Patents by Inventor Kenji Isihara

Kenji Isihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper foil for printed circuits and method of producing same
    Patent number: 5356528
    Abstract: A copper foil for printed circuits having a rust-preventive and heat-discoloration resistant coat, comprising a first layer of zinc or an alloy or a compound or a composition including zinc mainly, and a second layer including a silane coupling agent and phosphorus or a phosphorus compound, said second layer being positioned on the first layer. A method of producing a copper foil for printed circuits comprising the steps of treating the shiny side of a copper foil in a manner of cathode electrolysis in an alkaline solution including zinc ions and chrome ions, or providing the shiny side of a copper foil with a thin plating layer of zinc or a zinc alloy, and thereafter applying onto the treated surface of the copper foil a solution including a silane coupling agent and phosphorus or a phosphorus compound.
    Type: Grant
    Filed: April 1, 1993
    Date of Patent: October 18, 1994
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Katsuhito Fukuda, Masato Takami, Hirokazu Hasegawa, Chiaki Nakajima, Kenji Isihara
  • Copper foil for printed circuits and method of producing same
    Patent number: 5338619
    Abstract: A copper foil for printed circuits having a rust-preventive and heat-discoloration resistant coat, comprising a first layer of zinc or an alloy or a compound or a composition including zinc mainly, and a second layer including a silane coupling agent and phosphorus or a phosphorus compound, said second layer being positioned on the first layer. A method of producing a copper foil for printed circuits comprising the steps of treating the shiny side of a copper foil in a manner of cathode electrolysis in an alkaline solution including zinc ions and chrome ions, or providing the shiny side of a copper foil with a thin plating layer of zinc or a zinc alloy, and thereafter applying onto the treated surface of the copper foil a solution including a silane coupling agent and phosphorus or a phosphorus compound.
    Type: Grant
    Filed: August 4, 1992
    Date of Patent: August 16, 1994
    Assignee: Fukuda Metal Foil and Powder Co., Ltd.
    Inventors: Katsuhito Fukuda, Masato Takami, Hirokazu Hasegawa, Chiaki Nakajima, Kenji Isihara