Patents by Inventor Kenji Ikeshima

Kenji Ikeshima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6383254
    Abstract: There are provided a treatment solution for reducing a copper oxide formed on the surface of copper to copper, wherein dimethylamine borane is contained in an amount of 0.3 to 2.0 g/L and the relationship y≧0.232x−0.185 holds between the concentration y (g/L) of dimethylamine borane and an area x (dm2/L) to be treated per unit solution amount, and a treatment method for reducing a copper oxide formed on the surface of a copper material to copper by dipping the copper material in the treatment solution as described above, wherein the addition of dimethylamine borane to water is carried out within 10 minutes before the dipping of the copper material or after the dipping of the copper material.
    Type: Grant
    Filed: July 2, 2001
    Date of Patent: May 7, 2002
    Assignee: Meltex Inc.
    Inventors: Yasuji Fujita, Kenji Ikeshima