Abstract: A semiconductor light-emitting device includes a substrate having a first energy bandgap, a first semiconductor layers on the substrate, an active layer on the first semiconductor layer, and a second semiconductor layer on the active layer. The active layer includes a quantum well layer, and a first barrier layer between the first semiconductor layer and the quantum well layer. The first semiconductor layer has a second energy bandgap wider than the first energy bandgap. The quantum well layer has a third energy bandgap narrower than the first and second energy bandgaps. The second semiconductor layer has a fourth energy bandgap wider than the third energy bandgap. The substrate has a refractive index greater than a refractive index of the first semiconductor layer. The refractive index of the first semiconductor layer is not less than a refractive index of the first barrier layer.

Abstract: A semiconductor light-emitting device includes a substrate having a first energy bandgap, a first semiconductor layers on the substrate, an active layer on the first semiconductor layer, and a second semiconductor layer on the active layer. The active layer includes a quantum well layer, and a first barrier layer between the first semiconductor layer and the quantum well layer. The first semiconductor layer has a second energy bandgap wider than the first energy bandgap. The quantum well layer has a third energy bandgap narrower than the first and second energy bandgaps. The second semiconductor layer has a fourth energy bandgap wider than the third energy bandgap. The substrate has a refractive index greater than a refractive index of the first semiconductor layer. The refractive index of the first semiconductor layer is not less than a refractive index of the first barrier layer.

Abstract: According to one embodiment, an optical semiconductor element includes a substrate, a light emitting layer, and a distributed Bragg reflector. The light emitting layer includes an AlGaAs multi quantum well layer. The distributed Bragg reflector is provided between the substrate and the light emitting layer. A pair of a first layer and a second layer is periodically stacked in the distributed Bragg reflector. The first layer includes AlxGa1-xAs. The second layer includes Inz(AlyGa1-y)1-zP. A refractive index n1 of the first layer is higher than a refractive index n2 of the second layer. The first layer has a thickness larger than ?0/(4n1) where ?0 is a center wavelength of a band on wavelength distribution of a reflectivity of the distributed Bragg reflector. The second layer has a thickness smaller than ?0/(4n2).

Abstract: According to one embodiment, an optical semiconductor element includes a substrate, a light emitting layer, and a distributed Bragg reflector. The light emitting layer includes an AlGaAs multi quantum well layer. The distributed Bragg reflector is provided between the substrate and the light emitting layer. A pair of a first layer and a second layer is periodically stacked in the distributed Bragg reflector. The first layer includes AlxGa1-xAs. The second layer includes Inz(AlyGa1-y)1-zP. A refractive index n1 of the first layer is higher than a refractive index n2 of the second layer. The first layer has a thickness larger than ?0/(4n1) where ?0 is a center wavelength of a band on wavelength distribution of a reflectivity of the distributed Bragg reflector. The second layer has a thickness smaller than ?0/(4n2).

Abstract: A method for manufacturing a light emitting device, includes: preparing a first substrate by slicing a single crystal ingot pulled in a pulling direction tilted with respect to a first plane orientation, the slicing being in a direction substantially perpendicular to the pulling direction; preparing a second substrate including a major surface having a plane orientation substantially parallel to a plane orientation of a major surface of the first substrate; growing a stacked unit as a crystal on the major surface of the second substrate, the stacked unit including a light emitting layer; and removing the second substrate after bonding the stacked unit and the major surface of the first substrate by heating them in a joined state.

Abstract: A motor controller, which is inexpensive and has small size, is provided by reducing the size of a heat sink used in the motor controller and the number of all parts of the motor controller, wherein said motor controller includes a heat sink, a power semiconductor modules that is in close contact with the heat sink, a substrate (4) that is electrically connected to the power semiconductor module, and a fan (6) that generates the flow of external air and supplies cooling air to the heat sink, wherein said heat sink is formed by combining two kinds of heat sinks, which include a first heat sink (7) and a second heat sink (8), so as to conduct heat therebetween, and, wherein said power semiconductor module is in close contact with the second heat sink (8).

Abstract: There is provided a motor controller that can easily reduce the size and manufacturing cost of a motor controller by reducing the size of a heat sink without increasing the number of parts much. The motor controller includes a heat sink, a plurality of power semiconductor modules that is in close contact with the heat sink, a substrate (6) that is electrically connected to the plurality of power semiconductor modules, and a fan (8) that generates the flow of external air and supplies cooling air to the heat sink. The heat sink is formed by the combination of two kinds of heat sinks that include a first heat sink (9) and a second heat sink (10), and at least one of the power semiconductor modules is in close contact with each of the first and second heat sinks (9) and (10).

Abstract: A method for manufacturing a light emitting device, includes: preparing a first substrate by slicing a single crystal ingot pulled in a pulling direction tilted with respect to a first plane orientation, the slicing being in a direction substantially perpendicular to the pulling direction; preparing a second substrate including a major surface having a plane orientation substantially parallel to a plane orientation of a major surface of the first substrate; growing a stacked unit as a crystal on the major surface of the second substrate, the stacked unit including a light emitting layer; and removing the second substrate after bonding the stacked unit and the major surface of the first substrate by heating them in a joined state.

Abstract: A motor controller which eliminates a positioning operation between a power semiconductor element and a base plate to improve the assembly process is provided. The motor controller has a power semiconductor element closely contacted with a heatsink and mounted in a first base plate, wherein a spacer having an engaging section formed therein as a hole for the power semiconductor element is interposed between the heatsink and the base plate, and the power semiconductor element is positioned in the spacer. Further, the peripheral wall of the hole is arranged so as to shut off a space between a terminal projecting from the side of the power semiconductor element and the heatsink.

Abstract: There is provided a motor control apparatus in which a size of the apparatus can easily be reduced, a work for aligning a power semiconductor module with a substrate can be eliminated and an assembling property can be enhanced. In a motor control apparatus in which a power semiconductor module adhering to a heat sink is mounted on a first substrate, a spacer is provided between the heat sink and the substrate and the power semiconductor module is disposed in the spacer. Moreover, an edge part of a hole has such a structure as to block a space between a terminal protruded from a side portion of the power semiconductor module and the heat sink.

Abstract: There is provided a motor controller that can easily reduce the size and manufacturing cost of a motor controller by reducing the size of a heat sink without increasing the number of parts much. The motor controller includes a heat sink, a plurality of power semiconductor modules that is in close contact with the heat sink, a substrate (6) that is electrically connected to the plurality of power semiconductor modules, and a fan (8) that generates the flow of external air and supplies cooling air to the heat sink. The heat sink is formed by the combination of two kinds of heat sinks that include a first heat sink (9) and a second heat sink (10), and at least one of the power semiconductor modules is in close contact with each of the first and second heat sinks (9) and (10).

Abstract: A motor controller, which is inexpensive and has small size, is provided by reducing the size of a heat sink used in the motor controller and the number of all parts of the motor controller. The motor controller includes a heat sink, a plurality of power semiconductor modules that is in close contact with the heat sink, a substrate (4) that is electrically connected to the plurality of power semiconductor modules, and a fan (6) that generates the flow of external air and supplies cooling air to the heat sink. The heat sink is formed by combining two kinds of heat sinks, which include a first heat sink (7) and a second heat sink (8), so as to conduct heat therebetween. The power semiconductor modules are in close contact with the second heat sink (8).

Abstract: There is provided a motor control apparatus in which a size of the apparatus can easily be reduced, a work for aligning a power semiconductor module with a substrate can be eliminated and an assembling property can be enhanced. In a motor control apparatus in which a power semiconductor module adhering to a heat sink is mounted on a first substrate, a spacer is provided between the heat sink and the substrate and the power semiconductor module is disposed in the spacer. Moreover, an edge part of a hole has such a structure as to block a space between a terminal protruded from a side portion of the power semiconductor module and the heat sink.

Abstract: There is provided a motor controller which eliminates a positioning operation between a power semiconductor element and a base plate to improve assemblability. A motor controller has a power semiconductor element (3) closely contacted with a heatsink (1) and mounted in a first base plate (4), wherein a spacer (2) having an engaging section (2e) formed therein as a hole for the power semiconductor element (3) is interposed between the heatsink (1) and the base plate (4), and the power semiconductor element (3) is positioned in the spacer (2). Further, the peripheral wall of the hole is arranged so as to shut off a space between a terminal projecting from the side of the power semiconductor element (3) and the heatsink (1).

Abstract: A cooling device for an electric equipment which is excellent in cooling efficiency and low in noise and permits easy mounting of a cooling fan and a fan guard, comprising a heat sink (1) having a U-shaped frame (4) consisting of a flat part (2) and side parts (3) disposed on the opposite sides of the flat part (2), fins (5) formed on the frame (4) and fan guard mounting holes (6) formed in the side parts (3) of the frame (4); a cooling fan (7) having an engaging recess (8) in the side thereof; and a U-shaped fan guard (9) consisting of a fan guard body (10) and side plates (11) disposed on the opposite ends of the fan guard body (10); wherein a lattice body (12) is provided on the fan guard body (10), an air guide (17) at the tip end of each side plate (11), a fan mounting engaging projection (13) on the inner side surface of each side plate for clamping and retaining by engaging the cooling fan (7) and a projection support (15), having an engaging projection (14) for mounting the fan guard (9) to the heat s

Abstract: A light emitting device has an N-type gallium nitride system compound semiconductor layer provided on a substrate; and a P-type gallium nitride system compound semiconductor layer provided on said N-type gallium nitride system compound semiconductor layer. The N-type gallium nitride compound semiconductor layer has such an area that an impurity concentration increases corresponding to a layer thickness from the side of said substrate.