in the semiconductor storage unit. The memory controller accesses the combination in response to a request of the host equipment. In addition, the selector selects the combination so that mechanical loads received by the semiconductor memories are averaged.