Abstract: A substrate processing method includes: (A) preparing a substrate, on which a high-dielectric film having a higher permittivity than a SiO2 film is formed; (B) supplying, to the substrate, a metal solution containing a second metal element having a higher electronegativity or a lower valence than a first metal element contained in the high-dielectric film; and (C) forming a doping layer, in which the first metal element is substituted with the second metal element, on a surface of the high-dielectric film.

Abstract: The present invention provides a polyoxymethylene resin composition comprising:(A) 100 parts by weight of a polyoxymethylene resin,(B) 0.1 to 2.0 parts by weight of a sterically hindered phenol compound,(C) 0.01 to 5.0 parts by weight of an olefin resin,(D) 0.1 to 2.0 parts by weight of specific polyalkylene glycol,(E) 0.01 to 5.0 parts by weight of a specific amide compound,(F) 0.01 to 2.0 parts by weight of melamine, and(G) 0 to 5.0 parts by weight of a polymer containing formaldehyde-reactive nitrogen.The extrusion molded article obtained from the polyoxymethylene resin composition of the present invention has smaller whitened and void parts internally which, when not so small, are unfavorable with respect to physical properties and appearance of the molded article.